A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

Apparatus at least comprising a first contact partner which has a first metal contact surface being essentially flat, a 3-dimensional injection molded layer serving as second contact partner which has a second metal contact surface, and which comprises a synthetic injection-moldable material, a plurality of deformable microstructures being situated between said first contact partner and said second contact partner, and wherein said deformable microstructures are serving as electric pressure contacts which electrically connect said first metal contact surface and said second metal contact surface after having assembled said first contact partner and said second contact partner,
and wherein said apparatus comprises an electrically isolating bonding agent being situated between said first contact partner and said second contact partner.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

A transmission line includes a first interlayer connection conductor connecting a first signal conductor and a first mounting electrode, a second interlayer connection conductor connecting a second signal conductor and a second mounting electrode, a third and fourth interlayer connection conductors respectively including third and fourth interlayer connection conductors, and each connecting first and second ground conductors between the first and second signal conductors. The third interlayer connection conductor is closer to the first and second interlayer connection conductors than the fourth interlayer connection conductor is, an adjacent distance between two of the fourth interlayer connection conductors is greater than an adjacent distance between two of the third interlayer connection conductors, and the adjacent distance between the two fourth interlayer connection conductors is less than about ½ of a minimum wavelength of signals transmitted by the first signal conductor and the second signal conductor.

An object is to provide a transmission line having an air bridge structure in which grounding conductors of a transmission line are connected by wiring and which is stable in terms of mechanical strength by lowering an electrostatic capacitance in a region where the wirings connecting the central conductor and the grounding conductor intersect with each other. The transmission line includes a substrate, a first central conductor and a second central conductor that are formed on a surface of the substrate, a third central conductor that has a first erection portion and a second erection portion erected on the surface, and a first grounding conductor and a second grounding conductor. The transmission line further includes a third grounding conductor connecting the first grounding conductor and the second grounding conductor. The third central conductor and the third grounding conductor form an air bridge structure.

In accordance with embodiments disclosed herein, there is provided a high-density low-loss cable and connector assembly. A cable assembly includes a first cable connector, a bulk cable section, and a first cable transition section. The bulk cable section includes a first plurality of conductive wires of a first wire thickness. The first cable transition section includes a second plurality of conductive wires that has a first distal end connected to the bulk cable section and a second distal end connected to the first cable connector. Each of the second plurality of conductive wires transitions from the first wire thickness at the first distal end to a second wire thickness that is less than the first wire thickness at the second distal end. Each of the second plurality of conductive wires in the first distal end is connected to a corresponding conductive wire of the first plurality of conductive wires.