The present invention relates to a tunable waveguide resonator and a method of tuning a frequency of the tunable waveguide resonator. The waveguide resonator comprises a waveguide part having a plurality of walls where one of the plurality of walls at least partly comprises a tuning element. The tuning element has a first main surface facing toward a first main surface of an inner wall of one other wall of the plurality of walls. The tuning element is caused to, in response to a change in a temperature of the tuning element be reversibly displaced with respect to a reference plane of the first main surface of the tuning element along an extension perpendicular to the first main surface of the one other inner wall and whereby changing a dimension of a cavity of the tunable wave-guide resonator.

The disclosure provides a filtering module for a cavity filter having a housing defining an enclosed cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of planar resonators arranged within the cavity, one or more of the resonators being rotatable about an axis of rotation so as to vary an electric-field coupling between the resonator and other resonators of the plurality of resonators. The disclosure also provides a cavity filter having an input for receiving a signal to be filtered; a plurality of filtering modules, each filtering module comprising: a cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of resonators arranged within the cavity, at least one of the resonators being movable so as to vary an electromagnetic coupling between the resonator and other resonators of the plurality of resonators; and an output for outputting a filtered signal.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A shell of an electronic device includes a base, two sidewalls, and a plurality of terminals. The base includes upper lateral and lower lateral surfaces opposite to each other. The two sidewalls are disposed at the upper lateral surface and are located separately at two opposite sides of the base. The two sidewalls are opposite to each other, with each sidewall having a surface that faces away from the base. The plurality of terminals is symmetrically arranged in order at the other opposite sides of the base and is embedded in the base. Each terminal includes an upper section and a lower section, with the upper section vertically extending upwards from the upper lateral surface, with the lower section horizontally extending outwards from the lower lateral surface, and with at least a portion of the lower section affixed flatly to the lower lateral surface.

A resonance cavity comprising a first layer of dielectric material having a first dielectric constant and a first thickness, a second layer of dielectric material having a second dielectric constant different from the first dielectric constant and a second thickness, a metal patch arranged between the first and the second layer of dielectric material, and an electromagnetically shielded enclosure having at least one aperture, the electromagnetically shielded enclosure arranged to enclose part of the first and second layers of dielectric material and the metal patch.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A cavity device is disclosed comprising a plurality of flat boards stacked one on lop of the other to form a multilayered structure. At least some of the flat boards comprise at least one opening or perforations having one or more layers of electrically conducting materials configured to establish electrical conduction with one or more layers of electrically conducting materials of another one of the flat boards, to thereby form electrically conducting patterns in the multilayered structure for interacting with electromagnetic radiation introduced into the cavity device.

Filter devices are provided herein. A filter device includes a plurality of low-band resonators and a plurality of high-band resonators. In some embodiments, adjacent ones of the plurality of high-band resonators are spaced farther apart from each other than adjacent ones of the plurality of low-band resonators are spaced apart from each other.

Plasma jet assemblies utilizing evanescent mode cavity resonators, and methods of making the same and using the same, are described.

An apparatus includes a substrate containing a cavity and a dielectric structure covering at least a portion of the cavity. The cavity is hermetically sealed. The apparatus also may include a launch structure formed on the dielectric structure and outside the hermetically sealed cavity. The launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction.