A plane filter includes a dielectric substrate, a filter part provided on the dielectric substrate, and an input/output line connected to the filter part on the dielectric substrate. The filter part and the input/output line are provided on a front surface of the dielectric substrate. The dielectric substrate includes first and second regions. The filter part is provided in the first region, and the input/output line is provided in the second region. The first region having a first thickness in a first direction toward the front surface from a back surface at a side opposite to the front surface. The second region having a second thickness in the first direction, the second thickness being less than the first thickness. The back surface includes a step corresponding to a difference between the first thickness and the second thickness.

A plane filter includes a dielectric substrate, a filter part provided on the dielectric substrate, and an input/output line connected to the filter part on the dielectric substrate. The filter part and the input/output line are provided on a front surface of the dielectric substrate. The dielectric substrate includes first and second regions. The filter part is provided in the first region, and the input/output line is provided in the second region. The first region having a first thickness in a first direction toward the front surface from a back surface at a side opposite to the front surface. The second region having a second thickness in the first direction, the second thickness being less than the first thickness. The back surface includes a step corresponding to a difference between the first thickness and the second thickness.

A signal transmission line includes first and second base materials, and conductive bonding materials. The first base material includes a signal conductor. The second base material includes a ground conductor. The conductive bonding materials bond the first base and second base material to provide a gap. The first base material includes a mounting conductor to which the conductive bonding materials are respectively bonded. The mounting conductor includes a portion extending in parallel or substantially in parallel with the signal conductor on a side of a first side surface, and a portion extending in parallel or substantially in parallel with the signal conductor on a side of a second side surface. A position of a portion of the mounting conductor on the side of the first side surface and a position of a portion of the mounting conductor on the side of the second side surface are different from each other in a signal transmission direction.

A low loss unidirectional conductive sheet using magnetic field biasing and electron spin precession for coupling RF power to ferrite resonators, comprising the step of placing a plurality of ferrite resonators in a bias magnetic field to excite the electron spins of the materials of said ferrite resonators into precession.

To provide a directional coupler in which a coupling characteristic is made even flatter. There are included an input terminal, an output terminal, a coupling terminal, a termination terminal, ground terminals, a main line, a first sub line, and a second sub line. The main line is electromagnetically coupled to sub lines (first sub line, second sub line). A phase conversion unit (low pass filter) is connected between the first sub line and the second sub line. Between a point between the coupling terminal and the termination terminal, and the ground terminals, a resonant circuit is connected in which an inductor, a capacitor, and a resistor are connected in series.

A device includes: a first chip including a qubit; and a second chip bonded to the first chip, the second chip including a substrate including first and second opposing surfaces, the first surface facing the first chip, wherein the second chip includes a single layer of superconductor material on the first surface of the substrate, the single layer of superconductor material including a first circuit element. The second chip further includes a second layer on the second surface of the substrate, the second layer including a second circuit element. The second chip further includes a through connector that extends from the first surface of the substrate to the second surface of the substrate and electrically connects a portion of the single layer of superconducting material to the second circuit element.

Tires including a tire bodies formed of one or more tire plies are disclosed. In some implementations, tire plies may include a temperature sensor that may detect a temperature of a respective tire ply. The temperature sensor may include a ceramic material organized as a matrix and one or more split-ring resonators (SRRs). Each of the SRRs may have a natural resonance frequency configured to shift in response to one or more of a change in an elastomeric property or a change in the temperature of a respective one or more tire plies. The temperature sensor may include an electrically-conductive layer dielectrically separated from a respective one or more SRRs. A thickness each of the SRRs may be approximately between 0.1 micrometers (μm) and 100 μm.

Tires including a tire bodies formed of one or more tire plies are disclosed. In some implementations, tire plies may include a temperature sensor that may detect a temperature of a respective tire ply. The temperature sensor may include a ceramic material organized as a matrix and one or more split-ring resonators (SRRs). Each of the SRRs may have a natural resonance frequency configured to shift in response to one or more of a change in an elastomeric property or a change in the temperature of a respective one or more tire plies. The temperature sensor may include an electrically-conductive layer dielectrically separated from a respective one or more SRRs. A thickness each of the SRRs may be approximately between 0.1 micrometers (μm) and 100 μm.

An object of this invention is to reduce the size of a filter device. Provided is a filter device (1) including: a substrate (11) including a first main surface and a second main surface (111, 112); strip-shaped conductors (12a1 to 12a5) provided to the first main surface (111); and a ground conductor layer (13) provided at least to the second main surface (112), the second main surface (112) having a recessed portion (11ai) provided for each strip-shaped conductor (12ai), the recessed portion (11ai) overlapping the strip-shaped conductor (12ai) in plan view and having a surface covered with the ground conductor layer (13).

A split-ring resonator comprises a first ground terminal which is separated from a ground pattern.