Provided is an electric device including a display panel, and a first antenna disposed on the display panel and including a first patch part, a first transmission part, and a first additional transmission part, wherein the first transmission part faces a first side of the first patch part extending along a first cross direction, is spaced apart from the first patch part, and is capacitively coupled to the first patch part, and wherein the first additional transmission part faces a second side of the patch part extending in a second cross direction crossing the first cross direction, is symmetrical about a line of symmetry with the first transmission part, and is spaced apart from the first patch part.

According to an embodiment, an electronic device comprises: a foldable housing comprising a first housing hingably connected to a second housing, a first side member disposed about a side surface of the first housing and comprising a first plurality of conductive parts, and a second side member disposed about a side surface of the second housing and comprising a second plurality of conductive parts; a communication circuit electrically connected to a first conductive part among the first plurality of conductive parts and configured to transmit and receive a signal in a selected or specified frequency band; a first sensor integrated circuit (IC) electrically connected to at least one of the first plurality of conductive parts and configured to measure capacitance; a second sensor IC electrically connected to at least one of the second plurality of conductive parts and configured to measure capacitance; a first switching circuit electrically connected to the first conductive part and a second conductive part among the first plurality of conductive parts; and a processor and a memory, wherein the memory stores instructions that, when executed, cause the processor to perform a plurality of operations, the plurality of operations comprising: controlling the first switching circuit wherein the first conductive part and the second conductive part are electrically connected, based on at least one of the capacitance measured by the first sensor IC and the capacitance measured by the second sensor IC when the foldable housing is in a folded state.

An antenna package according to an embodiment includes antenna units, and a circuit board electrically connected to the antenna units. The circuit board includes a core layer, antenna feeding lines distributed on a surface of the core layer and connected to the antenna units, power/data lines distributed on the surface of the core layer, power/data ports connected to end portions of the power/data lines, and antenna feeding ports connected to end portions of the antenna feeding lines and arranged to be closer to the antenna units than the power/data ports.

Disclosed is an electronic device including an antenna module comprising a first array antenna disposed on a first surface, a radio frequency integrated circuit (RFIC) disposed on a second surface which is parallel to the first surface, and a connector, a wireless communication circuit electrically connected with the antenna module through the connector, and a flexible printed circuit board (FPCB) electrically connected with the antenna module through the connector, the FPCB comprising a second array antenna, wherein the wireless communication circuit is configured to transmit and receive a first signal via the first array antenna, and to transmit and receive a second signal which is distinct from the first signal via the second array antenna

An antenna design solution is provided. A metal frame and a PCB ground layer of an electronic device are used to form a slot. Through symmetric feeding and anti-symmetric feeding, the slot can be excited to generate two slot antenna patterns: a CM slot antenna pattern and a DM slot antenna pattern. In addition, the two slot antenna patterns share a same slot antenna radiator.

An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

An electronic device includes: a side member forming sides of the electronic device, the side member including a first conductive portion, a second conductive portion, a first non-conductive portion, and a slit; a printed circuit board including the ground; and a wireless communication circuit, wherein the first conductive portion includes a first electrical path and a second electrical path, the second conductive portion includes a third electrical path and a fourth electrical path, a capacitor is arranged along the third electrical path, and the wireless communication circuit may feed, to the first conductive portion via the first electrical path, an RF signal of a first frequency band and may feed, to the second conductive portion via the third electrical path, an RF signal of a second frequency band which at least partially overlaps the first frequency band.

An antenna laminate according to an embodiment may include a display panel which includes an electrode structure, a dielectric layer disposed on the display panel, an antenna conductive layer disposed on the dielectric layer, and a lower ground layer disposed on a lower side of the display panel and having a lower resistance than the display panel.

An antenna includes a first radiating layer including a first radiation patch, a slit formed in the first radiation patch, and a first feed point provided in the first radiation patch, a second radiating layer including a second radiation patch provided below the first radiation patch and a second feed point provided in the second radiation patch, a feeding layer including a coupling patch provided below the second radiation patch and at least one ground point provided in the coupling patch, a ground layer provided below the coupling patch, a feed line provided between the second radiation patch and the ground layer and including a third feed point, a signal via connecting the first feed point, the second feed point, and the third feed point, and a ground via connecting the at least one ground point and the ground layer.

An example electronic device may include: a side member including a first conductive portion disposed through a first non-conductive portion and a second non-conductive portion and a second conductive portion disposed through the second non-conductive portion and a third non-conductive portion; a substrate disposed in the internal space of the housing and including a ground; at least one wireless communication circuit disposed on the substrate; a first switching circuit disposed in a first electrical path connecting the wireless communication circuit and a first point of the first conductive portion; a second switching circuit disposed in a second electrical path connecting the wireless communication circuit and a second point of the second conductive portion; a third switching circuit disposed in a third electrical path connecting the wireless communication circuit and a third point of the second conductive portion between the second point and the third non-conductive portion; and at least one processor configured to control at least one switching circuit among the first, second, and third switching circuits, wherein the second switching circuit is electrically connected to another—first point between the first point and the second non-conductive portion through another—first electrical path.