Parabolic reflector antennas advantageously support low side lobe radiation patterns for ETSI class 4 performance, by utilizing: (i) metal choke plates adjacent a distal end of a dielectric cone within a sub-reflector assembly, (ii) “lossy” material feed boom waveguide sleeves and/or (iii) extended length cylindrical shields lined with radiation absorbing materials. Relatively shallow and large diameter parabolic reflectors having an F/D ratio of greater than about 0.25 may be provided with one or more of the identified (i)-(iii) enhancements.

Parabolic reflector antennas advantageously support low side lobe radiation patterns for ETSI class 4 performance, by utilizing: (i) metal choke plates adjacent a distal end of a dielectric cone within a sub-reflector assembly, (ii) “lossy” material feed boom waveguide sleeves and/or (iii) extended length cylindrical shields lined with radiation absorbing materials. Relatively shallow and large diameter parabolic reflectors having an F/D ratio of greater than about 0.25 may be provided with one or more of the identified (i)-(iii) enhancements.

In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. An semiconductor component is coupled to a bottom side of the substrate and is coupled to the transceiver pattern. Other examples and related methods are also disclosed herein.

An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.

An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.

An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.

A small cell includes a housing and an antenna support bracket mountable within the housing. The bracket includes a base member and a flange member. The base member supports a substrate of an antenna. The flange member is positioned along a first edge of the base member and extends away from the base member in a first direction. The flange member includes at least one generally hook-shaped arm member configured to engage a hook receiving element integrated with or attached to a sidewall of the small cell housing. The antenna support bracket may further include a second flange member positioned along a second edge of the base member and extending in a second direction opposite to the first direction. A non-conductive spacer may be adhered to a surface of the second flange member to provide electrical isolation between an electrically conductive fastener and the surface of the second flange member.

A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

An efficient, low-profile, lightweight fixed-beam (constant angle of departure) aperture antenna. The aperture antenna includes an array of horn radiators coupled to a waveguide diplexer by means of a stripline distribution network. The stripline distribution network is embedded in a printed wiring board (PWB), which PWB is sandwiched between a radiator plate (incorporating the horn radiators) and a diplexer plate. The aperture antenna may further include a backside ground plane made of metal. The diplexer plate and backside cover plate are configured to form the waveguide diplexer. Each horn radiator has a respective circular opening at one end adjacent to the PWB. The diplexer plate includes an array of circular waveguide backshorts which are congruent and respectively aligned with the circular openings of the horn radiators. The radiator plate further includes a rectangular waveguide backshort which is congruent and aligned with a rectangular port of the diplexer plate.

An efficient, low-profile, lightweight fixed-beam (constant angle of departure) aperture antenna. The aperture antenna includes an array of horn radiators coupled to a waveguide diplexer by means of a stripline distribution network. The stripline distribution network is embedded in a printed wiring board (PWB), which PWB is sandwiched between a radiator plate (incorporating the horn radiators) and a diplexer plate. The aperture antenna may further include a backside ground plane made of metal. The diplexer plate and backside cover plate are configured to form the waveguide diplexer. Each horn radiator has a respective circular opening at one end adjacent to the PWB. The diplexer plate includes an array of circular waveguide backshorts which are congruent and respectively aligned with the circular openings of the horn radiators. The radiator plate further includes a rectangular waveguide backshort which is congruent and aligned with a rectangular port of the diplexer plate.