A low-profile array and a low-profile radiating element including: a stripline feed layer; a High Order Floquet (HOFS) part layer; and a radome layer in direct contact with the HOFS part layer, where the HOFS part layer is disposed between the stripline feed layer and the radome layer, and the radome layer includes a high dielectric constant (dk) environmentally robust material.

The present disclosure relates to a communication method and system for converging a 5.sup.th-Generation (5G) communication system for supporting higher data rates beyond a 4.sup.th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to an embodiment o, an antenna device in a wireless communication system includes: an antenna module; and a radome covering at least a part of the antenna module, wherein the antenna module includes a first radiator disposed on one surface of the radome and at least one second radiator spaced apart from the first radiator by a specified distance on the one surface to form a loop of the first radiator, wherein the at least one second radiator includes a plurality of gaps opening each of the loops.

Provided is an antenna system mounted on a vehicle according to the present invention. The antenna system comprises: a first printed circuit board (PCB) having a metal pattern and a dielectric region; a second PCB on which a plurality of antennas are disposed; and a slot antenna configured to radiate a signal through a slot region formed adjacent to a junction portion of the first PCB and the second PCB.

An antenna structure according to an embodiment of the present disclosure includes an antenna unit array including a plurality of antenna units, and a parasitic element disposed to be adjacent to the antenna units and to be electrically and physically separated from the antenna units. Each of the antenna units includes a radiator, and a transmission line including a first transmission line and a second transmission line connected to the radiator in different directions. The parasitic element includes a first parasitic element disposed between the first transmission line and the second transmission line included in the same antenna unit, and a second parasitic element disposed between the first transmission line and the second transmission line included in different neighboring antenna units. The second parasitic element includes a branched portion including a first branched portion and a second branched portion bent in different directions.

An antenna structure according to an embodiment of the present disclosure includes a dielectric layer, and a plurality of antenna units arranged on a top surface of the dielectric layer. Each of the plurality of antenna units includes a radiator, a transmission line including a first transmission line and a second transmission line that extend in different directions to be connected to the radiator, an upper parasitic element adjacent to an upper portion of the radiator, and a lower parasitic element adjacent to a lower portion of the radiator and the transmission line. Feeding signals of different phases are applied to the first transmission line and the second transmission line.

A patch antenna device configured to receive a radio communication signal includes a circuit board, a patch antenna, and a parasitic element. The circuit board has a signal processing circuit placed thereon. The patch antenna is stacked on the circuit board and has a quadrangular radiation element. The parasitic element is disposed above the patch antenna so as to improve antenna gain characteristics of the patch antenna and configured such that the length of the upper side of the parasitic element is shorter than the width in a plan view of the radiation element of the patch antenna and that the length between the upper and lower sides of the parasitic element is longer than the length between the upper and lower sides of the radiation element of the patch antenna.

Provided is a 5G dual port beamforming antenna. The beamforming antenna according to an embodiment of the present disclosure includes a plurality of patch antennas, and the patch antenna includes: a first patch positioned on an upper portion; a second patch positioned on a left side under the first patch and having a plurality of feeding ports formed thereon; a third patch positioned on an upper portion of a right side of the second patch; and a fourth patch positioned on a lower portion of the right side of the second patch. Accordingly, 3D wide angle beamforming is possible in an antenna to be used in 5G mobile communication systems, military radar systems, etc.

An antenna device includes a ground plane, a first feed via and a second feed via for penetrating the ground plane through a first hole and a second hole of the ground plane, a first feed pattern connected to the first feed via, a first antenna pattern configured to be coupled to the first feed pattern and transmit/receive an RF signal of a first frequency bandwidth, a second antenna pattern connected to the second feed via and configured to transmit/receive an RF signal of a second frequency bandwidth, and a third antenna pattern disposed between the first antenna pattern and the second antenna pattern, and overlapping the first antenna pattern and the second antenna pattern.

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.