A first edge of a ground plane extends in a first direction. A radiating element is arranged with a gap from the ground plane in a thickness direction of the ground plane. A feed line supplies a radio frequency signal to the radiating element. A pair of stubs are arranged at positions sandwiching the radiating element in the first direction. The stub is connected to the ground plane. In plan view, a distance from the radiating element to the first edge in a second direction orthogonal to the first direction is ¼ or less of a wavelength corresponding to a resonant frequency of the radiating element. Even when the radiating element is arranged close to an edge of the ground plane, disorder of a beam pattern may be reduced.

A chip packaging structure includes a miniature antenna, an radio frequency identification chip, and a packaging member, wherein the radio frequency identification chip is electrically connected to the miniature antenna, and the packaging member is adapted to encapsulate the miniature antenna and the radio frequency identification chip, and has a top surface, a bottom surface, and a plurality of side surfaces, wherein the top surface, the bottom surface, and the side surfaces substantially form a hexahedron.

This antenna device comprises an antenna element disposed in a recess 2 on the exterior of a moving body, and a non-feeding element of which the center is disposed at a position higher than the horizontal plane in which the center of the antenna element is positioned in the recess. In the antenna device, furthermore, the moving body is a vehicle, and the recess may be provided in a roof 1 of the vehicle.

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

An RFID tag 300 with a boost antenna includes a boost antenna 100 and an RFID tag 200, wherein the boost antenna 100 includes: a radiation unit 10 which is conductive; a ground unit 30 which faces the radiation unit 10 and is conductive; and a short circuit unit 20 which connects one end of the radiation unit 10 and one end of the ground unit 30, and electrically connecting the radiation unit 10 and the ground unit 30 with each other, and wherein the RFID tag 200 is arranged at a position close to the short circuit unit 20 on the ground unit 30, wherein each of the boost antenna 100 and the RFID tag 200 has resonance characteristics.

An electronic device according to a certain embodiments comprises: a housing including a front plate, a rear plate, and a side member surrounding a space between the front plate and the rear plate; an antenna module disposed in the space, and configured to transmit and receive first signals belonging to a first frequency band using at least one antenna element; a nonconductive member disposed to face at least one surface of the antenna module; and a conductive pattern being closer to the rear plate than to the at front plate and disposed between the nonconductive member and the rear plate, wherein the conductive pattern is configured to: change a radiation direction of at least a portion of the first signal and transmit and receive a second signal belonging to a second frequency band.

A multiple input, multiple output (“MIMO”) antenna system is provided for operation on a radio frequency (“RF”) module that may be used in a wireless access device. The MIMO antenna system includes a plurality of multi-band antenna elements connected to a radio in a MIMO configuration. The multi-band antenna elements and the radio are configured to operate on an RF module. A reflector is formed on the RF module to contain the plurality of multi-band antenna elements and a common director is positioned in front of the multi-band antenna elements to concentrate signal communication in a sector. The plurality of multi-band antenna elements are oriented to provide a sector coverage pattern formed by beam patterns generated by each of the multi-band antenna elements.

A multiple input, multiple output (“MIMO”) antenna system is provided for operation on a radio frequency (“RF”) module that may be used in a wireless access device. The MIMO antenna system includes a plurality of multi-band antenna elements connected to a radio in a MIMO configuration. The multi-band antenna elements and the radio are configured to operate on an RF module. A reflector is formed on the RF module to contain the plurality of multi-band antenna elements and a common director is positioned in front of the multi-band antenna elements to concentrate signal communication in a sector. The plurality of multi-band antenna elements are oriented to provide a sector coverage pattern formed by beam patterns generated by each of the multi-band antenna elements.

This document describes a waveguide with radiation slots and parasitic elements for asymmetrical coverage. An apparatus may include a waveguide for providing asymmetrical coverage in an azimuth plane. The waveguide includes a hollow channel containing a dielectric and an array of radiation slots through a surface that is operably connected with the dielectric. The waveguide includes an array of parasitic elements positioned on or in the surface and offset from a longitudinal side of the array of radiation slots. The radiation slots and parasitic elements configure the described waveguide to focus an antenna radiation pattern that provides an asymmetrical coverage to focus on a particular portion within the antenna field-of-view.