An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

An antenna package according to an embodiment includes an antenna unit including a radiator, a transmission line extending from the radiator and an antenna ground pad disposed around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes a core layer, a circuit wiring layer disposed on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad, and a ground layer disposed on an opposite surface facing the one surface of the core layer. The ground layer does not overlap a portion of the antenna ground pad except for a region bonded to the first ground pattern in a planar view.

An apparatus can include a substrate, a first antenna panel, a second antenna panel and a wall isolator. The first antenna panel can be coupled on the substrate and comprising an array of first antenna elements. The second antenna panel can be coupled on the substrate comprising an array of second antenna elements. The wall isolator can be coupled on the substrate. The wall isolator can include a first EBG element and a second EBG element. The first EBG element can be positioned along an edge of the first antenna panel for a length of the substrate and configured to reduce surface wave propagation from the array of first antenna elements. The second EBG element can be positioned along an edge of the second antenna panel for a length of the substrate and configured to reduce surface wave propagation from the array of second antenna elements.

A multi-feed antenna with a shared radiator comprises a ground capacitor, a first antenna module, a second antenna module, a first feed-in module, a second feed-in module and at least one sensing module. The first antenna module is grounded through the ground capacitor. The second antenna module is coupled with the first antenna module. The first feed-in module and the second feed-in module are connected with the second antenna module, and the first feed-in module and the second feed-in module are used to receive or send radio frequency signals through the first antenna module and the second antenna module. The at least one sensing module is connected with the first antenna module or the second antenna module, and the at least one sensing module is used to sense a capacitance value of a parasitic capacitance of the first antenna module or the second antenna module.

An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.

An antenna includes a reflector and a waveguide assembly. The waveguide assembly includes a feed assembly and a support member that extends from behind the reflector to orient the feed assembly for direct illumination of the reflector. The waveguide assembly includes a first waveguide coupled to a first portion of a common waveguide, a second waveguide coupled to a second portion of the common waveguide, and a septum layer that includes a septum polarizer coupled between the common waveguide and the first and second waveguides.

An antenna includes a reflector and a waveguide assembly. The waveguide assembly includes a feed assembly and a support member that extends from behind the reflector to orient the feed assembly for direct illumination of the reflector. The waveguide assembly includes a first waveguide coupled to a first portion of a common waveguide, a second waveguide coupled to a second portion of the common waveguide, and a septum layer that includes a septum polarizer coupled between the common waveguide and the first and second waveguides.

An antenna assembly and a mobile terminal include a first grounding part and a second grounding part and a slot, the first grounding part and the second grounding part are separated by the slot; at least a part of a first feed line is located in the slot or is located in a directly opposite position of the slot, the first feed line is configured to feed the first grounding part and electrically connected to the first grounding part; at least a part of a second feed line is located in the slot or is located in a directly opposite position of the slot, the second feed line is configured to feed one of the first grounding part and the second grounding part, and electrically connected to the other of the first grounding part and the second grounding part.

A film antenna-circuit connection structure according to an embodiment of the present invention includes a film antenna including radiation patterns and pads, and a circuit board electrically connected to the film antenna. The film antenna includes connection wirings each of which is electrically connected to each of the pads of the film antenna, and a dummy barrier interposed between neighboring connection wirings of the connection wirings.

A film antenna-circuit connection structure according to an embodiment of the present invention includes a film antenna including radiation patterns and pads, and a circuit board electrically connected to the film antenna. The film antenna includes connection wirings each of which is electrically connected to each of the pads of the film antenna, and a dummy barrier interposed between neighboring connection wirings of the connection wirings.