An example electronic device may include: a side member including a first conductive portion disposed through a first non-conductive portion and a second non-conductive portion and a second conductive portion disposed through the second non-conductive portion and a third non-conductive portion; a substrate disposed in the internal space of the housing and including a ground; at least one wireless communication circuit disposed on the substrate; a first switching circuit disposed in a first electrical path connecting the wireless communication circuit and a first point of the first conductive portion; a second switching circuit disposed in a second electrical path connecting the wireless communication circuit and a second point of the second conductive portion; a third switching circuit disposed in a third electrical path connecting the wireless communication circuit and a third point of the second conductive portion between the second point and the third non-conductive portion; and at least one processor configured to control at least one switching circuit among the first, second, and third switching circuits, wherein the second switching circuit is electrically connected to another—first point between the first point and the second non-conductive portion through another—first electrical path.

An example electronic device may include: a side member including a first conductive portion disposed through a first non-conductive portion and a second non-conductive portion and a second conductive portion disposed through the second non-conductive portion and a third non-conductive portion; a substrate disposed in the internal space of the housing and including a ground; at least one wireless communication circuit disposed on the substrate; a first switching circuit disposed in a first electrical path connecting the wireless communication circuit and a first point of the first conductive portion; a second switching circuit disposed in a second electrical path connecting the wireless communication circuit and a second point of the second conductive portion; a third switching circuit disposed in a third electrical path connecting the wireless communication circuit and a third point of the second conductive portion between the second point and the third non-conductive portion; and at least one processor configured to control at least one switching circuit among the first, second, and third switching circuits, wherein the second switching circuit is electrically connected to another—first point between the first point and the second non-conductive portion through another—first electrical path.

Disclosed is a radiator assembly configured to operate in the range of 3.4-4.2 GHz. The radiator assembly comprises a folded dipole with four dipole arms that radiate in two orthogonal polarization planes, whereby the signal of each polarization orientation is radiated by two opposite radiator arms that radiate the signal 180 degrees out of phase from each other. The radiator assembly has a balun structure that includes a balun trace that conductively couples to a ground element on the same side of the balun stem plate. The combination of the shape of the folded dipole and the balun structure reduces cross polarization between the two polarization states and maintains strong phase control between the opposing radiator arms.

An antenna structure includes a first radiator, a second radiator, an antenna ground, and a conductor. The first radiator for resonating at a high frequency band includes a feeding end. The second radiator is connected to the first radiator and resonates at a low frequency band with a part of the first radiator. The antenna ground is located on one side of the first radiator and the second radiator. The conductor is located between the second radiator and the antenna ground in a first direction and connected to the first radiator and the antenna ground. A slit having at least one bending portion is formed among the second radiator, and the conductor and the antenna ground. An electronic device is further provided.

An antenna structure includes a first radiator, a second radiator, an antenna ground, and a conductor. The first radiator for resonating at a high frequency band includes a feeding end. The second radiator is connected to the first radiator and resonates at a low frequency band with a part of the first radiator. The antenna ground is located on one side of the first radiator and the second radiator. The conductor is located between the second radiator and the antenna ground in a first direction and connected to the first radiator and the antenna ground. A slit having at least one bending portion is formed among the second radiator, and the conductor and the antenna ground. An electronic device is further provided.

A dipole antenna includes an elongate substrate and a first, second, and third conductive pieces on the substrate, the first conductive piece having a main part, a straight part, and a bent part, a free end of the straight part defining a feeding point, the second conductive piece having a bent portion, two U-shaped portions, and a ground portion, wherein the main part of the first conductive piece includes a connecting portion connected to the straight part, a meander portion connected at one end thereof to the connecting portion, and an end portion connected to an opposite end of the meander portion, and the straight part of the first conductive piece is disposed between the two U-shaped portions of the second conductive piece.

Provided is an electronic device including a multi-input multi-output antenna structure configured on a substrate, and the multi-input multi-output antenna structure includes two dipole antennas and two second grounded radiators. Each dipole antenna is used for resonating a first frequency band and a second frequency band. Each dipole antenna includes a feed-in radiator and a first grounded radiator. The feed-in radiator has a feed-in end. The first grounded radiator is disposed beside the feed-in radiator and has a first grounded end. The two second grounded radiators are positioned between the two dipole antennas, the two second grounded radiators are separated from the two first grounded radiators and are respectively corresponding to the two first grounded radiators, and a bent gap is formed between the two second grounded radiators.

An antenna structure includes a ground metal element, a first metal element, and a second metal element. The ground metal element has a slot. A feeding point is positioned at the first metal element. The first metal element and the second metal element are coupled to the ground metal element. The first metal element and the second metal element extend into the interior of the slot. The slot includes a first branch portion, a second branch portion, a third branch portion, and a fourth branch portion. The first metal element is disposed between the second branch portion and the third branch portion of the slot. The second metal element is disposed between the third branch portion and the fourth branch portion of the slot.

An antenna structure includes a ground metal element, a first metal element, and a second metal element. The ground metal element has a slot. A feeding point is positioned at the first metal element. The first metal element and the second metal element are coupled to the ground metal element. The first metal element and the second metal element extend into the interior of the slot. The slot includes a first branch portion, a second branch portion, a third branch portion, and a fourth branch portion. The first metal element is disposed between the second branch portion and the third branch portion of the slot. The second metal element is disposed between the third branch portion and the fourth branch portion of the slot.

Metallic, electrically conductive, structures on smart glasses, which can be utilized to provide structural integrity and/or thermal dissipation capability, can be leveraged to provide antenna capability as well. Metallic structures on smart glasses are utilized as antenna grounds, with corresponding antenna elements being electrically coupled thereto, and located on the glasses temple. Such antenna elements implement folded antennas having an antenna length selected in accordance with desired communicational frequencies. A shorting pin establishes the electrical connection to the antenna ground. Metallic structures on smart glasses are also utilized as antenna elements, with different metallic structures acting as the antenna ground. Such antenna elements implement monopole antennas having a length selected in accordance with desired communicational frequencies, and a width that can maintain structural integrity and/or thermal dissipation capability. Multiple antenna elements are manufactured onto a single glasses temple, and both temples of the smart glasses comprise antennas.