The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.

Systems for interfacing a printed circuit board assembly (PCBA) adapter module to a receiver housing are provided. The receiver housing may have a first interface mounted on the receiver housing via a first mount and the PCBA adapter module may have a second interface mounted on the adapter module via a second mount. One of the interfaces has a protruding feature that aligns the interfaces when matingly engaged, while the other interface has a centering hole opposite the protruding feature. The first centering hole is enlarged with respect to an axis of an insertion-angle plane such that the protruding feature substantially clears the centering hole without causing either interface to exceed a limit of free-play between that interface and its respective mount.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

An electrical connector that connects circuit boards in a coplanar manner. The electrical connector includes a frame comprising a plate, and two platforms extending above the plate and substantially parallel to each other. A housing of the electrical connector holding conductive elements is coupled to the plate of the frame such that a top surface of the housing is substantially flush with top surfaces of the two platforms. The platforms of the frame have threaded holes extending therethrough such that screws can be inserted to hold one of the two platforms of the electrical connector to a first circuit board and the other one of the two platforms of the electrical connector to a second circuit board that is substantially edge aligned to the first circuit board. Such a configuration enables connecting circuit boards of various thicknesses in a coplanar manner.

A circuit board arrangement (100) for a motor controller in a motor housing (50) has at least one first populated circuit board (LP1) and one second populated circuit board (LP2). Contact elements (20) are plugged together in the plug-in direction (S) in order to produce a detachable electrical connection with the first circuit board (LP1). An alignment and guidance device (LP3) protrudes from the first circuit board (LP1) in the plug-in direction (S) toward the second circuit board (LP2). In the assembled state, the contact elements (20) are completely in the plugged-in state with mating contacts (10) of the first circuit board (LP1). An end-side portion (30), of the device (LP3), protrudes through a gap (21) in the second circuit board. The contact elements (20) protrude from or out of the second circuit board (20) in different lengths.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

An electrical contact, a 3D LED and a method of manufacturing 3D LEDs are described. The electrical contact includes a printed circuit board (PCB) bridge and a PCB connector. The PCB bridge comprises at least one electrical contact. The at least one electrical contact is configured for electrical coupling with at least one interposer of a string of LEDs. The PCB connector is electrically coupled to the PCB bridge. The PCB connector comprises an electrical contact configured for electrical coupling with at least one external electrical wire.

A connector is provided for electronically connecting a first printed circuit board to a second printed circuit board and a third printed circuit board. The connector is configured to form an assembly of an electronic control unit for an electric power steering system. The printed circuit boards are electronically connected with each other by the connector. The connector has a body comprising a base portion and a step portion (20). An assembly of the electronic control unit for the electric power steering system comprising the connector is also provided, along with an electronic control unit itself for the electric power steering system.

A socketless land grid array (LGA) is provided that uses an adhesive material rather than a socket to secure the optical communications module to the LGA and to provide the clamping force that is needed to maintain contact between the module and the LGA and to maintain a flat profile for the module and the LGA. Eliminating the LGA socket eliminates the need to drill holes in the host circuit board and the need for additional hardware (e.g., backing plates, screws, etc.) to secure a socket to the host circuit board. This allows the area of the host circuit board underneath the array of electrical contacts of the LGA to be used for routing electrically-conductive pathways of the host circuit board (e.g., vias and traces) and reduces the amount of time and effort that are needed to secure modules to the respective LGAs.

The present invention relates to a power module and a method for manufacturing same, the power module comprising: a ceramic substrate including a ceramic base and an electrode pattern formed on the upper and lower surfaces of the ceramic base; a PCB substrate disposed above the ceramic substrate and including an electrode pattern; a plurality of through-holes formed in at least one of the ceramic substrate and the PCB substrate; and a connection pin coupled to the through-holes and connecting the electrode pattern of the ceramic substrate and the electrode pattern of the PCB substrate to each other. The present invention has advantages in that it is easy to fix the connection pin to the ceramic substrate, the position accuracy of the connection pin is improved, and the convenience of assembly is increased.