A vehicular window assembly includes a window panel having an inner surface and an outer surface, electrically conductive traces established at the inner surface of the window panel, a pair of busbars established at the inner surface and in electrical connection with respective portions of the electrically conductive traces, and an electrical connector affixed at each busbar and configured to electrically connect to a wire harness of a vehicle when the vehicular window assembly is installed at the vehicle. The electrical connector includes a bonding portion, a connecting terminal and a busbar-connecting portion. The connecting terminal is configured to electrically connect to the wire harness of the vehicle. The bonding portion is adhesively bonded at the window panel. The electrical connector is bonded at the window panel with the busbar-connecting portion electrically connected to the respective busbar without use of solder.

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

An apparatus and method to reliably attach an electronic module to a textile. The overall mechanical assembly of the invention includes: (a) light pipe, (b) top enclosure, (b) magnet, (c) main electronics which contains (d) the main PCB, (e) battery and (f) other electronic components, (g) bottom enclosure, which holds (h) the connector PCB, (i) module dock, (j) top textile PCB which are located above the (j) textile band and under the (k) textile pocket and the (I) bottom textile PCB and (m) fabric and laminate padding, which are located below the textile band. The invention is physically embodied by an electronic module, comprising at least one printed circuit board (PCB), comprising at least one conductive circuit and at least one electronic component; a metallic rivet, grommet or eyelet to mechanically and electrically connect the; and a textile substrate with at least one electrically conductive circuit.

A semiconductor device assembly that includes a flexible member having a first portion connected to a substrate and a connector attached to a second portion of the flexible member. The connector is electrically connected to the substrate via a conducting layer within the flexible member. The substrate may be a semiconductor device, such as a chip. The connector may be configured to connect the semiconductor device to another semiconductor device assembly or a system board, such as a printed circuit board. A material may encapsulate at least a portion of the substrate of the semiconductor assembly. The semiconductor device assembly may be formed by selectively connecting the flexible member to a first substrate. A second substrate and connector may then be connected to the flexible member. A release layer may be used to release the assembly of the second substrate, flexible member, and connector from the first substrate.

A connector includes: a terminal, and a housing holding the terminal, the connector being mounted on a substrate with a liquid potting agent applied thereto, wherein: the housing includes a mating recess mating with a counterpart connector, along with a bottom plate part in which a terminal press-in hole with the terminal pressed therein is formed, the terminal includes a contact part contacting a counterpart terminal of the counterpart connector in the mating recess, a substrate connection part which is exposed below the bottom plate part so as to be connected to the substrate, and a holding part housed and held in the terminal press-in hole, and this holding part includes a terminal side first seal part and a terminal side second seal part which respectively configure a first seal part and a second seal part by adhering to the side faces of the terminal press-in hole.

An electric connection member comprises a conductive member, a fixing member which brings the conductive member into contact with a connection target member and holds the conductive member in a state of compression in a thickness direction Z. The conductive member has a compressive stress of 1.0 N/mm.sup.2 or more and 15.0 N/mm.sup.2 or less when compressed by 25% in the thickness direction. The fixing member has an elongation of 400 m or less when drawn at 96 kPa for 30 minutes in a direction along the thickness direction Z.

A signal conditioning module for a cable tap may include a reversible jumper having at least one pair of U-shaped wires, a first body configured to receive the at least one pair of U-shaped wires on opposite ends within the first body and protruding through recesses within the first body; and a second body configured to cover the first body and retain the at least one pair of wires in place. The first body and the second body are configured to be connected together to form a t-shape, the first body and the second body having a set of first edges that are angled with respect to opposite second edges. A printed circuit board (PCB) includes at least two sets of contacts, wherein the PCB is configured to connect with the reversible jumper and selectively form a first electrical path of at least two electrical paths through the PCB when the reversible jumper is installed in the PCB in a first position.

An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

A connector includes: a terminal, and a housing holding the terminal, the connector being mounted on a substrate with a liquid potting agent applied thereto, wherein: the housing includes a mating recess mating with a counterpart connector, along with a bottom plate part in which a terminal press-in hole with the terminal pressed therein is formed, the terminal includes a contact part contacting a counterpart terminal of the counterpart connector in the mating recess, a substrate connection part which is exposed below the bottom plate part so as to be connected to the substrate, and a holding part housed and held in the terminal press-in hole, and this holding part includes a terminal side first seal part and a terminal side second seal part which respectively configure a first seal part and a second seal part by adhering to the side faces of the terminal press-in hole.

A semiconductor package module is provided. The semiconductor package module may prevent dropout of a large-scale device from a module substrate by improving bonding strength between the module substrate and a part, and perform assembling parts on a top surface and a bottom surface of the module substrate, simultaneously. The semiconductor package module includes: a module substrate; at least one first electric/electronic device mounted on the module substrate by using surface mount technology (SMT); a plurality of passive devices mounted on the module substrate; and at least one second electric/electronic device mounted on the module substrate by using SMT and a resin film adhesive, the at least one second electric/electronic device having a size or a weight greater than a size or a weight of the at least one first electric/electronic device.