A communication module includes a laser driving unit (LDU) and one or more multifunction illumination units. The one or more multifunction illumination units are be coupled to the LDU with an electrical connection and configured to transmit both electrical power and data.

Provided is a nitride semiconductor laser element which includes: a stacked structure including a plurality of semiconductor layers including a light emitting layer, the stacked structure including a pair of resonator end faces located on opposite ends; and a protective film including a dielectric body and disposed on at least one of the pair of resonator end faces. The protective film includes a first protective film (a first emission surface protective film), a second protective film (a second emission surface protective film), and a third protective film (a third emission surface protective film) disposed in stated order above the stacked structure. The first protective film is amorphous, the second protective film is crystalline, and the third protective film is amorphous.

A light source unit includes: a sealed semiconductor laser package including a laser diode that includes an emitter region from which laser light is emitted, the emitter region located at a surface of the laser diode, and a window member configured to transmit the laser light; a first lens structure configured to receive the laser light transmitted through the window member and create an image of the emitter region on an image plane; and a second lens structure configured to convert the laser light having passed through the image plane into a collimated or converged beam, and to emit the collimated or converged beam.

An optical component includes a support member having a through-hole, a second light-transmissive member disposed inside the through-hole, and having a light incidence face, a light emission face, and an outer peripheral side surface, and at least one functional film selected from a group consisting of a short pass filter, a long pass filter, and a heat dissipation member and disposed on a surface of the second light-transmissive member.

To provide an optical module and a scan-type image projection display device at low power consumption in a configuration of enhancing a heat radiation property with excellent assembly performance. An optical module for coupling and irradiating laser beams from a plurality of laser diodes, and onto a desired position is characterized in that a first protruded part corresponding to a first laser holder for holding a first laser diode 1a and a second protruded part corresponding to a second laser holder for holding a second laser diode are provided on a base for placing the optical module thereon, and heat conductive materials are provided between the first protruded part and the first laser holder and between the second protruded part and the second laser holder, respectively.

Methods, systems, and apparatus, including medium-encoded computer program products, for a universal laser system including a laser operable to produce an infrared laser beam for a range of wavelengths, an optics assembly operable to focus and direct the laser beam, and electronics communicatively coupled with the laser and the optics assembly, the electronics being configured to control the laser and the optics assembly, where the laser is configured to produce the infrared laser beam at wavelengths in the range of wavelengths that overlap with absorption peaks due to higher-order, non-linear oscillations of molecular bonds of each polymeric material of at least ten different polymeric materials, thereby generating heat from absorption of photon energy from the infrared laser beam.

Methods, systems, and apparatus, including medium-encoded computer program products, for a universal laser system including a laser operable to produce an infrared laser beam for a range of wavelengths, an optics assembly operable to focus and direct the laser beam, and electronics communicatively coupled with the laser and the optics assembly, the electronics being configured to control the laser and the optics assembly, where the laser is configured to produce the infrared laser beam at wavelengths in the range of wavelengths that overlap with absorption peaks due to higher-order, non-linear oscillations of molecular bonds of each polymeric material of at least ten different polymeric materials, thereby generating heat from absorption of photon energy from the infrared laser beam.

The light source unit includes a base provided with an opening, a support member fixed to the base at the opening, and a light source assembly fixed to the support member at the opening. The light source assembly includes a light source emitting laser light, a lens disposed on an optical axis of the laser light, and a holding member holding the light source and the lens. The support member has a convex receiving surface extending along the spherical surface so as to surround the optical axis when viewed from a direction parallel to the optical axis. The light source assembly is fixed to the support member by coupling the holding member to the receiving surface at a contact portion with the receiving surface. The receiving surface has a portion located on a side away from the optical axis with respect to a coupling part with the holding member.

A metal stem includes a cylindrical portion in which an FPC inserting portion is formed, and a base standing upright from one plane of the cylindrical portion. A tubular lens cap with one open end is fixed to a peripheral portion of the one plane of the cylindrical portion, and has a lens mounted on a bottomed portion. A substrate mounted on one plane of the base includes a signal wiring layer and a ground wiring layer. An optical semiconductor element is mounted on the substrate and has a signal terminal connected to the signal wiring layer of the substrate, and a ground terminal connected to the ground wiring layer of the substrate. An FPC substrate is disposed so as to pass through the FPC inserting portion and to face the one plane of the base. The FPC substrate includes a signal wiring layer connected to the signal wiring layer of the substrate with a metal wire.

A lead pin (2a,2b) penetrates a metal stem (1). A support block (3) is mounted on the metal stem (1). A dielectric substrate (4) is mounted on a side surface of the support block (3). A signal line (5a,5b) is formed on the dielectric substrate (4). One end of the signal line (5a,5b) is connected to the lead pin (2a,2b). A semiconductor optical modulation device (6) is mounted on the dielectric substrate (4). A conductive wire (8a,8b) connects the other end of the signal line (5a,5b) and the semiconductor optical modulation device (6). The semiconductor optical modulation device (6) includes a plurality of optical modulators (6b,6c) separated from each other.