A light emitting device includes a base, a lid portion, a plurality of semiconductor laser elements, and a collimate lens. The lid portion is fixed to the base to define a hermetically sealed space by the lid portion and the base. The semiconductor laser elements are provided in the hermetically sealed space. The collimate lens has a non-lens portion fixed to the lid portion, and a plurality of lens portions connected and aligned along one direction and surrounded by the non-lens portion when viewed from a light extracting surface side of the collimate lens.

An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.

An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.

A laser-based light source includes a material arranged on a package base adjacent to a laser diode chip and an optical element coupled to the material. The optical element is aligned to receive electromagnetic radiation from the laser diode chip. The optical element includes a wavelength conversion material and is configured to receive at least a portion of the electromagnetic radiation emitted by the laser diode chip. A reflective material surrounds sides of the optical element.

A laser device is provided. The laser device includes a bottom plate, a frame body, a heat sink and a light-emitting chip. The light-emitting chip is located on a surface of the heat sink away from the bottom plate. The light-emitting chip includes a plurality of first protrusions and/or a plurality of first depressions, the plurality of first protrusions and/or the plurality of first depressions are located on a first surface of the light-emitting chip; the heat sink includes a plurality of second depressions and/or a plurality of second protrusions, the plurality of second depressions and/or the plurality of second protrusions are located on a second surface of the heat sink; the plurality of first protrusions are located in the plurality of second depressions, and the plurality of second protrusions are located in the plurality of first depressions.

A laser device is provided. The laser device includes a bottom plate, a frame body, a heat sink and a light-emitting chip. The light-emitting chip is located on a surface of the heat sink away from the bottom plate. The light-emitting chip includes a plurality of first protrusions and/or a plurality of first depressions, the plurality of first protrusions and/or the plurality of first depressions are located on a first surface of the light-emitting chip; the heat sink includes a plurality of second depressions and/or a plurality of second protrusions, the plurality of second depressions and/or the plurality of second protrusions are located on a second surface of the heat sink; the plurality of first protrusions are located in the plurality of second depressions, and the plurality of second protrusions are located in the plurality of first depressions.

An embodiment provides a beam projector module including: a light source configured to output light; a substrate configured to support the light source; an optical device configured to reduce the light in terms of intensity output to a predetermined space; a frame configured to separate the optical device from the light source by a predetermined distance; an optical substrate configured to attach the optical device thereto and to define a sealed space with the substrate and the frame, the sealed space having internal pressure lower than pressure outside the sealed space; a sensor configured to measure a state of the sealed space; and a processor configured to change an operation mode of the light source depending on a measured value of the sensor.

An embodiment provides a beam projector module including: a light source configured to output light; a substrate configured to support the light source; an optical device configured to reduce the light in terms of intensity output to a predetermined space; a frame configured to separate the optical device from the light source by a predetermined distance; an optical substrate configured to attach the optical device thereto and to define a sealed space with the substrate and the frame, the sealed space having internal pressure lower than pressure outside the sealed space; a sensor configured to measure a state of the sealed space; and a processor configured to change an operation mode of the light source depending on a measured value of the sensor.

A semiconductor laser device includes: a support base having a plurality of mounting surfaces arranged in a first direction, wherein heights of the mounting surfaces from a reference plane that is parallel to the first direction decrease stepwise or gradually along the first direction; a first semiconductor laser element secured to a first mounting surface; a second semiconductor laser element secured to a second mounting surface; a first slow-axis collimator lens secured to the first mounting surface, the first slow-axis collimator lens being located at a position at which the first laser light is incident; a second slow-axis collimator lens directly or indirectly secured to the second mounting surface, the second slow-axis collimator lens being located at a position at which the second laser light is incident; and a first sealing cover that defines an inner space in which the first and second semiconductor laser elements are held.

A light-emitting device includes a base structure, a light-emitting element, an optical member, and first and second adhesive parts. The first adhesive parts are disposed in first and second regions of a second surface of the base structure. The second adhesive parts are located at both opposite sides of the first adhesive part without being in contact with the first adhesive part. In the top view, a virtual first line segment, which connects two points respectively on the first adhesive parts in the first and second regions, extends across a first surface of the base structure. A virtual line segment, which connects two points respectively on the second adhesive parts at the both opposite sides of the first adhesive part, does not extend across the first surface. A width of the first adhesive part along the line segment is greater than a width of the second adhesive part.