Methods, devices, and systems for double-sided cooling of laser diodes are provided. In one aspect, a laser diode assembly includes a first heat sink, a plurality of submounts spaced apart from one another on the first heat sink, a plurality of laser diodes, and a second heat sink on top sides of the plurality of laser diodes. Each laser diode includes a corresponding active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer. A bottom side of each laser diode is positioned on a different corresponding submount of the plurality of submounts. The plurality of laser diode are electrically connected in series.

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

Methods, devices, and systems for double-sided cooling of laser diodes are provided. In one aspect, a laser diode assembly includes a first heat sink, a plurality of submounts spaced apart from one another on the first heat sink, a plurality of laser diodes, and a second heat sink on top sides of the plurality of laser diodes. Each laser diode includes a corresponding active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer. A bottom side of each laser diode is positioned on a different corresponding submount of the plurality of submounts. The plurality of laser diode are electrically connected in series.

A laser weapon system is described. Particularly, embodiments describe subsystems of a laser weapon system including those necessary for laser generation, operational control, optical emission, and heat dissipation configured to provide a lightweight unit of reduced dimensions.

Various optical systems equipped with diode laser light sources are discussed in the present application. One example system includes a diode laser light source for providing a beam of radiation. The diode laser has a spectral output bandwidth when driven under equilibrium conditions. The system further includes a driver circuit to apply a pulse of drive current to the diode laser. The pulse causes a variation in the output wavelength of the diode laser during the pulse such that the spectral output bandwidth is at least two times larger than the spectral output bandwidth under the equilibrium conditions.

The object is to provide a technique that allows a semiconductor laser to be efficiently cooled. A semiconductor laser light source device includes: a semiconductor laser; a cooler that cools the semiconductor laser; and a driving substrate that drives the semiconductor laser. The cooler is placed in contact with a surface of the semiconductor laser that is opposite to a light emitting surface of the semiconductor laser. Furthermore, the driving substrate is placed in contact with a surface of the cooler that is opposite to a surface of the cooler on which the semiconductor laser is placed.

An air-cooled laser device having a heat radiating structure capable of effectively radiating heat generated by a laser diode module and also radiating heat generated by a heating component other than the laser diode module, without being increased in size. The laser device has: laser diode modules; a heat-receiving plate horizontally-arranged, to which the laser diode modules are thermally connected; at least one L-shaped heat-transferring member extending inside the heat-receiving plate and bending at a right angle outside heat-receiving plate; a plurality of heat radiating fins attached to a vertical portion of the heat-transferring member so that each fin extends in a horizontal direction; and an axial fan for sending air to an upper space of the heat-receiving plate through between the fins. The air after flowing between the fins cools a heating component other than the laser diode module, positioned in the upper space, without changing the flow direction.

An optical module includes: a light emitting unit configured to generate light; a mirror mechanism configured to reflect the light generated by the light emitting unit; and a scanning unit configured to scan the light reflected from the mirror mechanism. The light emitting unit includes: a light forming unit including a plurality of semiconductor light emitting elements and a filter that multiplexes light beams from the plurality of semiconductor light emitting elements; and a protective member disposed so as to surround the light forming unit. The mirror mechanism is disposed outside the protective member and integrated with the protective member, and the scanning unit is disposed in a region surrounded by the protective member.

Various optical systems equipped with diode laser light sources are discussed in the present application. One example system includes a diode laser light source for providing a beam of radiation. The diode laser has a spectral output bandwidth when driven under equilibrium conditions. The system further includes a driver circuit to apply a pulse of drive current to the diode laser. The pulse causes a variation in the output wavelength of the diode laser during the pulse such that the spectral output bandwidth is at least two times larger than the spectral output bandwidth under the equilibrium conditions.

Embodiments of the present disclosure describe a laser projection apparatus. The laser projection apparatus includes a laser source system, an optical engine, a lens system that are sequentially connected in a laser beam propagation direction, a plurality of circuit boards, a first heat dissipation system, and a second heat dissipation system. The first heat dissipation system is configured to dissipate heat of a first laser assembly in the laser source system, the optical engine, and the plurality of circuit boards, and to make airflow sequentially flow through the above components to form a first heat dissipation path. The second heat dissipation system is configured to dissipate heat of a second laser assembly in the laser source system, the lens system, and the plurality of circuit boards, and to make airflow sequentially flow through the above components to form a second heat dissipation path.