A vertical cavity surface emitting laser (VCSEL) may include an active region (e.g., one or more quantum wells) and a chirped pattern reflector. The active region may be configured to be electrically pumped such that the active region generates light having a fundamental mode and a higher order mode. The chirped pattern reflector may include a first portion presenting to the active region as a first portion of an effective mirror having a concave shape and a second portion presenting to the active region as a second portion of the effective mirror having a convex shape.

Laser Side Mode Suppression Ratio (SMSR) control is provided via a logic controller configured to measure an SMSR of a carrier wave upstream of a modulator and measure an Average Optical Power (AOP) of the carrier wave downstream of the modulator; transmit a bias voltage based on the SMSR and the AOP to a laser driver for a laser generating the carrier wave; and transmit an attenuation level based on the SMSR and the AOP to a Variable Optical Attenuator (VOA) upstream of the modulator. In various embodiments the attenuation level and bias voltage can rise or fall together, or one may rise and one may fall to ensure the output optical signal meets specified SMSR and AOP values.

A method or apparatus for narrowing the linewidth of a single mode laser is provided. The linewidth of a single mode laser is narrowed by injecting an optical feedback simultaneously into the first laser cavity mirror and the second laser cavity mirror of the single mode laser.

A photonic integrated circuit device includes a lasing cavity for resonating at a plurality of discrete wavelengths and an optical feedback cavity operably coupled to the lasing cavity via a front surface of the lasing cavity. The optical feedback cavity has a reflective element for reflecting light, at least partially, back into the lasing cavity to form a resonant Fabry-Perot cavity between the front surface and the reflective element. The optical feedback cavity includes a variable phase shifting element adapted for receiving an input signal to control a phase shift of light propagating in the optical feedback cavity. The amount of light entering the lasing cavity from the optical feedback cavity is low enough to avoid dynamic instability of the lasing cavity. The reduction in light is obtained using an attenuator.

The present disclosure is generally directed to an EML with a filter layer disposed between an active region of the EML and a substrate of the EML to absorb a portion of unmodulated light energy, and preferably the unmodulated light energy caused by transverse electric (TE) substrate mode. The filter layer preferably comprises a material with an energy band gap (Eg) that is less than the energy band gap of the predetermined channel wavelength to absorb unmodulated laser light.

A topological bulk laser includes a topological photonic crystal (32) having an energy band inversion between dipole mode and quadrupole mode near the center of Brillouin zone and a trivial photonic crystal (31) not having band inversion for splicing to each other. The reflection and confinement of an optical field occurs at the interface; and the interface encloses to form a closed contour, thereby forming a laser cavity with an effective cavity feedback for lasing at the interior of the interface. This band-inversion-induced reflection mechanism induces single-mode lasing with directional vertical emission. At room temperature, the topological bulk laser can achieve low threshold, narrow linewidth, and a high side-mode suppression ratio, reduce the fabrication difficulty and costs, and improve heat dissipation and electrical injection efficiency, hence improving lifetime and stability of devices.

A semiconductor laser including a waveguide having a core, a confinement layer to bury the core, and a metallization layer. The core includes an active core region. The confinement layer surrounds the core and includes a first confinement layer between the core and the semiconductor substrate below the core, a second confinement layer above the core, and a third confinement layer to either or both sides of the core. The metallization layer is located above the confinement layers and include a first metallization layer and a second metallization layer. The first metallization layer is in direct contact with the second confinement layer and the third confinement layer, while the second metallization layer is disposed above the first layer. The first metallization layer is tuned to have a plasmon resonance corresponding to a higher order mode with high loss.

A single-mode micro-laser based on a single whispering gallery mode optical microcavity and a preparation method thereof described includes: preparing a desired single whispering gallery mode optical microcavity doped with rare earth ions or containing a gain material such as quantum dots, wherein an optical microcavity configuration include a micro-disk cavity, a ring-shaped microcavity, and a racetrack-shaped microcavity; a material type include lithium niobate, silicon dioxide, silicon nitride, etc.; preparing an optical fiber cone or an optical waveguide of a required size which can excite high-order modes of the optical microcavity, such as a ridge waveguide and a circular waveguides; and coupling, integrating, and packaging the optical fiber cone or the optical waveguide with the microcavity. A pump light is coupled to the optical fiber cone or the optical waveguide to excite a compound mode with a polygonal configuration.

A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion along a width direction of a semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the first portion has a first inclined surface inclined with respect to the side surface to go away from the side surface as going away from the semiconductor substrate, and a second inclined surface located opposite to the semiconductor substrate with respect to the first inclined surface and inclined with respect to a center line to approach the center line as going away from the semiconductor substrate. The metal layer extends over the first inclined surface and the second inclined surface.

A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion on a side of a semiconductor substrate along a width direction of the semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the second portion on a side opposite to the semiconductor substrate is located between a surface of an active layer on a side opposite to the semiconductor substrate and a surface of the active layer on a side of the semiconductor substrate. When viewed in the width direction of the semiconductor substrate, a part of the metal layer on the first portion overlaps the active layer. The metal layer is directly formed on the first portion.