A support structure for mounting an optical assembly above an optoelectronic device, the optical assembly comprising an electrically conductive structure, the support structure comprising: a first surface for supporting an optical assembly; and an electrically conductive lead, wherein said electrically conductive lead comprises: a first electrical interface portion adjacent to the first surface for forming an electrical contact with an electrically conductive structure of an optical assembly supported by the first surface; a second electrical interface portion on a side opposing the first surface, and wherein the electrically conductive lead extends from the first electrical interface portion to the second electrical interface portion so as to maintain an optical assembly supported on the first surface and the second electrical interface portion in electrical contact.

The present invention concerns a lighting device comprising a source for generating electromagnetic radiation, and a beam shaper which is so arranged and adapted that in operation of the lighting device it spatially expands the electromagnetic radiation issuing from the source. In comparison therewith the object of the present invention is to provide such a lighting device which ensures eye safety even when the beam shaper is detached or damaged. For that purpose it is proposed according to the invention that the lighting device has a sensor which is so adapted that in operation of the lighting device it detects a state of the beam shaper, wherein the sensor and the source are so operatively connected together and adapted that if during operation of the lighting device the state of the beam shaper changes in such a way that electromagnetic radiation could issue from the lighting device without the beam shaper being in the beam path of the electromagnetic radiation the source is switched off.

In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

A wearable heads-up display includes a power source, laser sources, and a lightguide. A photodetector is positioned to detect an intensity of a test light emitted at a perimeter of the lightguide from an optical path within the lightguide. A laser safety circuit provides a control to reduce or shut off a supply of electrical power from the power source to the laser sources in response to an output signal from the photodetector indicating that the detected intensity is below a threshold.

An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.

A laser-based light source includes a laser device configured to generate laser light of a predetermined laser wavelength and emit this laser light as a laser beam. A light-conversion device is configured to convert at least part of the laser light into converted light and a laser-output sensor is configured to determine a laser-output signal proportional to the output of laser light emitted by the laser device. Further, a converted-light sensor is configured to determine a converted-light signal proportional to the output of converted light emitted by the light-conversion device. A controller is configured to receive the laser-output signal and the converted-light signal, to determine a safe-to-operate parameter, based on the laser-output signal and the converted-light signal, and to control the operation of the laser-based light source based on a comparison of the safe-to-operate parameter with a at least one predefined threshold.

A semiconductor radiation source includes at least one semiconductor chip that generates radiation; and at least one capacitor body, wherein the semiconductor chip and the capacitor body are stacked on top of each other, the semiconductor chip directly electrically connects in a planar manner to the capacitor body, the semiconductor chip is a ridge waveguide laser, and a ridge waveguide of the semiconductor chip is arranged on a side of the semiconductor chip facing away from the capacitor body.

An embodiment provides a beam projector module including: a light source configured to output light; a substrate configured to support the light source; an optical device configured to reduce the light in terms of intensity output to a predetermined space; a frame configured to separate the optical device from the light source by a predetermined distance; an optical substrate configured to attach the optical device thereto and to define a sealed space with the substrate and the frame, the sealed space having internal pressure lower than pressure outside the sealed space; a sensor configured to measure a state of the sealed space; and a processor configured to change an operation mode of the light source depending on a measured value of the sensor.

Laser driver designs that aim to reduce or eliminate the problem of fault laser firing are disclosed. Various laser driver designs presented herein are based on providing a current dissipation path that is configured to start providing a resistance for dissipating at least a portion, but preferably substantially all, of the negative current from the laser diode. Dissipating at least a portion of the negative current may decrease the unintentional increase of the voltage at the input to the laser diode and, therefore, reduce the likelihood that fault laser firing will occur. A control logic may be used to control the timing of when the current dissipation path is activated (i.e., provides the resistance to dissipate the negative current from the laser diode) and when it is deactivated.