H01S5/1003

Semiconductor laser

A semiconductor laser is provided with: an active layer that excites a transverse electric (TE) mode and a transverse magnetic (TM) mode of light and constitutes at least a part of a resonator guiding the TE mode and the TM mode of light; and a diffraction grating as a frequency difference setting structure that sets the difference in oscillation frequency between the TE mode and the TM mode of light higher than a relaxation-oscillation frequency.

SEMICONDUCTOR RING LASER, PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING THE SAME
20220385035 · 2022-12-01 ·

A semiconductor ring laser including a closed loop laser cavity and an optical gain device that is optically interconnected with the closed loop laser cavity. The optical gain device includes a first optical gain segment and a second optical gain segment. The first optical gain segment and the second optical gain segment being non-identical, optically interconnected with each other, and electrically isolated from each other. A PIC including a semiconductor ring laser and to an opto-electronic system that includes a PIC. The opto-electronic system can be one of a transmitter, a receiver, a transceiver, a coherent transmitter, a coherent receiver and a coherent transceiver. The opto-electronic system can for example, but not exclusively, be used for telecommunication applications, LIDAR or sensor applications.

Quantum cascade laser system with angled active region

A QCL may include a substrate, an emitting facet, and semiconductor layers adjacent the substrate and defining an active region. The active region may have a longitudinal axis canted at an oblique angle to the emitting facet of the substrate. The QCL may include an optical grating being adjacent the active region and configured to emit one of a CW laser output or a pulsed laser output through the emitting facet of substrate.

Semiconductor optical element, semiconductor optical integrated element, and method for manufacturing semiconductor optical element

A semiconductor optical element includes a first cladding layer; a second cladding layer formed in a ridge shape; and optical confinement layer interposed between the first cladding layer and the second cladding layer to propagate light, wherein the second cladding layer is configured with a ridge bottom layer; a ridge intermediate layer; and a ridge top layer in this order from the optical confinement layer, and the ridge intermediate layer is formed wider in cross section perpendicular to the optical axis—the light propagating direction in optical confinement layer—than the ridge bottom layer and the ridge top layer.

Systems and methods for chip-scale lasers with low spatial coherence and directional emission

Exemplary embodiments of the present disclosure include chip-scale laser sources, such as semiconductor laser sources, that produce directional beams with low spatial coherence. The lasing modes are based on the axial orbit in a stable cavity and have good directionality. To reduce the spatial coherence of emission, the number of transverse lasing modes can be increased by fine-tuning the cavity geometry. Decoherence is reached in as little as several nanoseconds. Such rapid decoherence facilitates applications in ultrafast speckle-free full-field imaging.

SEGMENTED CONTACT FOR CURRENT CONTROL IN SEMICONDUCTOR LASERS AND OPTICAL AMPLIFIERS

Various semiconductor laser and optical amplifier designs and injection current control methods are disclosed that enable tailoring a distribution of the injection current along an active waveguide of the laser or the optical amplifier. Such configurations can be used to reduce longitudinal current crowding along the active waveguide of the laser or the optical amplifier. The electrodes and/or one or more layers of the laser or the optical amplifier may be segmented to provide a tailored longitudinal injection current distribution.

Heterogeneous substrate bonding for photonic integration
11482513 · 2022-10-25 ·

A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

QUANTUM CASCADE LASER SYSTEM WITH ANGLED ACTIVE REGION
20230131797 · 2023-04-27 ·

A QCL may include a substrate, an emitting facet, and semiconductor layers adjacent the substrate and defining an active region. The active region may have a longitudinal axis canted at an oblique angle to the emitting facet of the substrate. The QCL may include an optical grating being adjacent the active region and configured to emit one of a CW laser output or a pulsed laser output through the emitting facet of substrate.

Quantum cascade laser

A quantum cascade laser includes a first and a second mesa waveguides disposed on a substrate, a first electrode, a second electrode, and a current blocking region disposed burying the first and second mesa waveguides. The first and second mesa waveguides extend in a first direction. The first and second mesa waveguides are arranged apart from each other by a distance in a second direction intersecting with the first direction. The current blocking region has a first portion disposed between the first and second mesa waveguides and a second portion disposed on the first portion. The end of the first electrode and the end of the second electrode are facing each other in the second direction. The second portion protrudes from a reference plane which includes a surface of the end of the first electrode and extends in the first and second directions.

HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION
20230124445 · 2023-04-20 ·

A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.