Exemplary embodiments of the present disclosure include chip-scale laser sources, such as semiconductor laser sources, that produce directional beams with low spatial coherence. The lasing modes are based on the axial orbit in a stable cavity and have good directionality. To reduce the spatial coherence of emission, the number of transverse lasing modes can be increased by fine-tuning the cavity geometry. Decoherence is reached in as little as several nanoseconds. Such rapid decoherence facilitates applications in ultrafast speckle-free full-field imaging.

Gallium and nitrogen containing optical devices operable as laser diodes and methods of forming the same are disclosed. The devices include a gallium and nitrogen containing substrate member, which may be semipolar or non-polar. The devices include a chip formed from the gallium and nitrogen substrate member. The chip has a width and a length, a dimension of less than 150 microns characterizing the width of the chip. The devices have a cavity oriented substantially parallel to the length of the chip.

Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

A gallium- and nitrogen-containing laser device including an etched facet with surface treatment to improve an optical beam is disclosed.

An optical integrated device may include a substrate, a first laser diode oscillating in a transverse magnetic mode (TM mode) on the substrate, and a second laser diode oscillating in a transverse electric mode (TE mode) on the substrate, wherein the first laser diode includes a first body in a shape of a disk, and through holes penetrating the first body.

A laser is configured to emit light along a substrate-parallel plane along a first surface of the laser. An etched facet is on an emitting end of a lasing cavity and an etched mirror is on another end of the lasing cavity. An etched shaping mirror redirects light received from the etched facet in a direction normal to the substrate-parallel plane. A slider comprises an optical input coupler configured to couple the light from the laser into a waveguide of the slider. At least one protrusion is disposed on the laser and at least one recession is disposed on the slider, the at least one protrusion and the at least one recession configured to align the laser with the slider to allow the light to be coupled into the optical input coupler.

A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).

Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Semiconductor device structures comprising laser diode cavities with at least one of a mode-selective filter and a phase-alignment element, and methods for their fabrication, are disclosed. An example device structure comprises a surface-etched grating distributed-feedback (SEG DFB) laser with a mode-selective reflector structure. The reflector structure is designed to provide higher pot feedback of the fundamental TE0 mode and suppression of higher order mode effects. The reflector structure may be a single interface (single facet) mirror type reflector comprising a spatially patterned reflector, or a multi-interface distributed Bragg reflector (DBR). A phase alignment element may be included to provide precise optical phase control. A photodetector for back-facet power monitoring may be included. A method of fabrication is disclosed, based on a self-aligned process in which DBR features are included on the same mask that is used for the DFB laser grating.

An edge-emitting semiconductor laser includes a semiconductor structure having a waveguide layer with an active layer, the waveguide layer extending in a longitudinal direction between first and second side facets of the semiconductor structure, the semiconductor structure has a tapering region adjacent to the first side facet, a thickness of the waveguide layer in the tapering region increases longitudinally, the waveguide layer is arranged between first and second cladding layers, a thickness of the second cladding layer in the tapering region of the semiconductor structure increases longitudinally, the tapering region includes first and second subregions, the first subregion is arranged closer to the first side facet than the second subregion, thickness of the waveguide layer increases longitudinally in the first subregion, thickness of the waveguide layer is constant in the longitudinal direction in the second subregion, and thickness of the second cladding layer increases longitudinally in the second subregion.