A method for manufacturing a light emitting element according to the present disclosure is a method for manufacturing a light emitting element which includes a stacked structure 20 in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are stacked, a first light reflecting layer 41, and a second light reflecting layer 42 having a flat shape, and in which a base surface 90 positioned on a first surface side of the first compound semiconductor layer 21 has a protrusion 91 protruding in a direction away from the active layer 23, and a cross-sectional shape of the protrusion 91 includes a smooth curve, the method including: forming a first sacrificial layer 81 on the base surface on which the protrusion 91 is to be formed; forming a second sacrificial layer 82 on the entire surface; and performing etching back from the base surface 91 inward by using the second sacrificial layer 82 and the first sacrificial layer 81 as etching masks.

A vertical cavity light-emitting element includes a substrate, a first multilayer reflector, a semiconductor structure layer, an electrode layer, and a second multilayer reflector. The semiconductor structure layer includes a first semiconductor layer of a first conductivity type on the first multilayer reflector, a light-emitting layer on the first semiconductor layer, and a second semiconductor layer of a second conductivity type on the light-emitting layer. The electrode layer is on an upper surface of the semiconductor structure layer and is electrically in contact with the second semiconductor layer in one region of the upper surface. The second multilayer reflector covers the one region on the electrode layer and constitutes a resonator with the first multilayer reflector. The semiconductor structure layer has one recessed structure including one or a plurality of recessed portions passing through the light-emitting from the upper surface in a region surrounding the one region.

A multi-wavelength light-emitting semiconductor device and a method of fabricating the same are disclosed. The semiconductor device includes a substrate, a first reflector on the substrate, a light emission layer on the first reflector, second reflectors on corresponding active regions; and apertures on corresponding active regions. The light emission layer includes active regions. Each of the active regions includes a primary emission wavelength different from each other.

Disclosed herein are various embodiments for stronger and more powerful high speed laser arrays. For example, an apparatus is disclosed that comprises an active mesa structure in combination with an electrical waveguide, wherein the active mesa structure comprises a plurality of laser regions within the active mesa structure itself, each laser region of the active mesa structure being electrically isolated within the active mesa structure itself relative to the other laser regions of the active mesa structure.

Provided is a variable-wavelength surface emission laser having a wide wavelength variation range. A partial region of a thin-plate substrate (22) and a movable mirror (20), the partial region being positioned between an air gap (G1) and a movable gap (G2), can move toward the air gap (G1) side or the movable gap (G2) side.

A light emitting element includes: a laminated structure 20 obtained by laminating a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22; a first light reflecting layer 41 disposed on a first surface side of the first compound semiconductor layer 21; a second light reflecting layer 42 disposed on a second surface side of the second compound semiconductor layer 22; and light convergence/divergence changing means 50. The first light reflecting layer 41 is formed on a concave mirror portion 43. The second light reflecting layer 42 has a flat shape. When light generated in the active layer 23 is emitted to the outside, a light convergence/divergence state before the light is incident on the light convergence/divergence changing means 50 is different from a light convergence/divergence state after the light passes through the light convergence/divergence changing means 50.

A vertical cavity surface emitting laser includes a first distributed Bragg reflector, an active layer, and a second distributed Bragg reflector. The first distributed Bragg reflector, the active layer and the second distributed Bragg reflector are arranged in sequence in the direction of a first axis. The second distributed Bragg reflector includes a semiconductor region and a high resistance region. The high resistance region has an electrical resistance higher than the electrical resistance of the semiconductor region. The first axis passes through the semiconductor region. The high resistance region surrounds the semiconductor region. In a cross section including the first axis, the high resistance region has an inner edge extending in a direction inclined with respect to the first axis such that an inner diameter of the high resistance region increases as a distance from the active layer increases in the direction of the first axis.

A compound semiconductor has a high electron concentration of 5×10.sup.19 cm.sup.−3 or higher, exhibits an electron mobility of 46 cm.sup.2/V.Math.s or higher, and exhibits a low electric resistance, and thus is usable to produce a high performance semiconductor device. The present invention provides a group 13 nitride semiconductor of n-type conductivity that may be formed as a film on a substrate having a large area size at a temperature of room temperature to 700° C.

A semiconductor light-emitting element having a structure in which a substrate, a first reflector, a resonator cavity including an active layer, a second reflector and a transparent conductive film are stacked in this sequence, the semiconductor light-emitting element comprising: a first current constriction portion configured with an oxidation constriction layer; and a second current constriction portion configured with an insulation film, which is formed on an upper face of the second reflector and has an opening, and a contact portion between the transparent conductive film and a semiconductor layer with which the transparent conductive film is in contact, wherein a width d2 of the second current constriction portion is smaller than a width d1 of the first current constriction portion.

A semiconductor light-emitting element having a structure in which a substrate, a first reflector, a resonator cavity including an active layer, a second reflector and a tunnel junction portion are stacked in this sequence, comprising: a first current constriction portion configured with an oxidation constriction layer; and a second current constriction portion including the tunnel junction portion, wherein a width d2 of the second current constriction portion is smaller than a width d1 of the first current constriction portion.