H01S5/2226

OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE

There is provided a configuration which includes: a burying layer which has a current narrowing window where portions protruding onto a top part of a ridge stripe are opposed to each other with an interval therebetween narrower than a width of the top part; and a diffraction grating in which a λ/4 phase shifter is placed at an intermediate portion in a light traveling direction; wherein a sectional shape of the current narrowing window varies depending on a position in the light traveling direction so that, at a region where the λ/4 phase shifter is placed, a resistance of a current path from a second cladding layer to a first cladding layer through the current narrowing window is minimum.

DIODE LASER HAVING A CURRENT SHIELD

The present invention relates to a diode laser with a current block and, in particular, to a diode laser with a modified “p-n-p” or “n-p-n” structure as a current block for reducing the tunneling probability. A diode laser according to the invention comprises an active layer and a layered current block formed outside the active layer, wherein the current block is made of a material doped in opposition to its surroundings for a spatially selective current injection of the active layer between an n-substrate and a p-contact; wherein the current block is separated from adjacent layers via an intrinsic outer layer.

Vertical-cavity surface emitting laser for emitting a single mode laser beam

A vertical-cavity surface emitting laser includes a substrate, a first reflector, an active region, an oxide layer, a second reflector, and a circular metal electrode. The first reflector is formed above the substrate. The active region is formed above the first reflector, and includes at least one quantum well. The at least one quantum well generates a laser beam with a plurality of modes. The oxide layer is formed above the active region and includes an oxide aperture. The second reflector is formed above the oxide layer. The circular metal electrode is formed in a circular concave in the second reflector. The circular metal electrode reflects other modes of the laser beam with the plurality of modes except for a fundamental mode and receive an operational voltage. A window exists between the circular concave and lets the laser beam with the fundamental mode pass.

Semiconductor laser device, semiconductor laser module, and welding laser light source system

A semiconductor laser device lases in a multiple transverse mode and includes a stacked structure where a first conductivity-side semiconductor layer, an active layer, and a second conductivity-side semiconductor layer are stacked above a substrate. The second conductivity-side semiconductor layer includes a current block layer having an opening that delimits a current injection region. Side faces as a pair are formed in portions of the stacked structure that range from part of the first conductivity-side semiconductor layer to the second conductivity-side semiconductor layer. The active layer has a second width greater than a first width of the opening. The side faces in at least part of the first conductivity-side semiconductor layer are inclined to the substrate. A maximum intensity position in a light distribution of light guided in the stacked structure, in a direction of the normal to the substrate, is within the first conductivity-side semiconductor layer.

SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME

A semiconductor light-emitting element includes: a substrate; an n-type clad layer above the substrate; an active layer above the n-type clad layer; and a p-type clad layer above the active layer. The active layer includes: a well layer; an n-side first barrier layer on an n-type clad layer side of the well layer; and a p-side barrier layer on a p-type clad layer side of the well layer. The p-side barrier layer comprises In. The n-side first barrier layer has an In composition ratio lower than an In composition ratio of the p-side barrier layer. The n-side first barrier layer has a band gap energy smaller than a band gap energy of the p-side barrier layer.

Buried-type semiconductor optical device

A buried semiconductor optical device comprises a semiconductor substrate; a mesa-stripe portion including a multi-quantum well layer on the semiconductor substrate; a buried layer consisting of a first portion and a second portion, the first portion covering one side of the mesa-stripe portion, the second portion covering the other side of the mesa-stripe portion, and the first portion and the second portion covering a surface of the semiconductor substrate; and an electrode configured to cause an electric current to flow through the mesa-stripe portion, the buried layer comprising, from the surface, a first, second, and third sublayer, the first and third sublayer each consisting of semi-insulating InP, the first sublayer and the second sublayer forming a pair structure, the second sublayer being located above the multi-quantum well layer, and the second sublayer consisting of one or more layers selected from InGaAs, InAlAs, InGaAlAs, InGaAsP, and InAlAsP.

VERTICAL-CAVITY SURFACE EMITTING LASER FOR EMITTING A SINGLE MODE LASER BEAM
20220021186 · 2022-01-20 ·

A vertical-cavity surface emitting laser includes a substrate, a first reflector, an active region, an oxide layer, a second reflector, and a circular metal electrode. The first reflector is formed above the substrate. The active region is formed above the first reflector, and includes at least one quantum well. The at least one quantum well generates a laser beam with a plurality of modes. The oxide layer is formed above the active region and includes an oxide aperture. The second reflector is formed above the oxide layer. The circular metal electrode is formed in a circular concave in the second reflector. The circular metal electrode reflects other modes of the laser beam with the plurality of modes except for a fundamental mode and receive an operational voltage. A window exists between the circular concave and lets the laser beam with the fundamental mode pass.

NON-REFRIGERATED TUNABLE SEMICONDUCTOR LASER BASED ON MULTI-WAVELENGTH ARRAY AND PREPARATION METHOD

A non-refrigerated tunable semiconductor laser based on a multi-wavelength array includes a thermistor, a tunable laser array, a multiplexing structure, an optical amplifier, an optical splitter, an optical detector, and a main controller. The tunable laser array include a plurality of laser units with different wavelengths, and the tunable laser array is connected to the optical splitter and the main controller through the multiplexing structure and the optical amplifier in sequence. When the laser is influenced by the external environment temperature, the value of the influence caused by the external environment temperature is calculated, and drive currents of the tunable laser array and the optical amplifier are adjusted and controlled respectively according to the calculation result, so as to achieve the purpose that parameters of the final output light are consistent with parameters of the theoretical light.

OPTICAL SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME AND OPTICAL INTEGRATED SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

An optical semiconductor element including a semiconductor substrate, a first cladding layer of a first conductive type provided on the semiconductor substrate, an active layer provided on the first cladding layer, a second cladding layer of a second conductive type provided on the active layer, a first mesa constituted of a part of the first cladding layer, the active layer, and the second cladding layer, an auxiliary cladding layer of the second conductive type provided on the first mesa, a second mesa constituted of the auxiliary cladding layer, and a semi-insulating layer provided on the first cladding layer and on both sides of the first mesa and both sides of the second mesa, wherein a width of the second mesa is greater than a width of the first mesa.

Semiconductor Optical Element
20210184421 · 2021-06-17 ·

A first conduction type first cladding layer and a second conduction type second cladding layer are arranged on the two sides in the vertical direction of a core portion having a multiple quantum-well structure, and a first conduction type third cladding layer and a second conduction type fourth cladding layer are arranged on the two sides in the horizontal direction of the core portion. A first electrode connected to the third cladding layer is formed. A second electrode connected to the fourth cladding layer is formed. A reverse bias is applied between the first and third cladding layers and the second and fourth cladding layers.