The present disclosure relates to a converter for an air conditioner. The converter includes a substrate; an inductor disposed in one side of the substrate, and comprising a core and a coil wound around the core; a switching element disposed in one side of the substrate, and selectively controlling a flow of a circuit; and a heat sink for absorbing heat generated from the switching element by contacting the switching element, wherein a lead-in hole is formed in one side of the substrate, and at least a portion of the inductor is disposed in the lead-in hole, thereby quickly discharging the heat generated by the inverter and more efficiently using a space.

In this semiconductor device, an emitter electrode of a power semiconductor element includes a first sub-electrode provided in a region including a central portion of a front surface of a semiconductor substrate and a second sub-electrode provided in a region not including the central portion of the front surface of the semiconductor substrate. A first bonding wire connects the first sub-electrode and an emitter terminal. A second bonding wire connects the second sub-electrode and the emitter terminal. First and second voltage detectors detect voltages between the emitter terminal and the first and second sub-electrodes, respectively. It is possible to separately detect degradation of both the first bonding wire that degrades in an early period and the second bonding wire that degrades in a terminal period.

An apparatus includes a power supply monitor operative to monitor a status of multiple power converters. Based on the monitored status, the power supply monitor detects an event associated with a first power converter of the multiple power converters. The power supply monitor communicates a notification of the event to a management entity. The notification is encoded to include an identity of the first power converter experiencing the event as determined by the power supply monitor or other suitable entity.

A multi-phase voltage converter has a plurality of integrated circuits (ICs), and a controller. Each IC has a control pin to receive a control signal, a monitoring pin and a temperature sensing circuit, the controller has a monitoring pin connected to the monitoring pin of each of the plurality of ICs to receive a monitoring signal. The temperature sensing circuit is connected to or disconnected from the monitoring pin of the corresponding one of the plurality of ICs in response to the control signal and the monitoring signal.

A power converter apparatus includes a power module assembly including a power module and a cooler overlapping with the power module to allow the cooler to cover both sides of the power module, and a capacitor and a low voltage direct-current (DC)-DC converter (LDC) which are coupled in a state of pressing the power module assembly on both sides of the power module assembly.

Methods and apparatuses for controlling an apparatus comprising a controller integrated in a first slave device. In an example, the controller can detect a sensed current of the first slave device. The controller can receive a voltage signal associated with a second slave device connected to the first slave device. The controller can generate a correction current based on the sensed current of the first slave device and the voltage signal. The controller can modulate a pulse width modulation (PWM) signal received by the first slave device using the correction current. The controller can control a power converter using the modulated PWM signal.

The invention discloses a method and a system for correction of the junction temperatures of an IGBT module in a photovoltaic inverter. The method includes: constructing an electrothermal coupling model of an IGBT model based on a photovoltaic inverter topology, a light radiation intensity, and an ambient temperature; selecting an IGBT collector-emitter on-state voltage drop as an aging parameter and designing an on-state voltage drop sampling circuit to ensure measurement accuracy; constructing an aging database for IGBT modules in different aging stages based on large current and small current injection methods; comparing a junction temperature value output by the electrothermal coupling model with the calibrated junction temperature value and calibrating an aging process coefficient of an electrothermal coupling model correction formula; comparing an IGBT aging monitoring value with the aging threshold to determine the aging process and selecting a corresponding aging process coefficient to ensure accuracy of junction temperature data.

A circuit with a metal-oxide semiconductor field-effect transistor and a diode module is applied to a power factor correction circuit, which can effectively reduce the heat generated by the whole system under heavy load, The circuit includes a metal-oxide semiconductor field-effect transistor and a diode module and a load determination unit. The diode module includes a plurality of diodes with a switch. The load determination unit can control the connection/disconnection of each diode in the diode module based on the magnitude of the load current. It can effectively reduce the current generated by each diode due to the load, thereby reducing the heat generation of the overall system. Moreover, due to the contact capacitance effect after the diodes are connected in parallel, the electromagnetic interference (EMI) characteristics of the power factor correction circuit of the system can be further optimized.

In an embodiment, a power module may include: a plurality of first stages, each having an H-bridge to receive an incoming AC voltage at a first frequency and rectify the incoming AC voltage to a DC voltage; a plurality of DC buses, each to receive the DC voltage from one of the plurality of first stages; a plurality of second stages, each coupled to one of the plurality of DC buses to receive the DC voltage and output a second AC voltage at a second frequency; and a hardware configuration system having fixed components and optional components to provide different configurations for the power module.

A power converter assembly comprises a plurality of power converter channels each arranged to provide a three-phase output to an electrical machine having a multiple of three-phase windings. The power converter assembly further comprises control means arranged to provide a torque demand signal to the plurality of power converter channels to provide, together, a desired torque output to drive the machine and a temperature sensing means to detect temperature in the power channels and/or at the windings of the machine. The control means is arranged to determine the proportion of the desired torque output to be provided by each channel based on the detected temperature.