Various embodiments of charge adjustment techniques for a switched capacitor power converter are described. In one example embodiment, briefly, charge adjustment techniques may include a technique to operate a charge pump so as to reduce electrical transient effects that may occur during charge pump transition operation between a first steady state charge pump operation with respect to a first configuration gain mode and a second steady state charge pump operation with respect to a second configuration gain mode. In some instances, electrical transient effects may occur during charge pump transition operation, at least in part, from a selectable adjustment of charge pump configuration gain with respect to a configuration gain mode.

A driver circuit drives an output terminal with an input/output voltage using an NMOS transistor and a PMOS transistor. A pre-driver for the NMOS transistor supplied with a drive voltage and receives a data signal referenced to the drive voltage. A pre-driver for the PMOS transistor has a positive supply input connected to the positive supply rail, a negative supply input receiving a second drive voltage equal to the supply voltage minus the drive voltage. A level shifter circuit, shifts the data signal to be referenced between the supply voltage and the second drive voltage. A charge pump circuit for providing second drive voltage, the charge pump circuit driven with a variable switching frequency proportional to a current of the PMOS transistor.

There is described a rectifier circuit for providing and limiting a supply voltage to an RFID tag, the circuit including a pair of antenna input terminals configured to receive an input signal from an RFID tag antenna. A plurality of charge pump stages are coupled in cascade in such a way that an input terminal of a first charge pump stage in the cascade is connected to ground and an input terminal of each subsequent charge pump stage in the cascade is coupled to an output terminal of the preceding charge pump stage in the cascade. A control logic is configured to select the output terminal of one charge pump stage among the plurality of charge pump stages to provide the supply voltage. Furthermore, an RFID tag and a method of providing and limiting a supply voltage to an RFID tag are described.

A driver circuit drives an output terminal with an input/output voltage using an NMOS transistor and a PMOS transistor. A pre-driver for the NMOS transistor supplied with a drive voltage and receives a data signal referenced to the drive voltage. A pre-driver for the PMOS transistor has a positive supply input connected to the positive supply rail, a negative supply input receiving a second drive voltage equal to the supply voltage minus the drive voltage. A level shifter circuit, shifts the data signal to be referenced between the supply voltage and the second drive voltage. A charge pump circuit for providing second drive voltage, the charge pump circuit driven with a variable switching frequency proportional to a current of the PMOS transistor.

A charge pump having an input section, and first and second output charge pump sections. The input section includes an input and output node and N input charge pump cells arranged between the input and output nodes. The first output charge pump section includes a first input and output node and M first charge pump cells arranged between the first input and output nodes. The second output charge pump section includes a second input and output node and K second charge pump cells arranged between the second input and output nodes (M, N, K: any integer≥1). The output node of the input charge pump section is coupled with the first input node of the first output charge pump section and with the second input node of the second output charge pump section. The charge pump is configured to provide a first output voltage on the first output node and a second output voltage on the second output node.

An electronic device is disclosed. The electronic device includes: a first doped region of a first doping type arranged in a first semiconductor layer of a second doping type complementary to the first doping type; an insulation layer formed on top of the first semiconductor layer and adjoining the first doped region; at least two active device regions arranged in a second semiconductor layer formed on top of the insulation layer; and an electrical connection between one of the at least two active device regions and the first doped region. Each of the at least two active device regions is arranged adjacent to the first doped region and separated from the first doped region by the insulation layer.

An apparatus for providing electric power to a load includes a power converter that accepts electric power in a first form and provides electric power in a second form. The power converter comprises a control system, a first stage, and a second stage in series. The first stage accepts electric power in the first form. The control system controls operation of the first and second stage. The first stage is either a switching network or a regulating network. The second stage is a regulating circuit when the first stage is a switching network, and a switching network otherwise.

Circuits/methods for controlling the startup of multiple parallel power converters that avoid inrush current or switch overstress in an added power converter or a power converter having fault conditions. Embodiments include node status detectors coupled to nodes within parallel-connected power converters to monitor voltage/current and configured in some embodiments to work in parallel with an output status detector measuring the startup output voltage of a power converter. With charge pump-based power converters, the node status detectors ensure that the power converter pump capacitors are charged while the output capacitor is charged as well. For such embodiments, a softstart period of startup may be considered finished if both the shared output capacitors and the power converter pump capacitors are charged to target values. Embodiments may also be used for fault detection during steady-state operation.

Charge pump stages are coupled between flying capacitor pairs and arranged in a cascaded between a bottom voltage line and an output voltage line. Gain stages apply pump phase signals having a certain amplitude to the charge pump stages via the flying capacitors. A feedback signal path from the output voltage line to the bottom voltage line applies a feedback control signal to the bottom voltage line. Power supply for the gain stages is provided by a voltage of the feedback control signal in order to control the amplitude of the pump phase signals. An asynchronous logic circuit generates the switching drive signals for the gain stages with a certain switching frequency which is a function of a logic supply voltage derived from the voltage of the feedback control signal.

A charge pump circuit is provided. The charge pump circuit includes a dual-phase charge pump, a first load switch, a second load switch, and a control circuit. The dual-phase charge pump performs a voltage pumping operation on a power source in response to a first clock and a second clock to generate a first pumping voltage at a first node and a second pumping voltage at a second node. The control circuit controls the first load switch in response to a third clock and controls the second load switch in response to a fourth clock. In a period during which the first load switch is turned off, the second load switch transfers the first pumping voltage to an output terminal of the charge pump circuit. In a period during which the second load switch is turned off, the first load switch transfers the second pumping voltage to the output terminal.