A method and apparatus for enhancing the sensitivity of an oscillator circuit functioning, in use, to sense changes in the inductance of inductive elements and/or the capacitance of capacitive elements coupled to said oscillator circuit. The oscillator circuit is coupled to a nonlinear resonator for generating a comb of frequencies in response to a drive frequency generated by the oscillator circuit, the comb of frequencies having at least a portion of at least one tooth for which an absolute value of the first derivative of the drive frequency with respect to said comb frequency is less than 1.0, comparing an output of the nonlinear resonator with an output of a reference oscillator for detecting changes in the drive signal of the oscillator circuit as enhanced by the slope of the at least a portion of at least one tooth for which the absolute value of the first derivative of the drive frequency with respect to said comb frequency is less than 1.0.

A method and apparatus for enhancing the sensitivity of an oscillator circuit functioning, in use, to sense changes in the inductance of inductive elements and/or the capacitance of capacitive elements coupled to said oscillator circuit. The oscillator circuit is coupled to a nonlinear resonator for generating a comb of frequencies in response to a drive frequency generated by the oscillator circuit, the comb of frequencies having at least a portion of at least one tooth for which an absolute value of the first derivative of the drive frequency with respect to said comb frequency is less than 1.0, comparing an output of the nonlinear resonator with an output of a reference oscillator for detecting changes in the drive signal of the oscillator circuit as enhanced by the slope of the at least a portion of at least one tooth for which the absolute value of the first derivative of the drive frequency with respect to said comb frequency is less than 1.0.

An electronic system includes a first LC oscillator connected to a first general-purpose input/output (GPIO) circuit and a second LC oscillator connected to a second GPIO circuit. A threshold generator is coupled to an input of the comparator. A control circuit is configured to control a measurement phase comprising a first capture phase and a second capture phase. A microcontroller is coupled to the control circuit and a power management circuit is configured to switch-off the microcontroller following activation of the control circuit by the microcontroller. The control circuit is configured to control the application of an excitation signal to the each oscillator via the respective GPIO circuit, control the GPIO circuit so that oscillations of the oscillator are provided to the comparator, and count, based on an output of the comparator, a number of oscillations in the oscillator exceeding a threshold output by the threshold generator.

An electronic system includes a first LC oscillator connected to a first general-purpose input/output (GPIO) circuit and a second LC oscillator connected to a second GPIO circuit. A threshold generator is coupled to an input of the comparator. A control circuit is configured to control a measurement phase comprising a first capture phase and a second capture phase. A microcontroller is coupled to the control circuit and a power management circuit is configured to switch-off the microcontroller following activation of the control circuit by the microcontroller. The control circuit is configured to control the application of an excitation signal to the each oscillator via the respective GPIO circuit, control the GPIO circuit so that oscillations of the oscillator are provided to the comparator, and count, based on an output of the comparator, a number of oscillations in the oscillator exceeding a threshold output by the threshold generator.

Networks of superharmonic injection-locked (SHIL) electronic oscillators can be used to emulate Ising machines for solving difficult computational problems. The oscillators can be simulated or implemented in hardware (e.g., with LC oscillators) and are coupled to each other with links whose connection strengths are weighted according to the problem being solved. The oscillators' phases may be measured with respect to reference signal(s) from one or more reference oscillators, each of which emits a reference signal but does not receive input from any other oscillator. Sparsely connected networks of SHIL oscillators and reference oscillators can be used as Viterbi decoders that do not suffer from the information bottleneck between logic computational blocks and memory in digital computing systems. Sparsely connected networks of SHIL oscillators and reference oscillators can also be programmed to act as Boolean logic gates that operate in both forward and backward directions, enabling multipliers that can factor numbers.

Apparatus and methods of automatically trimming a PCB-based LC circuit. The apparatus may comprise an interface to a printed circuit board (PCB). The PCB may include a PCB inductor and a PCB capacitor to form an LC circuit. The LC circuit may have an LC circuit frequency. The apparatus may comprise a variable capacitor communicatively coupled to the interface and configured to adjust an effective capacitance of the LC circuit.

A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.

An apparatus can comprise a circuit and an electrical element coupled to the circuit. The circuit can include a pulse generator to generate an electrical pulse having a first power and a load. The electrical element can be configured to receive heat that is converted into electrical energy by the circuit to apply a second power, greater than the first power, to the load.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.