An oscillator control system includes an oscillator structure configured to oscillate about first and second rotation axes according to a Lissajous pattern, wherein an oscillation about the second rotation axis imparts a cross-coupling error onto an oscillation about the first rotation axis, and wherein the cross-coupling error changes in accordance with a Lissajous position within the Lissajous pattern; and a driver circuit that includes a phase-locked loop (PLL) configured to regulate a driving signal that drives the oscillation about the first rotation axis. The PLL is configured to generate a PLL signal based on a phase error of the oscillation about the first rotation axis. The PLL includes a compensation circuit configured to receive the PLL signal and the Lissajous position within the Lissajous pattern, apply a compensation value to the PLL signal to generate a compensated PLL signal used for generating the driving signal based on the Lissajous position.

An oscillator control system includes an oscillator structure configured to oscillate about first and second rotation axes according to a Lissajous pattern, wherein an oscillation about the second rotation axis imparts a cross-coupling error onto an oscillation about the first rotation axis, and wherein the cross-coupling error changes in accordance with a Lissajous position within the Lissajous pattern; and a driver circuit that includes a phase-locked loop (PLL) configured to regulate a driving signal that drives the oscillation about the first rotation axis. The PLL is configured to generate a PLL signal based on a phase error of the oscillation about the first rotation axis. The PLL includes a compensation circuit configured to receive the PLL signal and the Lissajous position within the Lissajous pattern, apply a compensation value to the PLL signal to generate a compensated PLL signal used for generating the driving signal based on the Lissajous position.

A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members. An angle θ1 formed between the first imaginary line and a second imaginary line passing through the first bonding member and the second bonding member is 100°<θ1<140°.

A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members. An angle θ1 formed between the first imaginary line and a second imaginary line passing through the first bonding member and the second bonding member is 100°<θ1<140°.

A detection circuit for detecting a clock signal includes a multiplexer, a digital-to-analog converter, a comparator, and a counter. The multiplexer outputs either a first signal or a second signal as a selection signal. The digital-to-analog converter outputs a reference voltage according to the selection signal. The comparator compares the clock signal to the reference voltage to generate a comparison signal. The counter counts a reference clock signal to generate an overflow signal, and resets the overflow signal according to the comparison signal. The overflow signal indicates the amplitude of the clock signal.

A detection circuit for detecting a clock signal includes a multiplexer, a digital-to-analog converter, a comparator, and a counter. The multiplexer outputs either a first signal or a second signal as a selection signal. The digital-to-analog converter outputs a reference voltage according to the selection signal. The comparator compares the clock signal to the reference voltage to generate a comparison signal. The counter counts a reference clock signal to generate an overflow signal, and resets the overflow signal according to the comparison signal. The overflow signal indicates the amplitude of the clock signal.

An oven-controlled crystal oscillator according to one or more embodiments includes a core section having at least an oscillation IC, a crystal resonator, and a heater IC. The core section is hermetically encapsulated in a heat-insulating package. The core section is supported by the package via a core substrate. The core substrate is connected to the package outside a region where the core section is provided in plan view.

An oven-controlled crystal oscillator according to one or more embodiments includes a core section having at least an oscillation IC, a crystal resonator, and a heater IC. The core section is hermetically encapsulated in a heat-insulating package. The core section is supported by the package via a core substrate. The core substrate is connected to the package outside a region where the core section is provided in plan view.

A crystal oscillator includes an oscillating substrate, a hollow frame, a first electrode, and a second electrode. The oscillating substrate includes a main oscillating region and a thinned region that has a thickness smaller than that of the main oscillating region. The first and second electrodes are disposed on a first surface of the oscillating substrate and a second surface opposite to the first surface, respectively. The hollow frame is disposed on the second surface. The second electrode includes a second electrode portion that has at least one opening in positional correspondence with the thinned region. A method for making the crystal oscillator is also provided herein.

A crystal oscillator includes an oscillating substrate, a hollow frame, a first electrode, and a second electrode. The oscillating substrate includes a main oscillating region and a thinned region that has a thickness smaller than that of the main oscillating region. The first and second electrodes are disposed on a first surface of the oscillating substrate and a second surface opposite to the first surface, respectively. The hollow frame is disposed on the second surface. The second electrode includes a second electrode portion that has at least one opening in positional correspondence with the thinned region. A method for making the crystal oscillator is also provided herein.