An electronic device may include wireless circuitry with a processor, a transceiver, an antenna, and a front-end module coupled between the transceiver and the antenna. The front-end module may include one or more radio-frequency amplifiers for amplifying a radio-frequency signal. The radio-frequency amplifier may include input transistors cross-coupled with capacitance neutralization transistors and/or coupled to cascode transistors. One or more n-type gain adjustment transistors may be coupled to source terminals of the capacitance neutralization transistors. One or more p-type gain adjustment transistors may be coupled to source terminals of the cascode transistors. One or more processors in the electronic device can selectively activate one or more of the gain adjustment transistors to reduce the gain of the radio-frequency amplifier without degrading noise performance and without altering the in-band frequency response of the radio-frequency amplifier.

A reactance cancelling radio frequency (RF) circuit array is disclosed. The reactance cancelling RF circuit array includes multiple RF circuits each coupled to one or two adjacent RF circuits by one or two pairs of coupling mediums each having a respective length less than one-quarter wavelength. In one aspect, an RF input signal is first split across the RF circuits and then combined to form an RF output signal. As a result, each RF circuit requires a lower power handling capability to process a portion of the RF input signal. In another aspect, each pair of the coupling mediums can cause reactance cancellation in each reactance-cancelling pair of the RF circuits. By coupling the RF circuits via the coupling mediums and enabling splitting-combining among the RF circuits, it is possible to miniaturize the reactance cancelling RF circuit array for improved performance across a wide frequency spectrum.

An amplifier circuit includes a first amplifier that amplifies a high frequency signal, and a load circuit that changes a load impedance of the first amplifier without being controlled by an external circuit so that a saturation power at a first temperature is higher than a saturation power at a second temperature lower than the first temperature, and an efficiency at the first temperature is lower than an efficiency at the second temperature.

An amplifier circuit includes a first amplifier that amplifies a high frequency signal, and a load circuit that changes a load impedance of the first amplifier without being controlled by an external circuit so that a saturation power at a first temperature is higher than a saturation power at a second temperature lower than the first temperature, and an efficiency at the first temperature is lower than an efficiency at the second temperature.

A two-stage differential amplifier with cross-coupled compensation capacitors. The differential amplifier includes first amplifier circuitry receiving a differential input voltage and presenting first and second intermediate outputs. The amplifier further includes a second amplifier stage with a first leg having an input coupled to the second intermediate output of the first amplifier circuitry, and a second leg having an input coupled to the first intermediate output of the first amplifier circuitry. A compensation capacitor is provided for each leg of the second amplifier stage, each coupled between the output of that amplifier leg and its input. A first cross-coupled capacitor is coupled between the output of the first amplifier leg to the input of the second amplifier leg, and a second cross-coupled capacitor is coupled between the output of the second amplifier leg and the input of the first amplifier leg.

A power amplifier module includes an output-stage amplifier, a driver-stage amplifier, an input switch, an output switch, an input matching circuit, an inter-stage matching circuit, an output matching circuit, and a control circuit. The input switch selectively connects one of a plurality of input signal paths to an input terminal of the driver-stage amplifier. The output switch selectively connects one of a plurality of output signal paths to an output terminal of the output-stage amplifier. The control circuit controls operations of the driver-stage amplifier and the output-stage amplifier. The input switch, the output switch, and the control circuit are integrated into an IC chip. The control circuit is disposed between the input switch and the output switch.

Methods and apparatus are provided. In an example aspect, an amplifier protection circuit is provided. The amplifier protection circuit comprises an input for receiving a signal from a first amplifier, and an isolation circuit between the input and an output of the amplifier protection circuit. The isolation circuit is configured to sense a backward signal propagating from the output of the amplifier protection circuit towards the input to provide a sensed signal, and to provide at least one cancellation signal based on the sensed signal to at least partially cancel the backward signal.

A distributed power management circuit is provided. In embodiments disclosed herein, the distributed power management circuit can achieve multiple performance enhancing objectives simultaneously. More specifically, the distributed power management circuit can be configured to switch a modulated voltage from one voltage level to another within a very short switching window, reduce in-rush current required for switching the modulated voltage, and minimize a ripple in the modulated voltage, all at same time. As a result, the distributed power management circuit can be provided in a wireless device (e.g., smartphone) to enable very fast voltage switching across a wide modulation bandwidth (e.g., 400 MHz) with reduced power consumption and voltage distortion.

An amplifier circuit structure can include an amplifier located in a main path, and a first switch located in a bypass. One end of a second switch is a signal output end of the amplifier circuit structure, and the other end of the second switch is configured to selectively connect to a signal output end of the bypass or a signal output end of the main path. The first and second switches are configured to control their respective operating states when a first instruction is received, such that the main path is connected to the signal input end and the signal output end of the amplifier circuit structure; and to control their respective operating states when a second instruction is received, such that the bypass is connected to the signal input end of the amplifier circuit structure and the signal output end of the amplifier circuit structure.

Methods and devices for reducing gate node instability of a differential cascode amplifier are presented. Ground return loops, and therefore corresponding parasitic inductances, are eliminated by using voltage symmetry at nodes of two cascode amplification legs of the differential cascode amplifier. Series connected capacitors are coupled between gate nodes of pairs of cascode amplifiers of the two cascode amplification legs so to create a common node connecting the two capacitors. In order to reduce peak to peak voltage variation at the common node under large signal conditions, a shunting capacitor is connected to the common node.