A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

A device includes an amplifier having a first path and a second path and a first variable attenuator connected to the first path. The device includes a controller coupled to the first variable attenuator. The controller is configured to determine a magnitude of an input signal to the amplifier. When the magnitude of the input signal is below a threshold, the controller is configured to set an attenuation of the first variable attenuator to a first attenuation value. When the magnitude of the input signal is above the threshold, the controller is configured to set the attenuation of the first variable attenuator to a second attenuation value. The second attenuation value is less than the first attenuation value.

An integrated circuit chip includes a first single-ended-to-differential amplifier configured to generate a differential output associated with an input of said first single-ended-to-differential amplifier; a second single-ended-to-differential amplifier arranged in parallel with said first single-ended-to-differential amplifier; a first set of switch circuits arranged downstream of said first single-ended-to-differential amplifier; a second set of switch circuits arranged downstream of said second single-ended-to-differential amplifier; and a first differential-to-single-ended amplifier arranged downstream of a first one of said switch circuits in said first set and downstream of a first one of said switch circuits in said second set.

Aspects of this disclosure relate to bulk acoustic wave components. A bulk acoustic wave component can include a substrate, at least one bulk acoustic wave resonator on the substrate, and a cap enclosing the at least one bulk acoustic wave resonator. The cap can include a sidewall spaced apart from an edge of the substrate. The sidewall can be 5 microns or less from the edge of the substrate.

This invention aims to present a smart and dynamic power amplifier module that features both power combining and power sharing capabilities. The proposed flexible power amplifier (PA) module consists of a pre-processor, N PAs, and a post-processor. The pre-processor is an M-to-N wavefront (WF) multiplexer (muxer), while the post processor is a N-to-M WF de-multiplexer (demuxer), where N≧M≧2. Multiple independent signals can be concurrently amplified by a proposed multi-channel PA module with a fixed total power output, while individual signal channel outputs feature different power intensities with no signal couplings among the individual signals. In addition to basic configurations, some modules can be configured to feature both functions of parallel power amplifiers and also as M-to-M switches. Other programmable features include configurations of power combining and power redistribution functions with a prescribed amplitude and phase distributions, as well as high power PA with a linearizer.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components.

A first system includes first and second buck-boost amplifiers. The first amplifier is connected to a battery, includes a first inductor and a first plurality of switches connected to the first inductor, and drives first and second loads. The second amplifier is connected to the battery, includes a second inductor and a second plurality of switches connected to the second inductor, and drives the first and second loads. A controller drives the first and second plurality of switches to operate each of the first and second amplifiers in a single inductor multiple output mode. A second system includes multiple buck-boost amplifiers connected to a battery and driving respective loads. Each amplifier includes inductors and switches connected to the inductors. A controller drives the switches to utilize one or more inductors based on an amount of power used by each amplifier to drive the respective loads.