RF transistor amplifiers include an RF transistor amplifier die having a semiconductor layer structure, a coupling element on an upper surface of the semiconductor layer structure, and an interconnect structure on an upper surface of the coupling element so that the RF transistor amplifier die and the interconnect structure are in a stacked arrangement. The coupling element includes a first shielded transmission line structure.

RF transistor amplifiers include an RF transistor amplifier die having a semiconductor layer structure, a coupling element on an upper surface of the semiconductor layer structure, and an interconnect structure on an upper surface of the coupling element so that the RF transistor amplifier die and the interconnect structure are in a stacked arrangement. The coupling element includes a first shielded transmission line structure.

A transistor device package includes a component assembly comprising an interconnect structure, a transistor die having a front surface including gate, drain, and source terminal on a first surface of the interconnect structure, and one or more passive electrical components electrically coupled to the gate, drain, and/or source terminal by the interconnect structure. A thermally conductive flange is attached to a back surface of the transistor die, which is opposite the front surface, by a conductive adhesive. Respective patterns of the conductive adhesive are provided on the first surface of the interconnect structure, and least one of the respective patterns of the conductive adhesive provides an input, output, or ground signal path for the transistor device package. Related fabrication methods are also discussed.

The present disclosure relates to a communication technique for converging Internet of Things (IoT) technology with a 5.sup.th Generation (5G) communication system for supporting a higher data transfer rate beyond a 4.sup.th Generation (4G) system, and a system therefor. The disclosure can be applied to intelligent services (e.g., smart homes, smart buildings, smart cities, smart or connected cars, health care, digital education, retail business, and services associated with security and safety) on the basis of 5G communication technology and IoT-related technology. An antenna module is provided. The antenna module includes an antenna, and at least one transmission line configured to transmit a first signal through the antenna for transmission or receive a second signal through the antenna for reception. The length of the transmission line may be determined based on the impedance when the first signal or the second signal flows through the transmission line.

A transistor amplifier includes a die comprising a gate terminal, a drain terminal, and a source terminal, a circuitry module on the transistor die and electrically coupled to the gate terminal, the drain terminal, and/or the source terminal, and one or more passive electrical components on a first surface of the circuitry module. The one or more passive electrical components are electrically coupled between the gate terminal and a first lead of the transistor amplifier and/or between the drain terminal and a second lead of the transistor amplifier.

RF transistor amplifiers include an RF transistor amplifier die having a semiconductor layer structure, a coupling element on an upper surface of the semiconductor layer structure, and an interconnect structure on an upper surface of the coupling element so that the RF transistor amplifier die and the interconnect structure are in a stacked arrangement. The coupling element includes a first shielded transmission line structure.

An electronic device may include wireless circuitry having an LC filter. The LC filter may include first and second series inductors coupled between the input and output of the LC filter. An input capacitor can be coupled at the input of the LC filter, and an output capacitor can be coupled at the output of the LC filter. Feedforward capacitors can be cross-coupled with the first and second series inductors to at least partially or fully cancel out any parasitic capacitance associated with the first and second series inductors to mitigate any undesired self-resonant effects associated with the series inductors.

The present disclosure relates to a communication technique for converging Internet of Things (IoT) technology with a 5th Generation (5G) communication system for supporting a higher data transfer rate beyond a 4th Generation (4G) system, and a system therefor. The disclosure can be applied to intelligent services (e.g., smart homes, smart buildings, smart cities, smart or connected cars, health care, digital education, retail business, and services associated with security and safety) on the basis of 5G communication technology and IoT-related technology. An antenna module is provided. The antenna module includes an antenna, and at least one transmission line configured to transmit a first signal through the antenna for transmission or receive a second signal through the antenna for reception. The length of the transmission line may be determined based on the impedance when the first signal or the second signal flows through the transmission line.

An electronic device may include wireless circuitry having an LC filter. The LC filter may include first and second series inductors coupled between the input and output of the LC filter. An input capacitor can be coupled at the input of the LC filter, and an output capacitor can be coupled at the output of the LC filter. Feedforward capacitors can be cross-coupled with the first and second series inductors to at least partially or fully cancel out any parasitic capacitance associated with the first and second series inductors to mitigate any undesired self-resonant effects associated with the series inductors.

In examples, an electronic device includes an antenna and a transmitter line. The transmitter line includes a double-tuned transformer having first and second windings, the first winding having first and second ends, the second winding having third and fourth ends, and the third end coupled to the antenna. The transmitter line includes a first capacitor coupled between the first and second ends. The transmitter line also includes a second capacitor coupled between the third and fourth ends, and a switch coupled between the first end and a reference terminal.