A radio communication filtering apparatus includes: a filter main body including a connector attaching portion and a grooved portion that encloses at least a part of the connector attaching portion; and a connector to be attached to the connector attaching portion.

Embodiments of a filter for electromagnetic radiation are disclosed herein. The filter includes a first glass-ceramic substrate having a first refractive index, a second glass-ceramic substrate having the first refractive index, and a first region disposed between the first glass-ceramic substrate and the second glass-ceramic substrate. The first region has a second refractive index that is less than the first refractive index. Further, the second glass-ceramic substrate is arranged substantially parallel to and spatially disposed from the first glass-ceramic substrate. The filter transmits at least 70% of electromagnetic radiation within a band of frequencies and reflects at least 80% of electromagnetic radiation outside the band of frequencies. The band of frequencies is located within the frequency range of 20 GHz to 100 GHz.

A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.

Disclosed herein is a common mode filter that includes first and second terminal electrodes provided on the first flange part, third and fourth terminal electrodes provided on the second flange part, a first wire wound around the winding core part and having one end connected to the first terminal electrode and other end connected to the third terminal electrode, and a second wire wound around the winding core part and having one end connected to the second terminal electrode and other end connected to the fourth terminal electrode. The winding core part includes a first winding region, a second winding region, and a third winding region positioned between the first and second winding regions in the axial direction. The first and second wires are bifilar-wound in the first and second winding regions and layer-wound in the third winding region.

A wafer-level manufacturing method for embedding a passive element in a glass substrate is disclosed. A highly doped silicon wafer is dry etched to form a highly doped silicon mould wafer, containing highly doped silicon passive component structures mould seated in cavity arrays; a glass wafer is anodically bonded to the highly doped silicon mould wafer in vacuum pressure to seal the cavity arrays; the bonded wafers are heated so that the glass melts and fills gaps in the cavity arrays, annealing and cooling are performed, and a reflowed wafer is formed; the upper glass substrate of the reflowed wafer is grinded and polished to expose the highly doped silicon passives; the passive component structure mould embedded in the glass substrate is fully etched; the blind holes formed in the glass substrates after the passive component structure mould has been etched is filled with copper by electroplating; the highly doped silicon substrate and unetched silicon between the cavity arrays are etched, and several glass substrates embedded with a passive element are obtained; to form electrodes for the passives, a metal adhesion layer is deposited, and a metal conductive layer is electroplated. The process is simple, costs are low, and the prepared passive elements have superior performance.

A dielectric thin film containing MgO as a main component, wherein the dielectric thin film is composed of a columnar structure group containing at least one columnar structure A constructed by single crystal and at least one columnar structure B constructed by polycrystal, respectively, and in the cross section of the direction perpendicular to the dielectric thin film, when the area occupied by the columnar structure A is set as C.sub.A and the area occupied by the columnar structure B is set as C.sub.B, the relationship between C.sub.A and C.sub.B satisfies 0.4≦C.sub.B/C.sub.A≦1.1.

A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.

An electronic component includes an antenna electrode functioning as a first electrode plate, a circuit board functioning as a second electrode plate, and a short-circuit section that electrically connects the antenna electrode and the circuit board. The circuit board includes a surface functioning as a first surface opposed to the antenna electrode, a grounding section, a circuit component functioning as a conductive structure disposed on the surface, and a wiring pattern that connects the circuit component and the grounding section.

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.

A radio frequency module includes a switch circuit that includes selection terminals, a filter that allows the signal in the first frequency band to pass therethrough, a filter that allows the signal in the second frequency band to pass therethrough, a phase adjustment circuit that is connected to the selection terminal and the filter, and a phase adjustment circuit that is connected to the selection terminal and the filter. The filter includes an acoustic wave resonator that is formed on a substrate that has piezoelectricity. The filter includes an acoustic wave resonator that is formed on a substrate that has piezoelectricity. At least one of circuit elements that are included in the phase adjustment circuit is formed on the substrate. At least one of circuit elements that are included in the phase adjustment circuit is formed on the substrate.