The invention relates to a method of manufacturing a plurality of mechanical resonators in a manufacturing wafer, the resonators being intended to equip a regulating member of a timepiece, the method comprising the following steps: (a) fabricating a plurality of resonators in at least one wafer according to reference specifications; (b) measuring the actual frequency of each of the plurality of resonators; (c) determining the offset of the actual frequency of the resonators with respect to the reference specifications; and (d) applying on at least one of the resonators at least two masses from a series of tuning masses to compensate the offset of the concerning resonator to bring the resonator closer to the reference specifications.

A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.

A resonance device is provided that includes a lower lid that has a recessed portion, and a resonator that is mounted on the lower lid and has a vibration arm that performs out-of-plane bending vibration in a space including the recessed portion and a frame provided around the vibration arm and having a facing portion facing a tip of the vibration arm. The facing portion of the frame is located in an outer-side portion of the resonator with respect to a straight line connecting an intersection point of a perpendicular extending from the tip of the vibration arm toward the recessed portion of the lower lid and the recessed portion of the lower lid, to a cavity edge of the recessed portion facing the tip of the vibration arm.

Embodiments of the present disclosure relate generally to MEMS resonators. An exemplary MEMS resonator comprises a resonator beam having a length and a width. The length can be an integer multiple of the width. The integer multiple can be at least two. The resonator is configured to resonate at a frequency upon application of an input signal. The TCF of this resonator can be made close to zero, thus providing a temperature stable resonator. The exemplary MEMS resonator thereby has the advantages of high Q, low polarization voltage, low motional impedance and temperature stability of low frequency resonators while being able resonate at high frequencies of 30 MHz to 30 GHz.

A micro-electrical-mechanical system (MEMS) guided wave device includes a plurality of electrodes arranged below a piezoelectric layer (e.g., either embedded in a slow wave propagation layer or supported by a suspended portion of the piezoelectric layer) and configured for transduction of a lateral acoustic wave in the piezoelectric layer. The piezoelectric layer permits one or more additions or modifications to be made thereto, such as trimming (thinning) of selective areas, addition of loading materials, sandwiching of piezoelectric layer regions between electrodes to yield capacitive elements or non-linear elastic convolvers, addition of sensing materials, and addition of functional layers providing mixed domain signal processing utility.

Described herein is using an array of microelectromechanical systems (MEMS) oscillators to produce unique identifiers. At least some of the MEMS oscillators will “couple” or influence each other when exposed to an external stimulus, such that the frequency of the device is not equal to the combination of individual MEMS oscillator frequencies. The frequency of the device provides a unique “fingerprint” that allows the device to be identified with accuracy but is incredibly difficult to copy, meaning the response may be a physical unclonable function (PUF).

Micro-Electro-Mechanical System (MEMS) devices for harvesting sound energy and methods for fabricating MEMS devices for harvesting sound energy are provided. In an embodiment, a method for fabricating a MEMS device for harvesting sound energy includes forming a pressure sensitive MEMS structure disposed over a semiconductor substrate and including a suspended structure in a cavity. Further, the method includes etching the semiconductor substrate to form an acoustic port through the semiconductor substrate configured to allow acoustic pressure to deflect the suspended structure.

A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.

A resonance device is provided that includes a lower cover; an upper cover coupled to the lower cover; and a resonator that has vibration arms that generate bending vibration in an interior space provided between the lower cover and the upper cover. Moreover, the vibration arms have distal ends provided with metal films on a side that faces the upper cover, and a gap is provided between the distal ends of the vibration arms and the upper cover that is larger than a gap between the distal ends of the vibration arms and the lower cover.