A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.

Described is an apparatus which comprises: a first transmission path for a first frequency band; a second transmission path for a second frequency band different from the first frequency band; a node common to the first and second transmission paths, the node to be coupled to an antenna; and a transmission-zero circuit coupled to the common node.

Radio-frequency splitter circuits, devices and methods. In some embodiments, a power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.

A multiplexer includes a first acoustic wave filter, a second acoustic wave filter, and an inductor-capacitor (LC) filter each connected to a common terminal. A passband of the second acoustic wave filter is between a passband of the first acoustic wave filter and a passband of the LC filter, a frequency gap between the passband of the second acoustic wave filter and the passband of the LC filter is greater than a frequency gap between the passband of the first acoustic wave filter and the passband of the second acoustic wave filter, the passband of the first acoustic wave filter includes a transmission band of the first communication band, the passband of the LC filter includes a reception band of the first communication band, and the passband of the second acoustic wave filter includes a reception band of a second communication band.

A network interface device includes a passive path between an entry port and a first port. The network interface device also includes an active path between the entry port and a second port. The network interface device also includes a buffer in the active path configured to absorb, attenuate, terminate, or isolate radio-frequency (RF) signals. The network interface device also includes a switching element in the active path configured to cause the RF signals to bypass the buffer when the network interface is in a first state that exists during powered operation of the network interface device, and direct the RF signals to the buffer when the network interface device is in a second state that exists during non-powered operation or faulted operation of the network interface device.

A diplexer includes a common terminal, first and second terminals, and first and second filters which are electrically connected to the common terminal. The first filter passes a high frequency signal in a first frequency band. The second filter passes a high frequency signal in a second frequency band higher than the first frequency band. Each filter includes an inductor and a capacitor in a dielectric substrate. The first filter includes a first inductor with one end electrically connected to the common terminal, and a first capacitor electrically connected between another end of the first inductor and a ground. An inductance of the first inductor is smaller than an inductance of another inductor included in the first filter. A frequency of an attenuation pole defined by the first inductor and the first capacitor is higher than a frequency of the second frequency band.

A diplexer having a low band filter and a high band filter is disclosed. The disclosure provides a diplexer having a low band filter and a high band filter for preventing the circuit damage due to an electrostatic discharge in the diplexer itself, and minimizing the signal loss according to addition of an electrostatic discharge prevention circuit.

A broadband power splitter can include an input port, a first output port and a second output port. The power splitter can further include a first signal path implemented between the input port and the first output port, and a second signal path implemented between the input port and the second output port. Each of the first and second signal paths can include a variable capacitance configured to provide a plurality of capacitance values that result in different frequency responses of the respective signal path.

An integrated isolator circuit for isolating receiver and transmitter in a Time-Division Duplex transceiver is disclosed. The integrated isolator circuit comprises a first node, a second node and. a third node. The integrated isolator circuit further comprises a first capacitor connected in series with a first switch and connected between the first and second nodes. The integrated isolator circuit further comprises a first inductor connected between the first and second nodes and a second capacitor connected between the second node and the third node. The first switch has an on state and an off state, and the integrated isolator circuit is configured to have a different impedance at a certain operating frequency by controlling the state of the first switch.