A power amplification circuit can include an input impedance matching circuit associated with one or more frequency bands of a plurality of frequency bands. The power amplification circuit can include a transistor with respective input coupled to an output of the input impedance matching circuit. The power amplification circuit can include a plurality of output impedance matching circuits. Each output impedance matching circuit can be associated with a respective frequency band of the plurality of frequency bands. The power amplification circuit can include a single pole multi-throw (SPMT) switch having an input terminal connected to an output of the transistor and a plurality of output terminals. Each output terminal of the SPMT switch can be connected to a corresponding output impedance matching circuit of the plurality of output impedance matching circuits.

Disclosed is a filter bank die that includes a first acoustic wave (AW) filter having a first antenna terminal coupled to the antenna port terminal and a first filter terminal, wherein the first AW filter is configured to have a filter skirt with a slope that spans at least a 100 MHz gap between adjacent passbands, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter.

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

A radio-frequency (RF) splitter is provided. The RF splitter includes a common branch node configured to transfer an RF signal, input from an input port, to at least one of first and second output ports, first and second branch nodes electrically connected between the common branch node and the first and second output ports, first and second series switches configured to control switching operations to electrically connect the common branch node and the first and second branch nodes to each other, first and second inductors electrically connected between the common branch node and the first and second branch nodes, a resistor electrically connected between the first and second branch nodes, and first and second shunt switches configured to control switching operations to electrically connect the first and second branch nodes and the resistor to each other.

A radio frequency module includes a transmit filter of Band A and Band B, a transmit amplifier, and a switch circuit and can perform CA using a transmit signal of Band A and a receive signal of Band B, a transmit band of Band B including a receive band of Band C. The switch circuit includes a switch switching connection between a common terminal and a first selection terminal, a switch switching connection between the common terminal and a second selection terminal, and a switch switching connection between the second selection terminal and a third selection terminal. The common terminal is connected to the transmit amplifier. The first selection terminal is connected to the transmit filter of Band A. The second selection terminal is connected to the transmit filter of Band B. The third selection terminal is connected to a receive path of Band C.

Front end architectures are described that tailor duplexer characteristics to enable the removal of many of the impedance matching components typically included in a receive signal path between an antenna and receive amplifiers and in a transmit signal path between transmit amplifiers and the antenna. By tailoring duplexer characteristics, targeted impedance matching can be achieved for front end architectures. This enables the front-end architecture to impedance match without including typical impedance matching components along a signal path between the antenna and an amplifier. This can be implemented on the transmit signal path (e.g., between a power amplifier (PA) and the antenna), on the receive signal path (e.g., between the antenna and a low noise amplifier (LNA)), or both the transmit signal path and the receive signal path. Thus, the disclosed front end architectures are configured to reduce or eliminate the number of components required for impedance matching.

According to embodiments of the present invention, a switching circuit is provided. The switching circuit includes a transmission line arrangement including a plurality of transmission lines coupled to each other, and at least one switching element arrangement coupled to at least one transmission line of the plurality of transmission lines, wherein, in a first mode of operation, the at least one switching element arrangement is configured in a first state, wherein, in a second mode of operation, the at least one switching element arrangement is configured in a second state, and wherein the transmission line arrangement is configured to, depending on whether the at least one switching element arrangement is configured in the first state or the second state, generate a standing wave from an input signal received by the transmission line arrangement for coupling into an output signal, wherein the output signal is transmitted from the transmission line arrangement.

This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.

A switch module includes a switch circuit and a filter. The switch circuit includes two or more selection terminals, a common terminal provided for the two or more selection terminals, and first and second bypass terminals. The filter is connected between the first and second bypass terminals and reduces harmonics of a radio-frequency signal which passes through the filter. The switch circuit is selectively switched between a first connection mode and a second connection mode. In the first connection mode, the common terminal is connected to any of the two or more selection terminals. In the second connection mode, the common terminal is connected to the first bypass terminal and the second bypass terminal is connected to any of the two or more selection terminals.

A communication module includes an input/output switch, a duplexer, a transmit filter, and a receive filter. In the duplexer, a second side is disposed at a position farther from the input/output switch than a first side in a second direction orthogonal to a first direction. Any one of the transmit filter and the receive filter is disposed adjacent to the input/output switch in the first direction.