An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor.

An electronic device includes multiple antennas to transmit one or more signals, and a transmitter electrically coupled to the antennas. The transmitter has splitter circuitry that receives an input signal and generates the signals. The splitter circuitry includes a pair of inductive elements that are inductively coupled together. The splitter circuitry includes capacitive elements to absorb parasitic input and output capacitance. In additional or alternative embodiments, the splitter circuitry may be in the form of combiner circuitry and disposed in a receiver of the electronic device.

A multilayer substrate includes a dielectric substrate, a pair of capacitor electrodes, and an input/output electrode that is an electrode for input, an electrode for output, or an electrode for input and output. The dielectric substrate has a first main surface and a second main surface that are opposite to each other in a thickness direction of the dielectric substrate. The pair of capacitor electrodes is disposed in the dielectric substrate. Electrodes of the pair of capacitor electrodes face each other in the thickness direction. The input/output electrode is disposed on the second main surface of the dielectric substrate. A capacitor that includes the pair of capacitor electrodes and a portion being part of the dielectric substrate and located between the electrodes of the pair of capacitor electrodes at least partially overlaps the input/output electrode electrically connected to the capacitor.

A multilayer substrate includes a dielectric substrate, a pair of capacitor electrodes, and an input/output electrode that is an electrode for input, an electrode for output, or an electrode for input and output. The dielectric substrate has a first main surface and a second main surface that are opposite to each other in a thickness direction of the dielectric substrate. The pair of capacitor electrodes is disposed in the dielectric substrate. Electrodes of the pair of capacitor electrodes face each other in the thickness direction. The input/output electrode is disposed on the second main surface of the dielectric substrate. A capacitor that includes the pair of capacitor electrodes and a portion being part of the dielectric substrate and located between the electrodes of the pair of capacitor electrodes at least partially overlaps the input/output electrode electrically connected to the capacitor.

A multiplexer includes a first filter disposed on a first signal path, a second filter disposed on a second signal path different from the first signal path, the second filter having a passband different from that of the first filter, a common connection point at which the first signal path and the second signal path are connected to each other, and an inductor disposed in series on a path connecting the common connection point and the first filter, the path being a portion of the first signal path. On the first signal path, a distance connecting the common connection point and the inductor is shorter than a distance connecting the inductor and the first filter.

Certain aspects of the present disclosure provide a circuit for dividing or combining power. The circuit generally includes a Wilkinson power divider, a first capacitive element, and a first resistive element coupled in parallel with the first capacitive element, wherein the first capacitive element and the first resistive element are coupled between a first port of the circuit and a first port of the Wilkinson power divider.

The invention relates to a filter circuit which, on the hardware level, prevents charge transfers caused by one or more currents in a frequency divider (200) from generating an interference signal that can cause a signal distortion at the output of a current-to-voltage converter (300) belonging to a filter circuit. This signal distortion would otherwise have to be removed by means of laborious post-processing of the signal. In this process, the voltage curve at the input of the frequency divider (200) or the current at the second output of the frequency divider (200) are employed so that, by means of a compensation circuit arrangement, it is possible to model a compensation signal that essentially compensates for an interference signal caused by the charge transfers. The invention also relates to an associated method.

In a filter arrangement comprising a frequency filter (F) that has a bad or non-ideal ground connection (GC1, 2, 3, 4, 5, 6, 7), the defects arising from bad ground are compensated by a capacitance (CC) coupled in parallel to the frequency filter. The value of the capacitance is chosen between 1 and 50 fF. The filter arrangement may be a receiving filter (RF) in a duplexer (DU).

A multiplexer includes a first filter disposed on a first signal path, a second filter disposed on a second signal path different from the first signal path, the second filter having a passband different from that of the first filter, a common connection point at which the first signal path and the second signal path are connected to each other, and an inductor disposed in series on a path connecting the common connection point and the first filter, the path being a portion of the first signal path. On the first signal path, a distance connecting the common connection point and the inductor is shorter than a distance connecting the inductor and the first filter.

Certain aspects of the present disclosure provide a circuit for dividing or combining power. The circuit generally includes a Wilkinson power divider, a first capacitive element, and a first resistive element coupled in parallel with the first capacitive element, wherein the first capacitive element and the first resistive element are coupled between a first port of the circuit and a first port of the Wilkinson power divider.