A directional coupler (1) includes a substrate (10), a main line (20) formed directly or indirectly on the substrate (10), sub-lines (21, 22 and 23) at least part of each of which is formed directly or indirectly on the substrate (10) along the main line (20), a switch (30) switching connections among end portions of the plurality of sub-lines (21, 22 and 23), and detection output terminals (FWD and REV) connected to the sub-line (21), wherein, when looking at the substrate (10) in plan, the end portions of the sub-lines (21, 22 and 23) are disposed on the opposite side to the detection output terminals (FWD and REV) relative to the main line (20), and the sub-line (21) to which the detection output terminals (FWD and REV) are connected is overlapped with or surrounded by the sub-lines (22 and 23).

A capacitive coupling circuit device is provided with a capacitive coupling circuit and a ground-side feedback circuit. The capacitive coupling circuit demodulates a modulated signal, which is obtained by modulating an input signal and transmitting a modulated input signal through a coupling capacitor. The ground-side feedback circuit is inserted between a first ground terminal on a signal input side of the capacitive coupling circuit and a second ground terminal on a signal output side of the capacitive coupling circuit. The ground-side feedback circuit is configured by connecting a second capacitor in series to a parallel circuit of a first capacitor and a first resistor. Alternatively, the ground-side feedback circuit may be configured by connecting the second capacitor and a third capacitor in series to both ends of the parallel circuit of the first capacitor and the first resistor, respectively.

Favorable isolation characteristics are obtained over a wide band in a non-reciprocal circuit element. A non-reciprocal circuit element includes: a magnetic material 10 to which a DC magnetic field is applied by a permanent magnet; and a plurality of center electrodes disposed on the magnetic material 10 so as to intersect each other in an insulated state. Of the plurality of center electrodes, a first center electrode 21 is connected at one end thereof to a first input/output port P1, and a second center electrode 22 is connected at one end thereof to a second input/output port P2. A resistance element R is connected in series between the ports P1 and P2, and a phase-shift circuit (a parallel resonant circuit composed of an inductance element L5 and a capacitance element C5) is connected in series with the resistance element R.

Favorable isolation characteristics are obtained over a wide band in a non-reciprocal circuit element. A non-reciprocal circuit element includes: a magnetic material 10 to which a DC magnetic field is applied by a permanent magnet; and a plurality of center electrodes disposed on the magnetic material 10 so as to intersect each other in an insulated state. Of the plurality of center electrodes, a first center electrode 21 is connected at one end thereof to a first input/output port P1, and a second center electrode 22 is connected at one end thereof to a second input/output port P2. A resistance element R is connected in series between the ports P1 and P2, and a phase-shift circuit (a parallel resonant circuit composed of an inductance element L5 and a capacitance element C5) is connected in series with the resistance element R.

The present invention includes a method for creating a system-in-package in or on photodefinable glass including: providing a photodefinable glass substrate; masking a design layout comprising one or more structures to form one or more integrated lumped element devices as the system-in-package on or in a photodefinable glass substrate; transforming at least a portion of the photodefinable glass substrate to form a glass-crystalline substrate; etching the glass-crystalline substrate to form one or more channels in the glass-crystalline substrate; depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate to enable electroplating of copper; and electroplating the copper to fill the one or more channels and to deposit copper on the surface of the photodefinable glass to form the one or more integrated lumped element devices.

A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.

A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die.

A capacitive coupling circuit device is provided with a capacitive coupling circuit and a ground-side feedback circuit. The capacitive coupling circuit demodulates a modulated signal, which is obtained by modulating an input signal and transmitting a modulated input signal through a coupling capacitor. The ground-side feedback circuit is inserted between a first ground terminal on a signal input side of the capacitive coupling circuit and a second ground terminal on a signal output side of the capacitive coupling circuit. The ground-side feedback circuit is configured by connecting a second capacitor in series to a parallel circuit of a first capacitor and a first resistor. Alternatively, the ground-side feedback circuit may be configured by connecting the second capacitor and a third capacitor in series to both ends of the parallel circuit of the first capacitor and the first resistor, respectively.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.