A bulk acoustic resonator architecture is fabricated by epitaxially forming a piezoelectric film on a top surface of post formed from an underlying substrate. In some cases, the acoustic resonator is fabricated to filter multiple frequencies. In some such cases, the resonator device includes two different resonator structures on a single substrate, each resonator structure configured to filter a desired frequency. Including two different acoustic resonators in a single RF acoustic resonator device enables that single device to filter two different frequencies in a relatively small footprint.

A laterally excited bulk acoustic wave device is disclosed. The laterally excited bulk acoustic wave device can include a first solid acoustic mirror, a second solid acoustic mirror, a piezoelectric layer that is positioned between the first solid acoustic mirror and the second solid acoustic mirror, an interdigital transducer electrode on the piezoelectric layer, and a support substrate arranged to dissipate heat associated with the bulk acoustic wave. The interdigital transducer electrode is arranged to laterally excite a bulk acoustic wave. The first solid acoustic mirror and the second solid acoustic mirror are arranged to confine acoustic energy of the bulk acoustic wave. The first solid acoustic mirror is positioned on the support substrate.

Acoustic resonators and filter devices. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A conductor pattern formed is formed on the front surface of the piezoelectric plate, including an interdigital transducer (IDT) with interleaved fingers of the IDT on the diaphragm. The substrate and the piezoelectric plate are the same material.

A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

The present disclosure relates to a method for fabricating a laterally excited shear mode acoustic resonator. The method includes: providing a piezoelectric layer including monocrystalline lithium niobate and/or monocrystalline lithium tantalate; forming an acoustic mirror on a first surface of the piezoelectric layer; the acoustic mirror including at least one first acoustic reflection layer and at least one second acoustic reflection layer, the first acoustic reflection layers and the second acoustic reflection layers being alternately superimposed, and acoustic impedance of each of the first acoustic reflection layers being less than that of each of the second acoustic reflection layers; bonding a bearing wafer on a first surface of the acoustic mirror; and forming an electrode unit and a lateral reflector on a second surface of the piezoelectric layer.

A process for fabricating a micro-electro-mechanical system, includes the following steps: production of a stack on the surface of a temporary substrate so as to produce a first assembly, comprising: at least depositing a piezoelectric material or a ferroelectric material to produce a layer of piezoelectric material or of ferroelectric material; producing a first bonding layer; production of a second assembly comprising at least producing a second bonding layer on the surface of a host substrate; production of at least one acoustic isolation structure in at least one of the two assemblies; production of at least one electrode level containing one or more electrodes in at least one of the two assemblies; bonding the two assemblies via the two bonding layers, before or after the production of the at least one electrode level in at least one of the two assemblies; removing the temporary substrate.

There is provided a laminated substrate having a piezoelectric film, including: a substrate; and a piezoelectric film provided on the substrate interposing a base film, wherein the piezoelectric film has an alkali niobium oxide based perovskite structure represented by a composition formula of (K.sub.1-xNa.sub.x)NbO.sub.3 (0<x<1) and preferentially oriented in (001) plane direction, and a sound speed of the piezoelectric film is 5100 m/s or more.

An acoustic wave device includes a support substrate, a piezoelectric layer overlapping the support substrate viewed in a first direction, a functional electrode on at least a first main surface of the piezoelectric layer, and a wiring electrode connected to the functional electrode. A space is provided on a second main surface side opposite to the first main surface of the piezoelectric layer. The space is covered with the piezoelectric layer, the wiring electrode covers a portion of the functional electrode, and an air gap or an insulating film is provided between the functional electrode and the wiring electrode in a region where the functional electrode is covered with the wiring electrode.

An acoustic wave device includes a support substrate, an inorganic film over the support substrate, a piezoelectric layer over the inorganic film, and an electrode over the piezoelectric layer. A portion of the support substrate includes a hollow that overlaps at least a portion of the electrode in a thickness direction of the support substrate. An inner wall of the inorganic film is located farther from the hollow than a location on an inner wall of the support substrate, the location being closest to the piezoelectric layer, the inner wall of the support substrate defining the hollow.

The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator with tunable electromechanical coupling. The disclosed BAW resonator includes a bottom electrode, a top electrode, and a multilayer transduction structure sandwiched therebetween. Herein, the multilayer transduction structure is composed of multiple transduction layers, and at least one of the transduction layers is formed of a ferroelectric material, whose polarization will vary with an electric field across the ferroelectric material. Upon adjusting direct current (DC) bias voltage across the bottom electrode and the top electrode, an overall polarization of the multilayer transduction structure and an overall electromechanical coupling coefficient of the multilayer transduction structure are capable of being changed. Once the change of the overall electromechanical coupling coefficient of the multilayer transduction structure is completed, the overall electromechanical coupling coefficient of the multilayer transduction structure will remain unchanged after removing the DC bias voltage.