H03H9/02275

Guided wave devices with selectively loaded piezoelectric layers
11588466 · 2023-02-21 · ·

A micro-electrical-mechanical system (MEMS) guided wave device includes a plurality of electrodes arranged below a piezoelectric layer (e.g., either embedded in a slow wave propagation layer or supported by a suspended portion of the piezoelectric layer) and configured for transduction of a lateral acoustic wave in the piezoelectric layer. The piezoelectric layer permits one or more additions or modifications to be made thereto, such as trimming (thinning) of selective areas, addition of loading materials, sandwiching of piezoelectric layer regions between electrodes to yield capacitive elements or non-linear elastic convolvers, addition of sensing materials, and addition of functional layers providing mixed domain signal processing utility.

Resonator electrode configuration to avoid capacitive feedthrough for vibrating beam accelerometers
11493531 · 2022-11-08 · ·

This disclosure describes techniques of configuring capacitive comb fingers of an accelerometer resonator into discreet electrodes with drive electrodes and at least two sense electrodes. The routing of electrical signals is configured to produce parasitic feedthrough capacitances that are approximately equal. The sense electrodes may be placed on opposite sides of the moving resonator beams such that the changes in capacitance with respect to displacement (e.g. dC/dx) are approximately equal in magnitude and opposite in sign. The arrangement may result in sense currents that are also opposite in sign and result in feedthrough currents of the same sign. The sense outputs from the resonators may be connected to a differential amplifier, such that the difference in output currents may mitigate the effect of the feedthrough currents and cancel parasitic feedthrough capacitance. Parasitic feedthrough capacitance may cause increased accelerometer noise and reduced bias stability.

Micro-electro-mechanical resonators

A tunable non-reciprocal frequency limiter with an asymmetric micro-electro-mechanical resonator has two independent transducer ports. One port has a film stack including a 10 nm hafnium zirconium oxide (HZO) and another port has a film stack including a 120 nm aluminum nitride (AlN) film. These film stacks are deposited on top of 70 nm single crystal silicon substrate applying CMOS compatible fabrication techniques. The asymmetric transducer architecture with dissimilar electromechanical coupling coefficients force the resonator into mechanical nonlinearity on actuation with transducer having larger coupling. A proof-of-concept electrically-coupled channel filter is demonstrated with two such asymmetric resonators at ˜253 MHz with individual Q.sub.res of ˜870 and a non-reciprocal transmission ratio (NTR) ˜16 dB and BW.sub.3 dB of 0.25%.

Multi-frequency guided wave devices and fabrication methods
11476827 · 2022-10-18 · ·

A micro-electrical-mechanical system (MEMS) guided wave device includes a piezoelectric layer including multiple thinned regions of different thicknesses each bounding in part a different recess, different groups of electrodes on or adjacent to different thinned regions and arranged for transduction of lateral acoustic waves of different wavelengths in the different thinned regions, and at least one bonded interface between the piezoelectric layer and a substrate. Optionally, a buffer layer may be intermediately bonded between the piezoelectric layer and the substrate. Methods of producing such devices include locally thinning a piezoelectric layer to define multiple recesses, bonding the piezoelectric layer on or over a substrate layer to cause the recesses to be bounded in part by either the substrate or an optional buffer layer, and defining multiple groups of electrodes on or over the different thinned regions.

Laterally vibrating bulk acoustic wave resonator

A laterally vibrating bulk acoustic wave (LVBAW) resonator includes a piezoelectric plate sandwiched between first and second metal layers. The second metal layer is patterned into an interdigital transducer (IDT) with comb-shaped electrodes having interlocking fingers. The width and pitch of the fingers of the electrodes determine the resonant frequency. A combined thickness of the first and second metal layers and the piezoelectric layer is less than the pitch of the interlocking fingers.

PLATE WAVE DEVICES WITH WAVE CONFINEMENT STRUCTURES AND FABRICATION METHODS
20230134688 · 2023-05-04 ·

A micro-electrical-mechanical system (MEMS) guided wave device includes a single crystal piezoelectric layer and at least one guided wave confinement structure configured to confine a laterally excited wave in the single crystal piezoelectric layer. A bonded interface is provided between the single crystal piezoelectric layer and at least one underlying layer. A multi-frequency device includes first and second groups of electrodes arranged on or in different thickness regions of a single crystal piezoelectric layer, with at least one guided wave confinement structure. Segments of a segmented piezoelectric layer and a segmented layer of electrodes are substantially registered in a device including at least one guided wave confinement structure.

MEMS DEVICE OSCILLATING ABOUT TWO AXES AND HAVING A POSITION DETECTING SYSTEM, IN PARTICULAR OF A PIEZORESISTIVE TYPE

A MEMS device includes a platform carried by a frame via elastic connection elements configured to enable rotation of the platform about a first axis. A bearing structure supports the frame through first and second elastic suspension arms configured to enable rotation of the frame about a second axis transverse to the first axis. The first and second elastic suspension arms are anchored to the bearing structure through respective anchorage portions arranged offset with respect to the second axis. A stress sensor formed by first and second sensor elements respectively arranged on the first and second suspension arms is positioned in proximity of the anchorage portions, on a same side of the second axis, in a symmetrical position with respect to the first axis.

SOLIDLY MOUNTED LAYER THIN FILM DEVICE WITH GROUNDING LAYER
20170288629 · 2017-10-05 ·

An apparatus includes a substrate, a thin film piezoelectric layer, a transducer, and a low resistivity layer. The thin film piezoelectric layer is over the substrate, the transducer includes a number of electrodes in contact with the thin film piezoelectric layer and configured to transduce an acoustic wave in the thin film piezoelectric layer. The low resistivity layer is between at least a portion of the substrate and the thin film piezoelectric layer. By providing the low resistivity layer between at least a portion of the substrate and the thin film piezoelectric layer, a spurious response of the apparatus may be significantly reduced, thereby improving the performance thereof.

Multiplexer, radio-frequency front end circuit, and communication device
11245384 · 2022-02-08 · ·

A first filter of a multiplexer includes a ladder filter structure with a plurality of series resonators and a plurality of parallel resonators. Each resonator is an acoustic wave resonator that includes an InterDigital Transducer (IDT) electrode including a pair of comb-shaped electrodes. A total number of reflection electrode fingers of the reflectors of at least one of the series resonator that is closest to the common terminal among the series resonators and the parallel resonator that is closest to the common terminal is smaller than a total number of reflection electrode fingers of the reflectors of each of a remainder of the resonators.

Method of manufacturing a mechanical resonating structure

Methods are described for constructing a mechanical resonating structure by applying an active layer on a surface of a compensating structure. The compensating structure comprises one or more materials having an adaptive resistance to deform that reduces a variance in a resonating frequency of the mechanical resonating structure, wherein at least the active layer and the compensating structure form a mechanical resonating structure having a plurality of layers of materials A thickness of each of the plurality of layers of materials results in a plurality of thickness ratios therebetween.