An acoustic wave device is disclosed. The acoustic wave device can include a support substrate that includes a first substrate portion, a second substrate portion, and a third substrate portion between the first substrate portion and the second substrate portion. The acoustic wave device can include a piezoelectric layer that includes a first portion over the first substrate portion and a second portion over the second substrate portion. The piezoelectric layer can be arranged such that a region over the third substrate portion is free from the piezoelectric layer. The acoustic wave device can include a filter circuit formed on the first portion of the piezoelectric layer. The acoustic wave device can include a cancelation circuit on the second portion of the piezoelectric layer.

The multiplexer includes a plurality of IDT electrodes on a substrate, an insulating cover located on the substrate so as to configure one or more spaces above the plurality of IDT electrodes, an antenna terminal, transmission terminal, and reception terminal which are all located on the substrate and pass through the cover, and a reinforcing layer which is located on the cover and is made of metal. By the plurality of IDT electrodes, a transmission filter located in a signal path connecting the antenna terminal and the transmission terminal and a receiving filter located in a signal path connecting the antenna terminal and the reception terminal. The reinforcing layer includes a first area part facing the transmission filter and a second area part which faces the receiving filter and is separated from the first area part.

An acoustic wave device is disclosed. The acoustic wave device can include a support substrate that includes a first substrate portion, a second substrate portion, and a third substrate portion between the first substrate portion and the second substrate portion. The acoustic wave device can also include a piezoelectric layer that includes a first portion over the first substrate portion and a second portion over the second substrate portion. The piezoelectric layer can be arranged such that a region over the third substrate portion is free from the piezoelectric layer. The acoustic wave device can also include a first interdigital transducer electrode on the first portion of the piezoelectric layer. The acoustic wave device can further include a second interdigital transducer electrode on the second portion of the piezoelectric layer.

A method of forming an acoustic wave device is disclosed. The method can include providing a structure having a support substrate that includes a first substrate portion, a second substrate portion, and a third substrate portion between the first portion and the second portion, a piezoelectric layer that includes a first portion over the first substrate portion and a second portion over the second substrate portion, a first interdigital transducer electrode on the first portion of the piezoelectric layer, and a second interdigital transducer electrode on the second portion of the piezoelectric layer. the method can also include etching at least a portion of the piezoelectric layer such that a region over the third substrate portion is free from the piezoelectric layer.

A method of manufacturing a packaged acoustic wave component includes forming or providing a device substrate, forming a metal layer over the device substrate, and forming or providing an acoustic wave device and mounting the acoustic wave device over at least a portion of the metal layer. The method also includes forming or providing a cap substrate, and forming or providing a peripheral wall, attaching one end of the peripheral wall to the device substrate so that the peripheral wall surrounds the acoustic wave device, and attaching the cap substrate to an opposite end of the peripheral wall. The method includes forming one or more vias so that the one or more vias extend through the device substrate and are disposed under the metal layer.

A packaged acoustic wave component has a device substrate and a metal layer disposed over the device substrate. An acoustic wave device is disposed over at least a portion of the metal layer so that the metal layer is interposed between the device substrate and at least a portion of the acoustic wave device. A cap substrate is spaced above the device substrate, and peripheral wall that is attached to and extends between the device substrate and the cap substrate, the peripheral wall surrounding the acoustic wave device. One or more vias extend through the device substrate and are disposed under the metal layer.

An acoustic wave device includes first and second acoustic wave elements. The first acoustic wave element is disposed on a piezoelectric substrate, and includes at least one first IDT electrode. The second acoustic wave element is disposed on the piezoelectric substrate, and includes at least one second IDT electrode. The first and second acoustic wave elements are adjacent to each other in the direction of acoustic wave propagation. A diffracting component that diffracts an acoustic wave is disposed between the first IDT electrode and the second IDT electrode. The diffracting component includes a gap that defines and functions as a slit to diffract an acoustic wave.

A filter body includes a serial arm and one or more parallel resonators in a state where they are connected in a ladder shape. The serial arm includes a plurality of serial resonators connected in series to each other. A difference of resonance frequencies among the plurality of serial resonators is smaller than a half of a difference between the resonance frequency and an antiresonance frequency of each serial resonator. The serial arm includes a first divided arm which extends from one side toward the other side in a predetermined direction on the piezoelectric substrate, and a second divided arm which is folded back from the other side of the first divided arm and extends toward the one side. The shield conductor includes a portion which is located between at least one of the serial resonators included in the first divided arm and at least one of the serial resonators included in the second divided arm.

A filter body includes a serial arm and one or more parallel resonators in a state where they are connected in a ladder shape. The serial arm includes a plurality of serial resonators connected in series to each other. A difference of resonance frequencies among the plurality of serial resonators is smaller than a half of a difference between the resonance frequency and an antiresonance frequency of each serial resonator. The serial arm includes a first divided arm which extends from one side toward the other side in a predetermined direction on the piezoelectric substrate, and a second divided arm which is folded back from the other side of the first divided arm and extends toward the one side. The shield conductor includes a portion which is located between at least one of the serial resonators included in the first divided arm and at least one of the serial resonators included in the second divided arm.

An acoustic wave filter device includes a substrate, first and second acoustic impedance layers, a piezoelectric layer, first and second interdigital transducer electrodes, an input terminal, an output terminal, ground terminals, a series arm circuit, and a parallel arm circuits. The first interdigital transducer electrode at least partially overlaps the first acoustic impedance layer in the plan view. The second interdigital transducer electrode at least partially overlaps the second acoustic impedance layer in the plan view. The series arm circuit is provided on a first path connecting the input terminal and the output terminal and includes the first and second interdigital transducer electrodes. A conductive layer in the first acoustic impedance layer and a conductive layer in the second acoustic impedance layer are electrically insulated from each other.