H03H9/0519

CRYSTAL ELEMENT, CRYSTAL DEVICE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING CRYSTAL ELEMENT

A crystal element includes a vibration part, a holding part, an electrode part, and a recess that corresponds to a recess and/or protrusion. The vibration part has a pair of vibration-part main surfaces. The holding part is formed integrally with the vibration part to be connected to an outer edge of vibration part and has a pair of holding-part main surfaces and holding-part side surfaces. The electrode part is provided at the vibration-part main surfaces. The recess is located at the holding-part side surfaces.

Resonator device, resonator module, electronic apparatus, and vehicle

A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members. An angle θ1 formed between the first imaginary line and a second imaginary line passing through the first bonding member and the second bonding member is 100°<θ1<140°.

Crystal element and crystal device
11545957 · 2023-01-03 · ·

Provided is a crystal element that includes: a crystal piece that is in a substantially rectangular shape on a plan view; an excitation electrode part located on both main surfaces of the crystal piece; a connection lead part extended to a first short-side of the crystal piece from the excitation electrode part; a convex part located on both ends of a second short-side of the crystal piece; and a projected part located on both ends of the first short-side of the crystal piece. Further, a concave part is located in the convex part, and a recessed part is located in the projected part.

PIEZOELECTRIC VIBRATION DEVICE AND MANUFACTURING METHOD THEREFOR
20220416760 · 2022-12-29 ·

Metal films for first and second mounting terminals are formed at ends on both sides of a piezoelectric vibration plate across a vibrating portion, and first and second mounting terminals connected to these metal films are formed on outer surfaces of resin films adhered to the piezoelectric vibration plate. In case the metal films for first and second mounting terminals on both sides of the vibrating portion are desirably reduced in size in order to enlarge the vibrating portion, an adequate joining area for mounting purpose is still secured for the first and second mounting terminals formed on the outer surfaces of the resin films.

PRINTING COMPONENTS TO ADHESIVE SUBSTRATE POSTS

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Resonator Device
20230032754 · 2023-02-02 ·

A resonator device includes: a resonator element; a heat generating unit; a first package including a first base at which the resonator element and the heat generating unit are disposed, and a first lid bonded to the first base so as to accommodate the resonator element between the first lid and the first base; and a low emissivity layer that is disposed at an inner surface of the first lid and that has an emissivity lower than an emissivity of the first lid. In addition, a constituent material of the first lid is silicon, and the emissivity of the low emissivity layer at room temperature is less than 0.5.

Doubly Rotated Quartz Crystal Resonators With Reduced Sensitivity to Acceleration
20220345104 · 2022-10-27 ·

A doubts rotated quart/crystal resonator comprises a cantilever-mounted doubts rotated resonating element having a line of geometrical symmetry running from a supported end to a free end which is not perpendicular to the resonating element's crystallographic/axis. A method of manufacturing the crystal resonator comprises cutting a doubly rotated quartz crystal plate with x.sup.I and z.sup.I axes defining the plate's plane into one or more resonating elements at a non-zero degrees in-plane rotation angle in relation to the plate's x.sup.I axis. The resonator has reduced sensitivity to mechanical acceleration.

Method of fabricating a SiC resonator

A method of making a SiC resonator includes forming a layer of an oxide material on a relatively thick wafer of SiC; bonding the layer of oxide material on the relatively thick wafer of SiC to a handle wafer having at least an oxide exterior surface, the resulting bond being substantially free of voids; planarizing the relatively thick wafer of SiC to a desired thickness; forming top and bottom electrodes on the wafer of SiC wafer to define a SiC wafer resonator portion; and forming a trench around the top and bottom electrodes, the tench completely penetrating the planarized wafer of SiC around a majority of a distance surrounding said top and bottom electrodes, except for one or more tether regions of the planarized wafer of SiC which remain physically coupled a remaining portion the SiC wafer resonator portion which defines a frame formed of the planarized wafer of SiC surrounding the SiC wafer resonator portion.

OSCILLATOR, AN ELECTRONIC APPARATUS, AND A VEHICLE
20170373637 · 2017-12-28 · ·

An oscillator includes a first package including a first base, and a first lid bonded to the first base, a first temperature controller housed in the first package, and mounted on the first base, a second temperature controller housed in the first package, and mounted on the first base, and a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit, the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

VIBRATOR DEVICE AND METHOD FOR MANUFACTURING VIBRATOR DEVICE
20230208388 · 2023-06-29 ·

A vibrator device includes: a base having a first surface and a second surface in a front-back relationship with each other; a circuit element located at a first surface side of the base and having a third surface at the first surface side and a fourth surface in a front-back relationship with the third surface; a vibrator element located at a fourth surface side of the circuit element; a first bonding member that bonds the base to the circuit element; a second bonding member that bonds the circuit element to the vibrator element; and a lid bonded to the base so as to form a cavity that accommodates the circuit element and the vibrator element between the lid and the base, in which at least a part of the second bonding member overlaps the first bonding member in a plan view of the circuit element.