A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

A method for packaging chips includes: providing a filter wafer and a plurality of substrates to be packaged, each substrate to be packaged being provided with one or more first pads; flip-chip bonding the substrates to be packaged on the filter wafer; molding the substrates to be packaged to form a molded layer on the substrates to be packaged, the substrates to be packaged, the molded layer, and the filter wafer forming a molded structure, each substrate to be packaged, a portion of the molded layer formed on the substrate to be packaged, and the filter wafer together enclosing a cavity; exposing the first pads out of the molded layer; and cutting the molded structure into a plurality of particle chips.

An electronic component module includes an electronic component, a resin structure, a wiring portion, and a shield portion. The resin structure covers a second main surface and at least a portion of a side surface of the electronic component. The wiring portion is electrically connected to the electronic component. The shield portion includes a first conductor layer and a second conductor layer. The first conductor layer is spaced away from the electronic component between the electronic component and the resin structure, and has electrical conductivity. The second conductor layer is spaced away from the wiring portion between the wiring portion and the resin structure, and has electrical conductivity. In the shield portion, the first conductor layer and the second conductor layer are integrated.

A method for packaging chips includes: providing a filter wafer and a plurality of substrates to be packaged, each substrate to be packaged being provided with one or more first pads; flip-chip bonding the substrates to be packaged on the filter wafer; molding the substrates to be packaged to form a molded layer on the substrates to be packaged, the substrates to be packaged, the molded layer, and the filter wafer forming a molded structure, each substrate to be packaged, a portion of the molded layer formed on the substrate to be packaged, and the filter wafer together enclosing a cavity; exposing the first pads out of the molded layer; and cutting the molded structure into a plurality of particle chips.

A manufacturing method of a mounting structure, the method including a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a first cured layer; a removal step of removing the thermoplastic sheet from the first cured layer; and a coating film formation step of forming a coating film on the first cured layer, after the removal step. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

An elastic wave device includes a plate-shaped elastic wave element and a resin structure including a high elastic modulus resin portion and low elastic modulus resin portions. The low elastic modulus resin portions are provided in regions of side surfaces of an elastic wave element substrate, which extend from end portions at an IDT electrode formation surface side and do not reach a surface at a side opposite to an IDT electrode formation surface, and a remaining resin portion of a portion of the resin structure, which contacts with the side surfaces of the elastic wave element substrate, is the high elastic modulus resin portion.

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.

A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member via bumps, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a sheet having a space maintaining layer; a disposing step of disposing the sheet on the mounting member such that the space maintaining layer faces the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members so as to maintain the space, and to cure the sheet. The bumps are solder bumps. The space maintaining layer after curing has a glass transition temperature of higher than 125° C., and a coefficient of thermal expansion at 125° C. or lower of 20 ppm/K or less.

A component (B) comprising a carrier (TR), on which a functional structure (FS) is covered by a thin-layer covering (DSA) spanning across and resting on the carrier. On a planarization layer arranged above the thin-layer covering (DSA), a wiring level (M1, M2) is realized, which comprises structured conductor paths and which is connected via through-connections to the functional structure (FS).

A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.