A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.

A sensor comprising a resonator structure arranged for resonating along a first plane; and at least one sensing electrode arranged on a second plane parallel to said first plane at a predetermined distance of said resonator structure along a direction normal to said first plane.

A ring gyroscope which comprises a substantially circular and flexible ring which defines a ring plane, one or more primary piezoelectric split transducers configured to drive the ring into resonance oscillation, four or more mass elements which form a symmetrical mass distribution in relation to both a first and a second transversal symmetry axis and to a first and a second diagonal symmetry axis. The ring gyroscope also comprises a suspension structure configured to support the weight of the ring and the mass elements, wherein the suspension structure comprises N outer suspenders, where N is an integer greater than or equal to two, and each outer suspender extends along a ring tangent from a suspension attachment point on the outer edge of the ring to an anchor point.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

System and methods for a hollow-disk radial-contour mode resonator structure. The hollow disk reduces the dynamic mass and stiffness of the structure. Since electromechanical coupling C.sub.x/C.sub.o goes as the reciprocal of mass and stiffness, the hollow disk structure has a considerably stronger electromechanical coupling than a solid one at the same frequency, and thus raises C.sub.x/C.sub.o without excessive gap-scaling. Several embodiments of hollow disk resonators are detailed, including asymmetric and symmetric disk configurations.

A bulk acoustic wave resonator apparatus includes a resonator member having an annulus shape, and at least one anchor structure coupling the resonator member to a substrate. A perimeter of the resonator member is at least partially defined by respective sidewalls that are slanted at an angle relative to a plane defined by a surface of the resonator member. The surface of the resonator member may be defined by a (100) crystal plane, and the angle of the respective sidewalls may be defined by a (111) crystal plane. Related fabrication methods are also discussed.

According to one embodiment, a resonator is disclosed. The resonator includes a vibrator and an attenuation mechanism. The attenuation mechanism selectively attenuates vibration of a spurious mode that is mechanically coupled to a first mode when the vibrator vibrates in the first mode.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.

A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.