A passband filter includes a first and second microelectromechanical resonator system, each including a resonating beam, a drive electrode, and a sense electrode. An AC input signal is coupled to the drive electrode of the first and second microelectromechanical resonator system. A differential-to-single ended amplifier has a first input and second input respectively coupled to the sense electrodes of the first and second microelectromechanical resonator systems. An output of the differential-to-single ended amplifier is an output of the passband filter that provides a bandpass filtered signal of the AC input signal. A DC bias signal is coupled to the resonating beams of the first and second microelectromechanical resonator systems. The first microelectromechanical resonator system exhibits a hardening nonlinear behavior defining an upper stop frequency of the passband and the second microelectromechanical resonator system exhibits a softening nonlinear behavior defining a lower stop frequency of the passband.

A quartz crystal unit comprising a quartz crystal resonator having a base portion, and first and second tuning fork arms connected to the base portion, the base portion having a length less than 0.5 mm and greater than a spaced-apart distance between the first and second tuning fork arms, each of the first and second tuning fork arms having a width less than 0.1 mm and a length less than 1.56 mm, and a plurality of different widths including a first width and a second width greater than the first width, at least one groove being formed in at least one of opposite main surfaces of each of the first and second tuning fork arms so that a length of the at least one groove is within a range of 0.3 mm to 0.79 mm, the quartz crystal resonator being housed in a case, and a lid being connected to the case.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A vibrator is provided that includes a substrate having a major surface defined in width and length directions and one or more electrodes formed at least in a substantial entire region of the major surface of the substrate in the length direction, and that performs, as main vibration, expansion-contraction vibration along the width direction in accordance with a voltage applied to the electrodes. Moreover, a holder surrounds at least a portion of the vibrator; and a holding arm connects the vibrator to the holder. Moreover, the vibrator has a width Wo in the width direction positioned at an end in the length direction and includes, to have a width Wm differing from the width Wo and positioned between a pair of ends opposing in the length direction, a variant portion at least one or more locations that is in a shape recessed or projecting in the width direction.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

Provided are a resonator, a method of manufacturing the resonator, and a strain sensor and a sensor array including the resonator. The resonator is provided to extend in a lengthwise direction from a support. The resonator includes a single crystal material and is provided to extend in a crystal orientation that satisfies at least one from among a Young's modulus and a Poisson's ratio, from among crystal orientations of the single crystal material.

Described herein is using an array of microelectromechanical systems (MEMS) oscillators to produce unique identifiers. At least some of the MEMS oscillators will “couple” or influence each other when exposed to an external stimulus, such that the frequency of the device is not equal to the combination of individual MEMS oscillator frequencies. The frequency of the device provides a unique “fingerprint” that allows the device to be identified with accuracy but is incredibly difficult to copy, meaning the response may be a physical unclonable function (PUF).

Switchable and/or tunable filters, methods of manufacture and design structures are disclosed herein. The method of forming the filters includes forming at least one piezoelectric filter structure comprising a plurality of electrodes formed to be in contact with at least one piezoelectric substrate. The method further includes forming a micro-electro-mechanical structure (MEMS) comprising a MEMS beam in which, upon actuation, the MEMS beam will turn on the at least one piezoelectric filter structure by interleaving electrodes in contact with the piezoelectric substrate or sandwiching the at least one piezoelectric substrate between the electrodes.

A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.