A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

A packaged VCTCXO may include a crystal oscillator configured to output a signal of a particular frequency and a temperature sensor configured to measure an internal temperature of the crystal oscillator. In addition, the packaged VCTCXO may include a microcontroller configured to generate an internal control voltage signal based at least in part on the temperature and an external control voltage received by the packaged VCTCXO. Moreover, the packaged VCTCXO may include a combiner configured to combine an internal control voltage and the external control voltage to generate a control voltage. Further, the control voltage may be supplied to the crystal oscillator to cause the crystal oscillator to generate the signal of the particular frequency.

A packaged VCTCXO may include a crystal oscillator configured to output a signal of a particular frequency and a temperature sensor configured to measure an internal temperature of the crystal oscillator. In addition, the packaged VCTCXO may include a microcontroller configured to generate an internal control voltage signal based at least in part on the temperature and an external control voltage received by the packaged VCTCXO. Moreover, the packaged VCTCXO may include a combiner configured to combine an internal control voltage and the external control voltage to generate a control voltage. Further, the control voltage may be supplied to the crystal oscillator to cause the crystal oscillator to generate the signal of the particular frequency.

Disclosed is a temperature-compensated crystal oscillator based on analog circuit; a closed-loop compensation architecture determines the temperature compensation of a crystal oscillator. The power splitter divides the VCXO's current output signal with frequency f=f.sub.0+Δf into two signals, one signal to output of the TCXO and the other signal is sent to an analog frequency-voltage conversion circuit. According to the frequency of the VCXO's current output signal, the analog frequency-voltage conversion circuit produces a voltage signal V(T), which corresponds to current ambient temperature. The difference between V(T) and a reference voltage signal V.sub.ref is produced and amplified to obtain a compensation voltage signal ΔV through a voltage matching circuit. ΔV is smoothed by a filter, then sent to the voltage control terminal of the VCXO to make the VCXO generate a stable signal with desired frequency f.sub.0, to compensate the frequency of the VCXO's output signal when the ambient temperature is changed.

Disclosed is a temperature-compensated crystal oscillator based on analog circuit; a closed-loop compensation architecture determines the temperature compensation of a crystal oscillator. The power splitter divides the VCXO's current output signal with frequency f=f.sub.0+Δf into two signals, one signal to output of the TCXO and the other signal is sent to an analog frequency-voltage conversion circuit. According to the frequency of the VCXO's current output signal, the analog frequency-voltage conversion circuit produces a voltage signal V(T), which corresponds to current ambient temperature. The difference between V(T) and a reference voltage signal V.sub.ref is produced and amplified to obtain a compensation voltage signal ΔV through a voltage matching circuit. ΔV is smoothed by a filter, then sent to the voltage control terminal of the VCXO to make the VCXO generate a stable signal with desired frequency f.sub.0, to compensate the frequency of the VCXO's output signal when the ambient temperature is changed.

Provided is a semiconductor integrated circuit including an oscillation circuit configured to output an oscillation signal, a heater configured to heat the oscillation circuit, a temperature sensor configured to detect a temperature of the oscillation circuit, and a nonvolatile memory configured to store temperature correction data. The oscillation circuit controls a frequency of the oscillation signal based on an output signal of the temperature sensor and the temperature correction data.

A radio device comprises a radio transceiver, a resonator, a temperature measurement unit, a frequency synthesiser and a processing system. A temperature signal from the temperature measurement unit, representative of a measured temperature of the resonator, is used to determine an estimated frequency offset for the resonator at the measured temperature using a model stored in a memory of the processing system that relates frequency offset to temperature. A periodic signal from the resonator is provided to the frequency synthesizer, which, in dependence on the estimated frequency offset, is used to generate a periodic local signal. The radio transceiver receives a radio signal comprising a periodic component at a received signal frequency. An error value representative of a difference between the received signal frequency and a frequency of the periodic local signal is determined and used to update one or more parameters of the model stored in the memory.

A tracking system for a digital Phase Locked Loop (PLL), the tracking system including a PLL model configured to emulate an actual internal PLL signal, wherein the emulation is based on another internal PLL signal received from the digital PLL and on an estimated analog PLL parameter of the PLL model; and a tracker configured to compare the emulated internal PLL signal with the actual internal PLL signal, and to update the estimated analog PLL parameter according to a minimization algorithm that minimizes a result of the comparison.

A tracking system for a digital Phase Locked Loop (PLL), the tracking system including a PLL model configured to emulate an actual internal PLL signal, wherein the emulation is based on another internal PLL signal received from the digital PLL and on an estimated analog PLL parameter of the PLL model; and a tracker configured to compare the emulated internal PLL signal with the actual internal PLL signal, and to update the estimated analog PLL parameter according to a minimization algorithm that minimizes a result of the comparison.

The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.