H04J3/047

TECHNIQUES FOR ENABLING AND DISABLING OF A SERIALIZER/DESERIALIZER
20230239062 · 2023-07-27 ·

Methods, systems, and devices for techniques for enabling and disabling of a serializer/deserializer are described. In some examples, a system may be configured to identify information to be transmitted by a serializer/deserializer over a communication channel and activate, based on identifying the information to be transmitted, both a transmission component and a reception component of the serializer/deserializer that are coupled with the communication channel. Additionally or alternatively, in some examples, a system may be configured to identify information to be received by a serializer/deserializer over a communication channel and activate, based on identifying the information to be received, both a transmission component and a reception component of the serializer/deserializer that are coupled with the communication channel.

MULTIPLEXER AND SERIALIZER INCLUDING THE SAME
20230006750 · 2023-01-05 ·

A multiplexer selects one of a first to a fourth data signal in response to a first to a fourth pulse. The first to fourth pulses respectively correspond to the first to fourth data signals and sequentially toggle. The multiplexer includes: (1) a NAND gate that receives the first data signal, a fourth complementary data signal that is a complementary signal of the fourth data signal, and the first pulse and outputs a first gate signal and (2) a NOR gate that receives the first data signal, the fourth complementary data signal, and a first complementary pulse that is complementary to the first pulse and outputs a second gate signal. The first data signal corresponds to a rising edge of the first pulse, and the fourth complementary data signal corresponds to a rising edge of the fourth pulse.

CONFIGURABLE MODEM ARCHITECTURE FOR SATELLITE COMMUNICATIONS
20230070366 · 2023-03-09 ·

In some implementations, a communication device, includes a printed circuit board comprising conductors routed to support a plurality of different configurations of modulation and/or demodulation functionality. The printed circuit board can have multiple analog output interfaces and one or more analog input interfaces, multiple digital network interfaces, and sockets for components including a controller, multiple processors, digital-to-analog converters (DACs), and an analog-to-digital converter (ADC). Various processor sockets are interconnected to support the processors in different sockets selectively being used for different functions, e.g., as a modulator, burst processor, channelizer, etc.

TRANSMIT DRIVER ARCHITECTURE WITH A JTAG CONFIGURATION MODE, EXTENDED EQUALIZATION RANGE, AND MULTIPLE POWER SUPPLY DOMAINS
20230155591 · 2023-05-18 ·

A transmit driver architecture with a test mode (e.g., a JTAG configuration mode), extended equalization range, and/or multiple power supply domains. One example transmit driver circuit generally includes one or more driver unit cells having a differential input node pair configured to receive an input data signal and having a differential output node pair configured to output an output data signal; a plurality of power switches coupled between the differential output node pair and one or more power supply rails; a first set of one or more drivers coupled between a first test node of a differential test data path and a first output node of the differential output node pair; and a second set of one or more drivers coupled between a second test node of the differential test data path and a second output node of the differential output node pair.

Multi-chip module with a high-rate interface

A multi-chip module (MCM) may include a substrate, and first and second physical-layer (PHY) chips mounted on the substrate. In some implementations, the first PHY chip includes a multiplexer and a PHY circuit. The multiplexer is configured to receive a multiplexed data stream from a media access control (MAC) device, to demultiplex the multiplexed data stream into first and second data streams, to output the first data stream to the PHY circuit, and to output the second data stream to the second PHY chip. In some implementations, the first PHY includes a router and a PHY circuit. The router is configured to receive a plurality of data packets from a MAC device, to route one or more of the data packets having a first address to the PHY circuit, and to route one or more of the data packets having a second address to the second PHY chip.

OUTPUT SIGNAL GENERATION DEVICE, CONTROL CIRCUIT, STORAGE MEDIUM, AND PHASE CORRECTION METHOD
20230188236 · 2023-06-15 · ·

An output signal generation device includes: two or more signal output blocks that each include two or more serial output circuits and a signal multiplex unit, the serial output circuits controlling amplitudes of data signals having different delay times and each outputting a first serial signal, the signal multiplex unit electrically multiplexing the first serial signals outputted from the two or more serial output circuits, and output a second serial signal obtained by electrical multiplex of the signal multiplex unit; and a phase correction unit that controls a phase of the second serial signal outputted from the two or more signal output blocks by changing the amplitude of the first serial signal outputted from the serial output circuit.

SEMICONDUCTOR DEVICE

A semiconductor device includes: a data sampler configured to receive a data signal having a first frequency and to sample the data signal with a clock signal having a second frequency, higher than the first frequency, to output data for a time corresponding to a unit interval of the data signal; an error sampler configured to sample the data signal with an error clock signal having the second frequency and a phase, different from a phase of the clock signal, to output a plurality of pieces of error data for the time corresponding to the unit interval; and an eye-opening monitor (EOM) circuit configured to compare the data with each of the plurality of pieces of error data to obtain an eye diagram of the data signal in the unit interval.

HIGH SPEED SERIALIZER USING QUADRATURE CLOCKS
20170310412 · 2017-10-26 ·

Techniques efficiently serialize multiple data streams using quadrature clocks. Serializer employs first, second, third, and fourth clock signals. Serializer receives multiple data streams via registers, with each of four paths comprising a register, buffer, and switch, with registers of first and fourth paths associated with third clock signal, and registers of second and third paths associated with first clock signal, and with switches of first and fourth paths associated with first clock signal, and switches of second and third paths associated with third clock signal. Switches of first and second paths transfer respective data bits to fifth switch via another buffer, wherein fifth switch is associated with a delayed second clock signal of a time delay component (TDC). Switches of third and fourth paths transfer respective data bits to sixth switch via another buffer, wherein sixth switch is associated with a delayed fourth clock signal of TDC.

Interference-Immunized Multiplexer

A multiplexer comprises: an output circuit comprising a multiplexer output; and a first buffer coupled to the output circuit and comprising: a first selection input configured to receive a first selection signal; a first logical input configured to receive a first logical input signal; and a first ground; wherein the multiplexer is configured to: couple the first logical input to the multiplexer output when the first selection signal is a first value; and couple the first logical input to the first ground when the first selection signal is a second value. A method comprises: receiving a selection signal and a first logical input signal; coupling a first logical input to a multiplexer output when the selection signal is a first value; and coupling the first logical input to a ground when the selection signal is a second value.

Single-chip multi-domain galvanic isolation device and method

An integrated circuit, including: at least three integrated circuit portions mutually spaced on a single electrically insulating die, the integrated circuit portions being mutually galvanically isolated; and signal coupling structures on the die to allow communication of signals between the integrated circuit portions while maintaining the galvanic isolation therebetween.