A solid-state imaging device according to an embodiment includes a photoelectric conversion unit, a charge transfer unit configured to transfer a charge accumulated in the photoelectric conversion unit, a first charge modulation unit to which the charge is transferred from the photoelectric conversion unit by the charge transfer unit, a second charge modulation unit, a charge accumulation unit configured to accumulate a charge overflowing from the photoelectric conversion unit during an accumulation period, a modulation switching unit configured to couple or divide the first charge modulation unit and the second charge modulation unit, and a capacitance connection unit configured to couple or divide the second charge modulation unit and the charge accumulation unit, in which, in a state of the first charge modulation unit alone and a state where the first charge modulation unit and the second charge modulation unit are coupled by the modulation switching unit, the charge accumulated in the photoelectric conversion unit is modulated into a voltage signal, and voltage signals having different conversion efficiencies are continuously read, and the charge accumulated in the photoelectric conversion unit and the charge overflowing from the photoelectric conversion unit during the accumulation period are modulated into a voltage signal and the voltage signal is read in a capacitance obtained by coupling the first charge modulation unit, the second charge modulation unit, and the charge accumulation unit.

A CMOS image sensor with an imaging array of pixels containing selected pixels wherein illumination is blocked and light scattered from an adjacent pixel is collected. The signal from the selected pixels is resilient against saturation and thereby contributes to increased dynamic range of the imaging signal. The image sensor may be incorporated within a digital camera.

A CMOS image sensor with an imaging array of pixels containing selected pixels wherein illumination is blocked and light scattered from an adjacent pixel is collected. The signal from the selected pixels is resilient against saturation and thereby contributes to increased dynamic range of the imaging signal. The image sensor may be incorporated within a digital camera.

A solid state image sensor includes a pixel array, as well as charge-to-voltage converters, reset gates, and amplifiers each shared by a plurality of pixels in the array. The voltage level of the reset gate power supply is set higher than the voltage level of the amplifier power supply. Additionally, charge overflowing from photodetectors in the pixels may be discarded into the charge-to-voltage converters. The image sensor may also include a row scanner configured such that, while scanning a row in the pixel array to read out signals therefrom, the row scanner resets the charge in the photodetectors of the pixels sharing a charge-to-voltage converter with pixels on the readout row. The charge reset is conducted simultaneously with or prior to reading out the signals from the pixels on the readout row.

A multifunctional sky camera system and techniques for the use thereof for total sky imaging and spectral irradiance/radiance measurement are provided. In one aspect, a sky camera system is provided. The sky camera system includes an objective lens having a field of view of greater than about 170 degrees; a spatial light modulator at an image plane of the objective lens, wherein the spatial light modulator is configured to attenuate light from objects in images captured by the objective lens; a semiconductor image sensor; and one or more relay lens configured to project the images from the spatial light modulator to the semiconductor image sensor. Techniques for use of the one or more of the sky camera systems for optical flow based cloud tracking and three-dimensional cloud analysis are also provided.

According to the present disclosure, an imaging element may include: a substrate or a well; a pinned photodiode disposed on the substrate; a floating diffusion region disposed on the substrate or the well; a first transfer gate transistor disposed between the pinned photodiode and the floating diffusion region a photodiode signal charge generated by the pinned photodiode to the floating diffusion region; one or more gate-controlled storages disposed on the substrate and storing a signal charge generated by the pinned photodiode as a storage signal charge; a storage-controlling gate electrode disposed adjacent to the gate-controlled storage; an overflow path disposed between the pinned photodiode and the gate-controlled storage and transferring the storage signal charge from the pinned photodiode to the gate-controlled storage; and a detecting node connected to the floating diffusion region, wherein the photodiode signal charge and the storage signal charge can be read at the detecting node.

An imaging element according to an embodiment includes: a unit pixel including a first pixel having a first photoelectric conversion element and including a second pixel having a second photoelectric conversion element, the second pixel being arranged adjacent to the first pixel; and an accumulation portion that accumulates a charge generated by the second photoelectric conversion element and converts the accumulated charge into a voltage. The accumulation portion is disposed at a boundary between the unit pixel and another unit pixel adjacent to the unit pixel.

An image sensor and an operating method of the image sensor may include a pixel array including a plurality of pixels; a controller configured to generate a pre-shutter driving signal associated with a pre-shutter operation, the pre-shutter driving signal generated before a first shutter operation and a first read operation corresponding to photographing a first frame is performed; a row driver configured to drive first control signals to the pixel array based on the pre-shutter driving signal, the first control signals associated with the pre-shutter operation; and the pixel array is configured to perform the pre-shutter operation in response to the first control signals, wherein levels of the first control signals correspond to levels of second control signals, the second control signals associated with the first read operation.

The present disclosure relates to a method and system for imaging a scene. The method includes generating a shutter pattern and applying the shutter pattern to a photodetector array. The system includes a sensor architecture in three dimensions, where elements of the sensor architecture are stacked in two or more layers. Some elements of the sensor architecture include a photodetector array, register array, a generator to generate shutter patterns, readout circuitry, and an ISP.

A solid-state imaging apparatus includes a pixel circuit and a negative feedback circuit. The pixel circuit includes: a photodiode; a charge storage that holds a signal charge generated by the photodiode; an amplification transistor that outputs a pixel signal corresponding to the signal charge in the charge storage; a first reset transistor that resets the charge storage; a first storage capacitive element for holding a signal charge; and a first transistor that controls the connection between the charge storage and the first storage capacitive element. The negative feedback circuit negatively feeds back a feedback signal corresponding to a reset output of the amplification transistor to the charge storage via the first reset transistor.