H04N25/626

IMAGE CAPTURE USING RADIATION-SENSITIVE ELEMENTS HAVING A MEMORY EFFECT
20230010469 · 2023-01-12 ·

Disclosed is a method for capturing images that makes it possible to correct at least partially a memory effect of sensitive elements of a matrix used to capture the images. A corrected image is formed by subtracting, from a captured new raw image, a part of a prior raw image that was captured before the new raw image. The method is particularly suitable for sensitive elements with a first-order transfer function with respect to time, such as bolometers or microbolometers. Correction of the memory effect makes it possible to improve the transfer function and/or reduce a tail effect that is present in the images when scene elements move.

PIXEL SENSOR SYSTEM

The present invention relates to a high-speed imaging sensor system in which single-photon detectors are provided in an architecture adapted for high-speed processing of the output of the detectors with high reliability to filter out false positives.

PIXEL SENSOR SYSTEM

The present invention relates to a high-speed imaging sensor system in which single-photon detectors are provided in an architecture adapted for high-speed processing of the output of the detectors with high reliability to filter out false positives.

BURN-IN MITIGATION AND ASSOCIATED IMAGING SYSTEMS AND METHODS
20230058486 · 2023-02-23 ·

Techniques for facilitating burn-in mitigation and associated imaging systems and methods are provided. In one example, a method applying a bias signal to a sensor array of an imaging device to increase a temperature of the sensor array to perform burn-in mitigation. The method further includes reducing the temperature of the sensor array. The method further includes determining whether a burn-in is present in the sensor array. Related systems and devices are also provided.

Solid-state imaging device and method of operating the same, and electronic apparatus and method of operating the same

A solid-state imaging device includes a plurality of pixels in a two-dimensional array. Each pixel includes a photoelectric conversion element that converts incident light into electric charge, and a charge holding element that receives the electric charge from the photoelectric conversion element, and transfers the electric charge to a corresponding floating diffusion. The charge holding element further includes a plurality of electrodes.

Image sensors having dielectric relaxation correction circuitry

Some image sensors include pixels with capacitors. The capacitor may be used to store charge in the imaging pixel before readout. The capacitor may be a metal-insulator-metal (MIM) capacitor that is susceptible to dielectric relaxation. Dielectric relaxation may cause lag in the signal on the capacitor that impacts the signal on the capacitor during sampling. The image sensor may include dielectric relaxation correction circuitry that leverages the linear relationship between voltage stress and lag signal to correct for dielectric relaxation. The image sensor may include shielded pixels that operate with a similar timing scheme as the imaging pixels in the active array. Measured lag signals from the shielded pixels may be used to correct imaging data.

BEAM DETECTION WITH CONTINUOUS DETECTOR READOUT
20170374295 · 2017-12-28 ·

A method of operating a DR detector including sequentially capturing image frames in the detector that include at least one dark image. The dark image is stored and a statistical measure for a subset of pixels in a captured image frame is compared with the same statistical measure of a subset of pixels in the stored dark image to detect an x-ray beam impacting the detector. An x-ray beam-on condition is indicated if a sufficient difference in intensity between the pixel subsets is detected. At least one more image frame is captured in the detector after detecting the x-ray beam. The current captured image and the at least one more image frame are added and the dark image is subtracted to form the exposed radiographic image.

IMAGING DEVICE AND IMAGING SYSTEM

Provided is an imaging device that includes a plurality of pixels, each of the plurality of pixels including a photoelectric conversion unit configured to accumulate charges generated by an incident light, a first holding unit and a second holding unit configured to hold the charges, an amplification unit configured to output a signal based on the charges, a first transfer switch provided between the photoelectric conversion unit and the first holding unit, a second transfer switch provided between the photoelectric conversion unit and the second holding unit, a third transfer switch provided between the first holding unit and the amplification unit, and a fourth transfer switch provided between the second holding unit and the amplification unit, and outputs a signal including a signal based on actual signal charges and a signal including a signal based on false signal charges.

Global shutter pixel with hybrid transfer storage gate-storage diode storage node
09843754 · 2017-12-12 · ·

An image sensor pixel having a hybrid transfer storage gate-storage diode storage node is disclosed herein. An example image sensor includes a photodiode, a storage diode, a transfer gate, and a buried storage well. The photodiode, storage diode, and buried storage well are all disposed in a semiconductor material. The transfer storage gate may be disposed on a surface of the semiconductor material between the photodiode and the storage diode. Further, the buried storage well may be disposed under the storage diode and partially under the transfer storage gate. Additionally, a length of the transfer storage gate and a length of the storage diode may be equal, and the storage diode may passivate a surface of the semiconductor material between the transfer storage gate and an output gate.

SOLID-STATE IMAGING ELEMENT
20230187469 · 2023-06-15 ·

Provided is a solid-state imaging element with which it is possible to minimize crosstalk between different pixel columns while suppressing a decrease in quantum efficiency of a photoelectric conversion unit due to a pixel separating section. The solid-state imaging element includes a plurality of pixels arranged in a two-dimensional matrix in the X direction and the Y direction and including a photoelectric conversion unit (N-type semiconductor thin film) containing a compound semiconductor. In addition, the solid-state imaging element includes a pixel separating section disposed only at a pixel boundary extending in the X direction.