A solid-state imaging device includes a plurality of pixels in a two-dimensional array. Each pixel includes a photoelectric conversion element that converts incident light into electric charge, and a charge holding element that receives the electric charge from the photoelectric conversion element, and transfers the electric charge to a corresponding floating diffusion. The charge holding element further includes a plurality of electrodes.

A camera agnostic core monitor for an enhanced flight vision system (EFVS) is disclosed. In embodiments, a structured light projector (SLP) generates and projects a precise geometric pattern or other like artifact, which is reflected by collimating elements into the EFVS optical path. Within the optical path, the EFVS focal plane array is illuminated by, and detects, the projected artifacts within the scene imagery captured for display by the EFVS. Image processors assess the presentation of the detected artifacts (e.g., position/orientation relative to the expected presentation of the detected artifact within the scene imagery) to verify that the displayed EFVS imagery is not misleading.

Imagers and associated devices and systems are disclosed herein. In one embodiment, an imager includes a pixel array and control circuitry operably coupled to the pixel array. The pixel array includes an imaging pixel configured to produce a reset signal and a non-imaging pixel configured to produce a nominal reset signal. The control circuity is configured to produce an output signal based at least in part on one of (a) the nominal reset signal when distortion at the imaging pixel exceeds a threshold and (b) the reset signal when distortion does not exceed the threshold.

A method of operating a DR detector including sequentially capturing image frames in the detector that include at least one dark image. The dark image is stored and a statistical measure for a subset of pixels in a captured image frame is compared with the same statistical measure of a subset of pixels in the stored dark image to detect an x-ray beam impacting the detector. An x-ray beam-on condition is indicated if a sufficient difference in intensity between the pixel subsets is detected. At least one more image frame is captured in the detector after detecting the x-ray beam. The current captured image and the at least one more image frame are added and the dark image is subtracted to form the exposed radiographic image.

The invention concerns a structure of a CMOS active pixel, comprising a semi-conductive substrate (1) of a first type, at least one first photodiode operating in photovoltaic mode comprising a photovoltaic conversion area (2) defined by a doped area of a second type forming a PN junction with the substrate, said first photodiode re-emitting photoelectric charge carriers collected by the PN junction during the exposure of said first photodiode to a light, at least one second photodiode operating in integration mode and reverse-biased, said second photodiode comprising a charge accumulation area (3) defined by a doped area of the second type forming a PN junction with the substrate, said charge accumulation area being exposed to the charge carriers from the photovoltaic conversion area (2) in order to accumulate such charge carriers.

An image sensor pixel may include a photodiode, a charge storage region, a floating diffusion node, and a capacitor. A first transistor may be coupled between the photodiode and the charge storage region. A second transistor may be coupled between the charge storage region and the capacitor. The photodiode may generate image signals corresponding to incident light. Multiple image signals may be summed at the charge storage region. The second transistor may determine a portion of the image signal that may be sent to the capacitor for storage. The portion of the image signal that is sent to the capacitor may be a low gain signal. A remaining portion of the image signal may be a high gain signal. The image sensor pixel may also include readout circuitry that is configured to readout low and high gain signals stored at the floating diffusion node in a double-sampling readout operation.

Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

An imaging apparatus with logarithmic characteristics includes: a photodiode that receives light; a well tap unit that fixes the potential of an N-type region of the photodiode; and a resetting unit that resets the photodiode, a P-type region of the photodiode outputting a voltage signal equivalent to a photocurrent subjected to logarithmic compression. The first potential to be supplied to the well tap unit is made lower than the second potential to be supplied to the resetting unit, so that the capacitance formed with the PN junction of the photodiode is charged when the resetting unit performs a reset operation. The present technology can be applied to unit pixels having logarithmic characteristics.

Provided is an imaging device that includes a plurality of pixels, each of the plurality of pixels including a photoelectric conversion unit configured to accumulate charges generated by an incident light, a first holding unit and a second holding unit configured to hold the charges, an amplification unit configured to output a signal based on the charges, a first transfer switch provided between the photoelectric conversion unit and the first holding unit, a second transfer switch provided between the photoelectric conversion unit and the second holding unit, a third transfer switch provided between the first holding unit and the amplification unit, and a fourth transfer switch provided between the second holding unit and the amplification unit, and outputs a signal including a signal based on actual signal charges and a signal including a signal based on false signal charges.

An image sensor pixel having a hybrid transfer storage gate-storage diode storage node is disclosed herein. An example image sensor includes a photodiode, a storage diode, a transfer gate, and a buried storage well. The photodiode, storage diode, and buried storage well are all disposed in a semiconductor material. The transfer storage gate may be disposed on a surface of the semiconductor material between the photodiode and the storage diode. Further, the buried storage well may be disposed under the storage diode and partially under the transfer storage gate. Additionally, a length of the transfer storage gate and a length of the storage diode may be equal, and the storage diode may passivate a surface of the semiconductor material between the transfer storage gate and an output gate.