A speaker (20) includes a cabinet (21) extending along a longitudinal axis (X) between a first and a second end (21a, 21b). The cabinet (21) includes a side wall surrounding an internal volume and provided with an opening to place the internal volume in communication with an outside environment. The speaker (20) also includes a sound transducer (22) and a connection circuit (23) configured to receive a signal and to transmit the signal to the sound transducer (22). The speaker (20) also includes a first and a second passive resonator (24, 25) each including a vibrating panel (24a, 25a). The vibrating panels (24a, 25a) are positioned in the internal volume, with respective first faces facing each other and respective second faces opposite the first faces. The internal volume includes a first, closed air volume (V1) delimited by an inside surface of the cabinet (21) and by the second faces of the vibrating panels (24a, 25a). The internal volume also includes a second air volume (V2), delimited by the first faces of the vibrating panels (24a, 25a) and open towards the outside environment through the opening.

Motor vehicle with sound system A motor vehicle (10) defining a longitudinal axis (X), a front side, and a median (P) plane including the longitudinal axis (X) and which is vertical, and comprising: a structure (14) comprising a bulkhead (34), at least one front seat (26A) for a driver, and a floor covering (18), the bulkhead and the floor covering partially delimiting a passenger compartment (35), and a sound system (12) including at least one speaker enclosure (42) rigidly attached to the structure, the speaker enclosure comprising at least one woofer (50A) and being located close to the median plane (P): either longitudinally between the bulkhead and a front edge of the front seat, or longitudinally astride a front zone (40A) of the passenger compartment intended to receive the driver and a rear zone (40B) of the passenger compartment intended to receive one or more rear passengers of the motor vehicle.

This disclosure presents a connector assembly for providing a waterproof connection to a case for an electronic device. The connector assembly includes a connector body, an electrical cable, and an electrical conductor. The electrical conductor is electrically connected to the electrical cable and electrically engages the installed electronic device to convey at least one of data and power between the installed electronic device and the electrical cable. The connector assembly also includes an outer sleeve configured to freely rotate around the connector body and further configured to removably connect the connector assembly to the case. The outer sleeve includes a securing region to removably secure the connector assembly to the case, an inner gasket to seal an inner sealing interface of the outer sleeve with the connector body, and an outer gasket positioned to seal an outer sealing interface of the outer sleeve with the case.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

Provided is a speaker device, including: a speaker unit; and a speaker cabinet to which the speaker unit is mounted. The speaker cabinet includes an outer plate; and a partition plate arranged between the outer plate and the speaker unit so as to be opposed to the outer plate. The outer plate and the partition plate form a bass reflex port communicating with a rear space of the speaker unit, and the partition plate includes a leading end surface inclined so as to gradually increase a distance from the outer plate as extending forward.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

To provide an excellent sound output device which is worn on an ear of a user and used. The sound output device includes a sound generation part and a holding part that has an opening portion and holds the sound generation part in the vicinity of an entrance of an ear canal of a user. The holding part includes a ring body having the opening portion, and a housing of the sound generation part is integrated with a part of the ring body. The sound generation part includes a sound generation element having a dynamic type driver, and has a hollow exhaust part joining with a rear surface of the housing of the sound generation part. The exhaust part extends from a rear surface side of the housing across an intertragic notch and has an exhaust hole outside an auricle.

A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

A microphone apparatus including: a casing; a composite material located within the casing, the composite material including at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted by an acoustic wave, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.

A display apparatus may include a rear cover at a rear surface of a display module and a vibration generating module at a rear region of the rear cover. The vibration generating module may be configured to output sound in a forward direction and a lateral direction of the display module.