An electronic device is provided. The electronic device includes a first frame including a first surface, a second surface facing the direction opposite to that of the first surface, and a side surface encompassing the space between the first surface and the second surface, a guide path which is formed in the space of the first frame and which includes, from the side surface toward the space, an external environment connection hole formed at a specified depth, a first through-hole formed from the second surface up to the external environment connection hole, and a second through-hole formed at a location apart from the first through-hole so as to be formed from the first surface up to the second surface, and a sealing member including a sound module disposed on the first surface so as to correspond to the second through-hole, and a recess which is disposed on the second surface and connects the first through-hole to the second through-hole.

A speaker and an electronic device are provided. The speaker includes a counterweight body, and a lower shell, a middle shell, an electric vibration plate, and a dome where the lower shell, the middle shell, and the electric vibration plate are matched to form an accommodating cavity, and the counterweight body is disposed in the accommodating cavity and is connected to a first surface of the electric vibration plate; the dome is disposed on a second surface of the electric vibration plate away from the counterweight body; and when a voltage is applied to the electric vibration plate, the electric vibration plate drives the dome to move.

A headset of the present disclosure includes a housing 1 worn on user's ears, an ear-canal insertion portion 10 with a cylindrical shape provided at an ear-canal side of the housing 1 as a part of the housing 1, a driver 4 for outputting a signal provided inside the housing 1, and a microphone 5 provided at the back of a signal outputting surface of the housing 1 to acquire a response signal from a front of the driver 4.

Disclosed is an electronic device including a structure that stably supports a flexible printed circuit board on which a microphone module is disposed inside the electronic device, thereby improving the sealing between the microphone module and the camera housing.

Embodiments provide an apparatus for sound conversion, wherein the apparatus includes a sound channel and a sound transducer coupled to the sound channel, wherein the apparatus comprises an acoustic low-pass filter arranged in the sound channel.

A device includes a housing, an acoustic sensor disposed within the housing, the acoustic sensor comprising a microelectrornechanical (MEMS) transducer, a first port in the housing establishing a first acoustic path for air flow to the MEMS transducer, and a second port in the housing establishing a second acoustic path for air flow to the MEMS transducer. The first and second acoustic paths have an equal path length.

A microphone enclosure for a vehicle exterior component includes a housing, and a microphone disposed within the housing. The housing also includes a first outer portion defining a sound channel for conveying sound to the microphone. The microphone enclosure includes a membrane of elastomeric material, such as silicone, disposed over the sound channel and configured to prevent contaminants, such as moisture and dust, from entering the sound channel. The sound channel has at least one dimension configured to provide a specific frequency response or acoustic sensitivity. A protective mesh may be disposed below the first membrane and configured to limit deflection of the first membrane. The housing includes an outer surface defining an aperture and a passageway providing auditory communication between the aperture and the microphone. In some embodiments, the passageway is configured as a tortuous path impeding straight-line access from the aperture to the membrane.

A transducer arrangement for head- or earphones comprises a sound steering unit, which comprises a frontal chamber and at least one sound canal. Each of the at least one sound canal comprises at least one internal opening towards the frontal chamber and an external open end for directing sound towards the outside of the transducer arrangement. The transducer arrangement further comprises a rear chamber and at least one loudspeaker arranged between the frontal chamber and the rear chamber.

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).

A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.