A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Provided are a hierarchical porous ZSM-5 molecular sieve and a preparation method therefor. The molecular sieve comprises micropores and mesopores, wherein the pore size of the micropores is 0.5-1.8 nm, the pore size of the mesopores is 4-30 nm, and the particle size is 0.3-4 μm. The molecular sieve is prepared by using a hemicellulose as a hard template agent. Also provided are a hierarchical porous HZSM-5 molecular sieve, which is obtained by subjecting the ZSM-5 molecular sieve to ion exchange with an ammonium chloride solution, and the use of ZSM-5 and HZSM-5 molecular sieves in the preparation of a sound-absorbing material, the sound-absorbing material made from the molecular sieve, and a speaker loaded with the sound-absorbing material. After being prepared into sound-absorbing particles, the molecular sieve can more effectively improve the absorption and desorption performances of air molecules, improve the low-frequency response of a speaker, improve the acoustic performance of the speaker, and improve the acoustic improvement stability of sound-absorbing particles in the speaker.

An outer structure of a magnetic circuit is held inside a holder recess of a magnetic circuit holder of a frame. A pressing portion is screw-fixed to a mounting surface of the magnetic circuit holder. Elastically deformable pressing arms are formed at the pressing portion, and the pressing arms press a restriction surface of the outer structure of the magnetic circuit.

A speaker module includes a casing and a speaker unit. The casing has a sound outlet. The speaker unit is arranged in the casing, the speaker unit and the sound outlet are arranged along a transverse axis, and the speaker unit includes a bearing base, a first speaker assembly, and a second speaker assembly. The first and second speaker assemblies are disposed on the bearing base. The first speaker assembly and the second speaker assembly are symmetrical relative to the bearing base. A first sound cavity is formed between the casing and the first speaker assembly, a second sound cavity is formed between the casing and the second speaker assembly, the first sound cavity and the second sound cavity are communicated with the sound outlet, and the first sound cavity and the second sound cavity have the same size and are symmetrical relative to the bearing base.

Electrical equipment comprising a cover, a circuit board, and a heatsink arranged to dissipate heat produced by the circuit board outwards from the electrical equipment, the heatsink comprising at least one free fin and at least one fastener fin, the electrical equipment being such that, when the electrical equipment is assembled, the free fin(s) extend(s) outwards from the electrical equipment without being covered by the cover, and the cover is snap-fastened to the fastener fin(s).

In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.

Disclosed in the present disclosure are a sound production apparatus and an electronic device. The sound production apparatus comprises a holder, a vibration unit, an elastic member, and a damping member, wherein the elastic member connects the holder and the vibration unit, and the damping member is disposed on the elastic member. The technical solution of the present disclosure aims at preventing the elastic member from resonating with the vibration unit, thereby ensuring the vibration trajectory of the vibration unit, and ensuring the operation stability of the sound production apparatus.

A modular headphone system that can afford the wearer configurable choices of hearing protection and quality sound delivery for music and programming is provided. In an embodiment, a modular headphone includes a headband and an earpiece mounted to the headband. The earpiece comprises a can comprising a speaker, the can secured to the headband. A removable and replaceable music ear cup is removably mountable to the can to overlie the speaker. A removable and replaceable hearing protection/sound amplification (HP/amp) ear cup is removably mountable to the can to overlie the speaker.

A speaker system includes a first driver unit, a second driver unit and a cylinder case. The first driver unit and the second driver unit are disposed face to face with the same axial line. The axial line of the first driver unit and the axial line of the second driver unit forms a coaxial axial line or parallel axial lines. The cylinder case is hollow. The first driver unit and the second driver unit are disposed inside the cylinder case and contacts the inner wall of the cylinder case so that the central axial line of the cylinder case is parallel to the coaxial axial line or the parallel axial lines. A speak device includes a plurality of speaker systems. By the aforementioned configuration, even driver units may be disposed in a common cavity.

The present invention discloses a sound absorption material including an organic frame material; a binder; a thickener; and a plurality of sound absorption grains attached to the organic frame material via the binder, having a grain size in a range of 10-100 μm. The stability and the sound absorption performance of the sound absorption material have been effectively improved.