A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

A speaker diaphragm includes a first lamination region and a second lamination region. In the first lamination region, a plurality of layers are laminated in a thickness direction of the speaker diaphragm. In the second lamination region, a plurality of layers different in number from the plurality of layers in the first lamination region are laminated. The second lamination region is different from first lamination region in average density.

A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A method for manufacturing a loudspeaker vibrating membrane with hard and elastic soft properties, comprising: (a) adhering a curable polymer to all areas on the outer surface of a base material; (b) drying the curable polymer to form a hard structure; (c) forming a loudspeaker vibrating membrane; and (d) separating the loudspeaker vibrating membrane from the base material. The method further comprises the following steps between steps (b) and (c) or steps (c) and (d), or after step (d): (e) adhering an elastic soft polymer to all or partial areas on the outer surface of the hard structure; and (f) drying the elastic soft polymer to form an elastic soft structure covering all or partial areas on the outer surface of the hard structure. In the present invention, the hardness and elastic coefficient of the loudspeaker vibrating membrane can be adjusted by the hard structure and the elastic soft structure.

A MEMS microphone includes a substrate, a diaphragm disposed over the substrate to cover the cavity, the diaphragm defining an air gap together with the back plate, and the diaphragm being spaced apart from the substrate, a back plate disposed over the diaphragm and in the vibration area, an upper insulation layer to cover the back plate, a plurality of chamber portions provided in the supporting area, a lower insulation layer provided under the upper insulation layer and on the substrate, and an intermediate insulation layer provided between the lower insulation layer and the upper insulation layer and disposed further from the vibration area than the chamber portions.

In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer are removed.

A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

An acoustic transducer (30), comprising: a support structure (36); an active assembly comprising a base plate (32) supported by the support structure (36) and a piezoelectric body (34) supported by the base plate (32); and a passive vibrator (38) supported by the support structure (36) and coupled via the support structure (36) to the active assembly (32, 34) so that vibration of the active assembly (32, 34) drives the passive vibrator (38). The active assembly (32, 34) and the passive vibrator (38) have the same resonant frequency.

A piezoelectric microelectromechanical systems (MEMS) microphone is provided comprising a substrate including walls defining a cavity and at least one of the walls defining an anchor region, a piezoelectric film layer supported by the substrate at the anchor region such that the piezoelectric film layer is cantilevered, the piezoelectric film layer being formed to introduce differential stress between a front surface of the piezoelectric film layer oriented away from the cavity and a back surface of the piezoelectric film layer oriented towards the cavity such that the piezoelectric film layer is bent into the cavity, and an electrode disposed over the piezoelectric film layer and adjacent the anchor region. A method of manufacturing such a MEMS microphone is also provided.