This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

An acoustic receiver includes a first receiver subassembly having bottom housing plate with at least a portion of a motor fastened thereto, and a second receiver subassembly having a closed-ended housing wall with at least one open end that is fastened to the bottom housing plate. A method of making and assembling the components is also described.

This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.

This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

An electrodynamic transducer having a coil, a membrane, and a plate is disclosed, wherein the transducer is adapted to generate a sound pressure level in the human-audible acoustic range and the ultrasonic range so that the transducer may be used as a speaker and an ultrasonic proximity sensor. The transducer may be adapted to generate a sound pressure level above about 88 dB between 20 kHz and 70 kHz. The plate may include a structural rigidity increasing feature such as a domed portion or a population of ribs, which may increase the generated sound pressure level in the ultrasonic range. The transducer may also include a front resonator which may be used to further tune and/or increase the generated sound pressure level in the ultrasonic range.

The application describes MEMS transducer structures comprising a membrane structure having a flexible membrane layer and at least one electrode layer. The electrode layer is spaced from the flexible membrane layer such that at least one air volume extends between the material of the electrode layer and the membrane layer. The electrode layer is supported relative to the flexible membrane by means of a support structure which extends between the first electrode layer and the flexible membrane layer.

The present invention discloses a speaker module. The speaker module comprises an inner cavity defined by a shell, and a first induction coil. A single speaker piece is provided in the inner cavity of the shell, the first induction coil is configured to be electrically connected with a terminal device, and a second induction coil, which corresponds to the first induction coil and is configured to be electrically connected with a voice coil in the single speaker piece, is also provided on the shell. According to the speaker module, an output end of a complete machine and the voice coil are conducted through the first induction coil and the second induction coil; and by the adoption of such a structure, the space of the module can be greatly saved, and a lighter and thinner complete machine can be developed. In addition, the problems, such as poor performance due to the change of the resistance value in a traditional electro-acoustic connection way, can be solved. By the adoption of the structure, the first induction coil is allowed to be provided outside the inner cavity, the shell can be sealed at a time, wiring from the outside to the inside is not needed any more. In this way, secondary sealing of a lead position is avoided, production and transportation of the speaker module are greatly simplified, and assembly between the speaker module and the terminal device is also greatly simplified.

The present invention discloses a speaker module, comprising: a speaker assembly, a module shell and a front cover. The module shell is configured to bear the speaker assembly, and comprises a first shell and a second shell, wherein the first shell is doped with a thermally conductive filler. The front cover is configured to cooperate with the module shell to encapsulate the speaker assembly. The speaker module provided by the present invention can quickly discharge heat generated by the speaker assembly during operation through the module shell to prevent overheat of the speaker assembly, thereby avoiding performance loss of a speaker due to high temperature.

A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.

The present invention provides a MEMS microphone including a substrate with a back cavity and a capacitive system disposed on the substrate. The capacitive system includes a back plate and a vibration diaphragm arranged opposite to the back plate. The back plate includes a middle part and a fixed part surrounding the middle part and fixed to the substrate. The fixed part is arranged with a thickness greater than that of the middle part, and the fixed part includes a first surface away from the substrate and a second surface opposite to the first surface. The first surface includes a first arc connected to the middle part, and the first arc protrudes away from the substrate. Compared with related technologies, the MEMS microphone provided by the present invention can improve the reliability of the back plate.